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3.7K Views
•
09:18 min
February 8th, 2022
DOI :
10.3791/61040-v
Chapters
0:05
Introduction
1:19
Mac-imprint Stamp Preparation
2:43
Photoresist Ultraviolet (UV) Nanoimprinting
4:05
Gold and Silver/Gold Catalyst Thin Film Deposition
5:17
Silver/Gold Catalyst Thin Film Dealloying
6:01
Mac-imprint Operation
7:33
Results: Representative Au Porous Stamp and Si Mac-imprint Imaging
8:31
Conclusion
Transcript
我们的协议为硅提供了一种新的图案化方法,可以创建三维分层微观结构,从而能够设计基于超表面的微光学元件和波导技术。该协议允许在一个步骤中将3D结构从聚合物和硬质模具复制到单晶和多孔硅晶片中。同时,在所有三个方向上提供低于100纳米的分辨率。
多孔硅和硅本身是制造光学生物传感器和红外光学器件的优质材料。然而,我们预计这种技术将扩展到III-V类半导体甚至更远。冲压到基板的尖端和倾斜对齐对于均匀的Mac印记非常重要。
按照该协议,可以通过在与基板接触时将印章安装到支架上进
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Summary
提出了一种金属辅助化学印迹的方案,将形状精度低于20 nm的3D微尺度特征印制到固体和多孔硅晶圆中。
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