Name: compact lens-less digital holographic microscope for mems inspection and characterization
Uploaded: 2016-07-05T15:00:00
Description: Watch this Scientific Journal Video about Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization at JoVE.com

The authors have no acknowledgements.

측정 1. 사전 준비 주 : 실험에 사용 된 시료는 MEMS 전극이다. 금 전극은 리프트 오프 공정을 이용하여 실리콘 웨이퍼 상에 제조된다. 샘플은 1mm 기간과주기적인 구조 (전극)를 가진 18mm X 18mm 웨이퍼이다 <ol><li> 시스템을 사용하기 전에 로그 북에 로그인합니다. </li><li> 컴퓨터, 레이저 및 번역 단계 전원을 켭니다. </li><li> 멤스 전극 / 마이크로 다이어프램 샘플을 놓습니다. <ol><li> 집게를 사용...

<ol>
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본 검토에서는 정확하게 디지털 홀로그래피에 의존 컴팩트 한 시스템을 사용하여 다른 MEMS 디바이스의 형태를 정량적으로 회수 할 수있는 프로토콜을 제공한다. 정적 및 동적 두 모드에서 MEMS 특성이 설명된다. 마이크로 채널 MEMS 정량 3D 데이터가 얻어진다. 시스템의 정확성을 검증하기 위해, 결과 CDHM 및 AFM을 비교 하​​였다. 좋은 계약은 디지털 홀로그래피는 3D 영상에 대한 신뢰할 수있는 기?...

