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DOI :
10.3791/3725-v
July 2nd, 2012
Chapters
0:05
Title
1:05
Cutting Operation in MPL: Overview and Initial Steps
1:57
Cutting Operation in MPL: Single-layer Microstructures on a Substrate
2:36
Cutting Operation in MPL: Multi-layer Microstructures on a Substrate
4:44
Drawing Operation in MPL: Making PDMS Micropillars on HDPE Channel Sidewalls
6:25
Microstructures Formed by Cutting and Drawing, and Their Application
9:00
Conclusion
micropunchingリソグラフィのアプローチは、上、側壁およびポリマー基板の底面にマイクロおよびサブミクロンのパターンを生成するために開発されています。それはパターニングが導電性ポリマー及び側壁パターンを生成する障害を克服しています。このメソッドは、複数の機能の迅速な製造を可能にし、積極的な化学の自由です。
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