evaluation-curing-adhesive-systems-rheological-thermal

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

The analysis of thermal processes associated to the curing of adhesives and the study of mechanical behavior once cured, provide key information to choose ...

Universidade da Coruña

This work shows an effective methodology to characterize the creep-recovery behavior of silicones before their application in podiatry. The aim is to characterize, model and compare the creep-recovery properties of different types of silicone used in podiatry orthotics.

Creep analysis of silicone for podiatry applications.

This work shows an effective methodology to evaluate the dynamic viscoelastic behavior of silicones for application in podiatry. The aim is to characterize, compare their viscoelastic properties according to the dynamic stresses they can be presumably subjected when used in podiatry orthotic applications. These results provide a deeper insight which extends the previous creep-recovery results to the world of dynamic stresses developed in physical activity. In this context, it shoulod be taken into account that an orthoses can subjected to a set of static and dynamic shear and compressive forces.

Ramon Artiaga

Escola Politécnica Superior

Universidade da Coruña

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Ramon Artiaga

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Universidade da Coruña

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing

Escola Politécnica Superior