This work was supported in part through NSFDMI-0508454, NSF/LEQSF(2006)-Pfund-53, NSF-CMMI-0811888, and NSF-CMMI-0900595 grants.

A. Schematics of the MPL
The macropunching method includes "cutting" and "drawing" operations. The "cutting" operation adopts molds of sharp-edged convex structures and includes three basic steps (Fig. 1(a1-a3)). First, place a sheet metal on a rigid substrate (Fig. 1(a1)). Second, bring a Si mold and the substrate into physical contact by a high force. During this second step, the part of the metal directly underneath convex mold structures is first cut off fro...

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No conflicts of interest declared.

Troubleshooting information: Critical points regarding generation of single- and multiple-layer micropatterns of conducting polymers and metals using the "cutting" operation: (1) Temperature of embossing ensures fluidity of the intermediate PMMA layer which generates optimum results. It is advisable to start at the lower limit of the range and increase temperature gradually if desired results are not achieved. Too high temperature may cause the conducting polymer layer to change its chemical and/...

<table border="1">
 <tbody>
 <tr>
 <td>Name of the reagent</td>
 <td>Company</td>
 <td>Catalogue number</td>
 <td>Comments</td>
 </tr>
 <tr>
 <td>PMMA </td>
 <td>Sigma-Aldrich Co.</td>
 <td>495C9</td>
 <td>The solvent is cholorobenzene. Handle PMMA solution under a fume hood with adequate ventilation. Do not breathe the vapor. Refer to MSDS for safe handling instructions.</td>
 </tr>
 <tr>
 <td>PPy </td>
 <td>Sigma-Aldrich Co.</td>
 <td>--</td>
 <td>5% by weight in water. Used as received.</td>
 </tr>
 <tr>
 <td>PEDOT-PSS</td>
 <td>H. C. Starck Co.</td>
 <td>Baytron P HC V4</td>
 <td>Proprietary solvent. Used as received.</td>
 </tr>
 <tr>
 <td>SPANI</td>
 <td>Sigma-Aldrich Co.</td>
 <td>--</td>
 <td>Water soluble form. Used as received.</td>
 </tr>
 <tr>
 <td>Hot embossing machine </td>
 <td>JenoptikMikrotechnik Co. </td>
 <td>HEX 01/LT </td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Sputter machine</td>
 <td>Cressington Co.</td>
 <td>208HR</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>FIB machine </td>
 <td>Zeiss Co.</td>
 <td>FIB Crossbeam 1540 XB </td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Spin coater</td>
 <td>Headway Reseach Co.</td>
 <td>PWM32-PS-R790 Spinner System</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>RIE machine</td>
 <td>Technics MicroRIE Co.</td>
 <td>--</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Photoresist </td>
 <td>Shipley Co. </td>
 <td>S1813</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>PDMS</td>
 <td>Dow Corning</td>
 <td>Sylgard 184 Silicone elastomer kit</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>HDPE sheet </td>
 <td>US Plastic Incorporate </td>
 <td>--</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>PMMA sheet</td>
 <td>Cyro Co.</td>
 <td>--</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Double-sided adhesive tape </td>
 <td>Scotch Co.</td>
 <td>--</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Single-sided tape</td>
 <td>Delphon Co.</td>
 <td>Ultratape # 1310</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Glass micropipettes</td>
 <td>FHC Co.</td>
 <td>30-30-1</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Clip</td>
 <td>Office Depot Co.</td>
 <td>Bulldog clip</td>
 <td>&nbsp;</td>
 </tr>
 <tr>
 <td>Humidifier</td>
 <td>Vicks Co.</td>
 <td>Filter free humidifier</td>
 <td>&nbsp;</td>
 </tr>
 </tbody>
</table>

micropunching lithography for generating micro- and submicron-patterns on polymer substrates

Conducting polymers have attracted great attention since the discovery of high conductivity in doped polyacetylene in 19771. They offer the advantages of low weight, easy tailoring of properties and a wide spectrum of applications2,3. Due to sensitivity of conducting polymers to environmental conditions (e.g., air, oxygen, moisture, high temperature and chemical solutions), lithographic techniques present significant technical challenges when working with these materials4. For example, current photolithographic methods, such as ultra-violet (UV), are unsuitable for patterning the conducting polymers due to the involvement of wet and/or dry etching processes in these methods. In addition, current micro/nanosystems mainly have a planar form5,6. One layer of structures is built on the top surfaces of another layer of fabricated features. Multiple layers of these structures are stacked together to form numerous devices on a common substrate. The sidewall surfaces of the microstructures have not been used in constructing devices. On the other hand, sidewall patterns could be used, for example, to build 3-D circuits, modify fluidic channels and direct horizontal growth of nanowires and nanotubes.
A macropunching method has been applied in the manufacturing industry to create macropatterns in a sheet metal for over a hundred years. Motivated by this approach, we have developed a micropunching lithography method (MPL) to overcome the obstacles of patterning conducting polymers and generating sidewall patterns. Like the macropunching method, the MPL also includes two operations (Fig. 1): (i) cutting; and (ii) drawing. The "cutting" operation was applied to pattern three conducting polymers4, polypyrrole (PPy), Poly(3,4-ethylenedioxythiophen)-poly(4-styrenesulphonate) (PEDOT) and polyaniline (PANI). It was also employed to create Al microstructures7. The fabricated microstructures of conducting polymers have been used as humidity8, chemical8, and glucose sensors9. Combined microstructures of Al and conducting polymers have been employed to fabricate capacitors and various heterojunctions9,10,11. The "cutting" operation was also applied to generate submicron-patterns, such as 100- and 500-nm-wide PPy lines as well as 100-nm-wide Au wires. The "drawing" operation was employed for two applications: (i) produce Au sidewall patterns on high density polyethylene (HDPE) channels which could be used for building 3D microsystems12,13,14, and (ii) fabricate polydimethylsiloxane (PDMS) micropillars on HDPE substrates to increase the contact angle of the channel15.

Watch this Scientific Journal Video about Micropunching Lithography for Generating Micro- and Submicron-patterns on Polymer Substrates at JoVE.com

Micropunching Lithography for Generating Micro- and Submicron-patterns on Polymer Substrates

A micropunching lithography approach is developed to generate micro- and submicron-patterns on top, sidewall and bottom surfaces of polymer substrates. It overcomes the obstacles of patterning conducting polymers and generating sidewall patterns. This method allows rapid fabrication of multiple features and is free of aggressive chemistry.

Conducting polymers have attracted great attention since the discovery of high conductivity in doped polyacetylene in 19771. They offer the advantages of ...

micropunching-lithography-for-generating-micro-submicron-patterns-on

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15.0K Görüntüleme.  University of Texas at Arlington. Bir micropunching litografi bir yaklaşım oluşturmak için mikro ve Mikronaltı-desen üst, yanak ve polimer yüzeylerde alt yüzeylerinde geliştirilmiştir. Bu desenlendirme iletken polimerlerin ve yanak modelleri üretme engellerin üstesinden gelir. Bu yöntem birden fazla özelliklerin hızlı üretimi sağlayan ve agresif kimya ücretsizdir.