마이크로 및 나노 물체의 계측 업계와 연구자 모두에게 매우 중요하다. 사실, 개체의 소형화는 광학 계측을위한 새로운 도전을 나타냅니다. 일반적으로 정의 된 마이크로 전자 기계 시스템 (MEMS)은 전자 기계 시스템을 소형화 일반적으로 마이크로 센서, 마이크로 액츄에이터, 마이크로 전자 및 마이크로와 같은 구성 요소를 포함하고있다. 여기에는 생명 공학, 의학, 통신, 1 감지 등 다양한 분야에서 많은 응용 프로그램을 발견했다. 최근, 증가하는 복잡성뿐만 아니라 테스트 객체의 미세화에 적합한 특성 MEMS 기술의 발달에 대한 호출을 특징으로한다. 이러한 복잡한 마이크로 시스템의 고 스루풋 특성은 제조 변수와 공정 조건 (2)에 의한 관련 결함을 정량화 고급 인라인 측정 기술의 구현을 필요로한다. 기하학적 PARAM의 예를 들면, 편차멤스 장치 eters는 시스템 특성에 영향을 미치는 특징되어야한다. 또한, 업계는 전체 세 가지 차원 (3D) 계측,보기, 높은 영상 해상도의 대형 과학 ELD, 실시간 분석과 같은 높은 해상도의 측정 성능을 필요로한다. 따라서, 품질 관리 검사 공정 신뢰성을 보장하기 위해 필수적이다. 또한, 기존의 인프라 스트럭처에 설치 될 생산 라인에서 용이하게 구현 가능하고, 따라서 상대적으로 컴팩트하게 측정 시스템을 필요로한다. 제 가버 (3)에 의해 도입 된 홀로그램은, 기준 및 감광 매체의 물체 웨이브 사이의 간섭을 기록하여 객체의 전체 정량적 정보의 복구를 허용하는 기술이다. 기록으로 알려진이 과정에서, 필드의 진폭, 위상 및 편광은 상기 매체에 저장된다. 다음 객체 파 필드는 저에 참조광을 전송하여 회수 할 수있다dium, 홀로그램의 광학적 판독 알려진 방법. 종래의 검출기 만 전파의 강도를 기록하기 때문에, 홀로그램은 전계에 대한 추가 정보에 액세스 할 수 있기 때문에 지난 50 년 동안 많은 관심의 대상이되어왔다. 그러나, 종래의 홀로그래피의 여러 측면은 산업 애플리케이션에 비실합니다. 실제로, 감광성 재료는 고가이며, 기록 공정은 일반적으로 고도의 안정성을 요구한다. 이러한 충전 결합 소자 (CCD)와 같은 고해상도 카메라 센서의 발전은 디지털 계측에 대한 새로운 접근 방식을 열었습니다. 이러한 기술 중 하나는 디지털 홀로그래피 (4)로서 알려져있다. 디지털 홀로그래피 (DH)에있어서, 홀로그램 카메라 (기록 매체)에 기록하는 수치 프로세스는 위상 및 세기 정보를 재구성하는데 사용된다. 인터넷에 도시 된 바와 같이 기록 재 : 종래 홀로그래피와 같이, 그 결과는 두 가지 절차 후에 얻을 수있다녹음이 기존의 홀로그래피 유사한 경우 gure 1. 그러나, 재건은 5 만 숫자입니다. 수치 재구성 처리는도 2에 도시되어있다. 두 방법은 재구성 프로세스에 참여한다. 우선, 오브젝트 파 필드 홀로그램로부터 검색된다. 홀로그램은 홀로그램면에있는 객체의 파면을 얻을 수있는 수치 기준 파형과 곱합니다. 둘째, 복잡한 객체 파면 수치 화상면에 전파된다. 우리의 시스템에서,이 단계는 회선 방법 6을 이용하여 수행된다. 얻어진 재구성 필드는 복소 함수 따라서 위상 및 강도가 관심의 대상에 정량적 높이 정보를 제공하는 추출 할 수있다. 홀로그래피 방식에서 전체 파이 ELD 정보 기억 능력 및 빠른 데이터 처리를위한 컴퓨터 기술의 사용은 실험 구성의 유연성을 제공하며, 상당히 속도 시간을 증대새로운 가능성을 열어 실험 과정의 d를, MEMS 및 마이크로 시스템 7, 8에 대한 동적 계량 도구로 DH를 개발. 위상차 영상 디지털 홀로그래피의 사용은 지금 잘 설립하고 첫 번째 10 년 이상 전 9 제시했다. 실제로 디지털 홀로그래피와 현미경을 조합하여 미세 소자의 조사 많은 연구 10, 11, 12, 13에서 수행되었다.이 높은 코 히어 런스 (14) 및 저 간섭 15 소스에 기초하여 여러 시스템뿐만 아니라 구조 (13) (16)의 다른 유형 17 (줄, 축, 일반적인 경로 떨어져 ...) 제시되었다. 또한, 라인 디지털 홀로그래피는 MEMS 디바이스 (18, 19)의 특성화 이전에 사용되어왔다. 그러나, 이러한 시스템은 일반적으로 구현이 어렵고 부피가 산업용 애플리케이션에 적합하지 않다. 본 연구에서는 오프 AXI 기반으로하는 무료, 컴팩트 간단하고 렌즈 시스템을 제안한다실시간 MEMS 검사 및 특성에 대한 디지털 홀로그래피는 할 수에요. 컴팩트 디지털 홀로그램 현미경 (CDHM)는 렌즈 적은 디지털 홀로그래피 시스템 개발 및 마이크로 크기의 반사 물체의 3 차원 형태를 얻기 위해 특허이다. 우리의 시스템, 10 mW의에서는 매우 안정 638 nm에서 동작하는 온도 제어 다이오드 레이저는 단일 모드 광섬유로 연결된다. 도 3에 도시 된 바와 같이, 광섬유에서 발산하는 발산 빔은 빔 스플리터에 의해 기준 및 오브젝트 빔으로 분할된다. 참조광 경로는 오프 축 형상을 실현하는 경사 거울을 포함한다. 대상 빔이 산란되어 시료에 의해 반사된다. 두 빔이 홀로그램을 CCD에주는 간섭. 이미지 상에 인쇄 된 간섭 줄무늬는 공간 캐리어 불리는 단 하나의 이미지와 정량적 위상 정보의 복구를 허용한다. 수치 재구성 공통 푸리에 변환 및 역 같은 컨벌루션 알고리즘을 사용하여 수행이전 테드. 렌즈가없는 구성은 매력적 여러 가지 장점을 갖는다. 어떤 렌즈를 사용하지 않는 바와 같이, 입력 빔이 발산 파 자연 기하학적 인 배율을 제공함으로써, 시스템의 해상도를 향상시키는 것이다. 또한, 일반적인 광학계에서 발생하는 수차의 자유이다. 도 3b에서 알 수있는 바와 같이, 시스템은 컴팩트 (55x75x125 mm 3), 경량 (400g)을 만들 수 있고, 따라서 용이하게 공업 생산 라인에 통합 될 수있다.

