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Comparing Two Temperature Field-Solving Modules to Address the Temperature Rise Problem of the Ring Main Unit

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02:52 min

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July 5th, 2024

DOI :

10.3791/202126-v

July 5th, 2024

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1College of Mechanical and Electrical Engineering, Wenzhou University, 2Institute of Laser and Optoelectronic Intelligent Manufacturing, Wenzhou University, 3Wecome Intelligent Manufacturing Co., Ltd., 4College of Mechanical Engineering, Nanjing University of Aeronautics and Astronautics

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Temperature Field
Temperature Rise
Ring Main Unit
Ice Pack Model
Copper Polished Surface
Aluminium6061 T6
Emissivity
Multi level Meshing
Mesh Settings
Geometric Model
Surface Radiation Model
Turbulent Flow Regime
Natural Convection
Ambient Temperature
Volumetric Heat Losses
Thermal Load Generation
Ohmic Losses
Convective Temperature Value
Temperature Distribution
Steady State Thermal Model

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A Comprehensive Approach to Investigate RMU Temperature Rise Problem
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