Silicon Wafer Cleaning and Phosphorus Diffusion into the Silicon Substrate
3:08
SiNx Coating by Plasma-Enhanced Chemical Vapor Deposition (PECVD), GaP Growth by Molecular Beam Epitaxy (MBE), and Wet Etching of Back n+ and SiNx Layers
6:01
Hole-Selective Contact Formation on the Bare Si Side and External Contact Formation on the GaP Side
8:17
Results: Characterization of the GaP/Si Heterojunction Devices