<table border="0" cellpadding="0" cellspacing="0" width="1228">
	<tbody>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">2 MP Camera</td>
			<td style="width:251px;">Imaging Source</td>
			<td style="width:251px;">DMX 41BU02</td>
			<td style="width:512px;">used to record the hologram. 4.65 microns pixel size</td>
		</tr>
		<tr height="42">
			<td height="42" style="height:42px;width:216px;">Motorized X,Y,Z Translation Stage</td>
			<td style="width:251px;">Zaber Technology&#160;</td>
			<td style="width:251px;">TLS28-M</td>
			<td>Holder for the system&#160;</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Beam splitter</td>
			<td style="width:251px;">Edmund optics</td>
			<td style="width:251px;">49-003</td>
			<td>Cube Beam splitter. Separate and recombine the object and reference beam</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Laser&#160;</td>
			<td style="width:251px;">Micro Laser Systems, Inc.</td>
			<td>SRT-F635S-20/OSYS</td>
			<td>Diode laser</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Mirror</td>
			<td style="width:251px;">Edmund Optics</td>
			<td style="width:251px;">#43-412-566</td>
			<td>1&#34; Dia. Protected Gold, &#955;/20 Flat Zerodur</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">monomode Fiber</td>
			<td style="width:251px;">Thorlabs</td>
			<td style="width:251px;">S405-XP</td>
			<td style="width:512px;">Single Mode Optical Fiber, 400 - 680 nm, &#216;125 &#181;m Cladding</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Sample holder</td>
			<td style="width:251px;">Edmund Optics</td>
			<td style="width:251px;">#39-930</td>
			<td>Ideal Positioning Platform,&#177;35mm Travel in Both X and Y</td>
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			<td height="21" style="height:21px;width:216px;">Hotplate</td>
			<td style="width:251px;">Thermolyne Mirak hotplate</td>
			<td style="width:251px;">Barnstead International HP72935-60</td>
			<td>temperature range&#160;&#160; 40-370 &#176;C</td>
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			<td height="21" style="height:21px;width:216px;">Holoscope Software</td>
			<td style="width:251px;">d&#39;Optron Pte Ltd</td>
			<td style="width:251px;">NA</td>
			<td>software developed by the NTU researchers&#160;</td>
		</tr>
	</tbody>
</table>

compact lens-less digital holographic microscope for mems inspection and characterization

A micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and automotive. However, effective inspection and characterization metrology systems are needed to ensure the functional reliability of MEMS. This study presents a system based on digital holography as a tool for MEMS metrology. Digital holography has gained increasing attention in the past 20 years. With the fast development and decreasing cost of sensor arrays, resolution of such systems has increased broadening potential applications. Thus, it has attracted attention from both research and industry sides as a potential reliable tool for industrial metrology. Indeed, by recording the interference pattern between an object beam (which contains sample height information) and a reference beam on a CCD camera, one can retrieve the quantitative phase information of an object. However, most of digital holographic systems are bulky and thus not easy to implement on industry production lines. The novelty of the system presented is that it is lens-less and thus very compact. In this study, it is shown that the Compact Digital Holographic Microscope (CDHM) can be used to evaluate several characteristics typically consider as criteria in MEMS inspections. The surface profiles of MEMS in both static and dynamic conditions are presented. Comparison with AFM is investigated to validate the accuracy of the CDHM.

상기 프로토콜은 검사하고 CDHM 시스템을 사용하는 MEMS 및 마이크로 소자의 특성을 설계 하였다. 우리의 시스템에서, 단일 모드 광섬유는 633 nm 파장에서 작동하는 다이오드 레이저에 결합된다. 인해 발산 빔 구성, 재구성 될 수있는 홀로그램을 얻기 위해 대상 빔 및 기준 빔 경로와 일치하는 것이 중요하다. 이는 시스템에 대해 샘플을 조심 수직 위치를 통해 달성된다. 계산...

Watch this Scientific Journal Video about Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization at JoVE.com

Compact Lens-less Digital Holographic Microscope for MEMS Inspection and Characterization

우리는 MEMS 장치의 검사 및 특성화를위한 소형 반사 디지털 홀로 그래픽 시스템 (CDHM)을 제시한다. 자연의 기하학적 배율을​​ 제공 발산 입력 파를 사용하는 렌즈없는 디자인이 설명된다. 모두 정적 및 동적 연구가되게됩니다.

MEMS 검사 및 특성화를위한 소형 렌즈가없는 디지털 홀로그램 현미경

A micro-electro-mechanical-system (MEMS) is a widely used component in many industries, including energy, biotechnology, medical, communications, and ...

The overall goal of this procedure is to test micro-electro-mechanical structures to be used in static and dynamic applications using optical full-field measurements with computational and experimental techniques. This method can help answer key questions in the semiconductor industry and more specifically for micro-electro-mechanical system inspection such as the characterization of the mechanical properties of MEMS structures at different stages of manufacturing. The main advantage of this technique is that it is full-field, non-contact, real-time, high-resolution, and it provides a fully quantitative 3D map of the reflective object.The system have been made with no lens and, hence, is really compact. So this method can provide insight into MEMS characterization. It can also be used for wafer inspection or optics reference testing.If set up in a transparent geometry, it is also possible to inspect micro-optics, diffractive optics, or even used for bioimaging. This procedure uses a compact digital holographic microscope, or CDHM, to characterize a micro-electro-mechanical system or MEMS device. For this demonstration, an 11 square millimeter silicon wafer with square gold electrodes positioned every 0.25 millimeters will be characterized.Using tweezers, place the MEMS sample on the sample holder. Adjust the sample holder so that the laser beam targets the electrodes. The largest possible field of view is limited by the camera sensor, and in this case, is 2.3 by 1.8 millimeters.Vertically position the system about 1.5 centimeters from the sample, and proceed with setting up the 3D View software. This package was developed in C+Begin with clicking on the green box icon to select the video imaging device. Choose the DMx 41BU02 imaging source camera in the drop-down menu.Next, under the Device Settings, Select the Y800 Video Format option, and set the capture rate to 15 Frames Per Second. Press OK, and start the camera using the yellow play button. A live video image of the sample should appear.The displayed image should be a defocus image of the sample. Adjust the exposure time and contrast of the image if needed. Now, center the sample as best as possible and access the Settings options.There, set the System Type to Reflection or Transmission. Check that the wavelength of the laser is set to 633 nm, The Pixel size of the camera to 4, 650 nm, and the magnification is times two. Next, select the Convolution Reconstruction algorithm, and set the Reconstruction Distance to 100 mm and the Reconstruction Step to one.The reconstruction distance can be adjusted later to adjust the intensity image to a sharp focus, while the Step parameter indicates how many times the convolution operation is performed to simulate the beam propagation. This parameter can be changed to fine-tune the reconstruction distance in the intensity image. Lastly, under the Post Processing options, set the Unwrapping algorithm to the Quality mapped option.Make sure that the Intensity filter and the Phase filter options are set to None. Then, press OK.Begin with accessing the 3D View software and opening the Fourier spectrum window. If one zero order and two plus one minus one order spectrums do not appear, check that the sample is placed below the red laser beam.The laser reflection can easily be seen from the sample. Now, stop the live measurement mode and select one of the diffracted orders using the filter tool. Select an area large enough to encompass all the frequencies needed for the phase retrieval.Select the SET option to apply the filter. Then, restart the live measurement mode. With the selection made, and imaging live, open the Phase window and make sure that the unwrapped mode is not enabled.Next, adjust the vertical stage to reduce the number of fringes in the phase image so only one or two fringes remain. Let the system adjust after each stage movement. To find the best reconstruction distance, use the auto-focus option.Several refocus steps may be needed to get to the optimal reconstruction distance. Ultimately, the image should become sharp and clear. Fine focus adjustments can be made using the focus slider bar if the auto-focus is not providing the best result.For very fine focus adjustments, the Reconstruction Step can be changed in the settings. With the image prepared, enable the unwrapped mode to see the unwrapped phase image. In the 3D View software, open the 3D image window to see the final image of sample, and use the available image adjustments to observe the result.On the unwrapped phase image, select the ruler icon and draw a line on the area of interest to get a cross-sectional plot in the line plot window. Now, in the line plot window, use the two green line markers to get an approximate height of the object. To arrange the windows for simultaneous viewing, select the Tile Windows option.Surface roughness can also be calculated on the flat part of the sample using MATLAB software. Save the final phase image as a bitmap for further viewing in other software. To prepare the sample for dynamic analysis, position it on the sample stage for analysis.In this case, the sample is a micro diaphragm. Connect the sample electrodes to the crocodile clips of the generator. Following the described procedures, record a hologram of the micro diaphragm at the ambient temperature for reference.Click on the Delta icon to remove the initial phase, and thus only observe deformation. Then, turn on the DC generator and gradually increase the voltage from zero to 12 volts, taking phase map images at every 1 volt increment. Later, using a simple MATLAB code, plot the different phase map deformations into one graph to better observe the total deformation, and characterize the MEMS deformation to electrical loading.A CDHM system was used to characterize a MEMS device as described, using a monomode fiber coupled to a diode laser operating at a 633 nanometer wavelength. The object beam and reference beam path were matched to obtain a hologram image of the MEMS device. The yellow line represents the cross-section location on the sample, and the two green marker lines were used to estimate the sample height.To validate the results of the digital holographic system, an atomic force microscope was used to measure the same structure. A height difference of 2.1 nanometers was found between the atomic force microscope measurement and the CDHM measurement. A MEMS electrode made using a lift-off process is subject to sample morphology variance that needs quantification.Using the described protocol, a def map was made for this purpose. A plot in the other dimension shows that surface roughness of the electrode is also observable using the system. In a dynamic system, with the temperature rising from 50 to 300 degrees Celsius, morphological changes were measured in a micro diaphragm fabricated by bonding a thin-plate onto an SOI wafer sample.This thermal deformation was then summarized in a line plot showing a cross-sectional view of the different deformation states. After watching this video you should have a clear understanding of how to set up the system and carry out morphological studies related to reflective samples such as 3D profile, deformation maps, and surface roughness. Once trained, anyone can use the software and the system so that it can be easily implemented on production chains and operated by technicians.While attempting this procedure, it's important to remember to place the sample at the right distance from the system. This is an important step. And it has a real impact on the final results.After it's development, this technique b-v for researchers in the field of optical and electrical engineering to categorize the behavior of MEMS samples for static and dynamic conditions. Following this procedure, other experiments like observation of resonant mode while your playing high-frequency alternative current or quantifying cantilever deflection can be performed in order to provide a calibration of a packed column MEMS device.

Research

JoVE Journal

Engineering

Compact Quantum Dots for Single-molecule Imaging

단일 분자 이미징을위한 소형 양자 점

Single-molecule imaging is an important tool for  understanding the mechanisms of biomolecular function and for visualizing the  spatial and temporal ...

연구

공학

Construction of a High Resolution Microscope with Conventional and Holographic Optical Trapping Capabilities

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Real-Time DC-dynamic Biasing Method for Switching Time Improvement in Severely Underdamped Fringing-field Electrostatic MEMS Actuators

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Single Plane Illumination Module and Micro-capillary Approach for a Wide-field Microscope

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Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope

Extended defects such as dislocations and grain boundaries have a strong influence on the performance of microelectronic devices and on other applications ...

Fabrication of 3D Carbon Microelectromechanical Systems (C-MEMS)

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

3D 탄소 미세 전자 기계 시스템 (C-MEMS) 제작

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The use of super-resolution imaging to overcome the diffraction limit of conventional microscopy has attracted the interest of researchers in biology and ...

Design and Characterization Methodology for Efficient Wide Range Tunable MEMS Filters

설계 및 효율적인 넓은 범위 가변 MEMS 필터 특성 방법론

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Intermediate Strain Rate Material Characterization with Digital Image Correlation

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Implementation of a Nonlinear Microscope Based on Stimulated Raman Scattering

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