Name: micro-masonry for 3d additive micromanufacturing
Uploaded: 2014-08-01T15:00:00
Description: Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

This work was supported by the NSF (CMMI-1351370).

1，设计面膜供体基板的制作<ol><li>设计具有所需几何形状的面具。为了制作100微米×100微米见方的硅个别单位，画出100微米×100微米的正方形阵列。 </li><li>设计第二掩模具有相同的几何形状，与各侧延伸出额外的15微米。为100微米×100微米的正方形阵列，绘制的130微米×130微米的正方形可以覆盖的平方在步骤1.1的阵列。 </li><li>设计锚几何。得出4个20微米×40微米的矩形，每个沿着正方形的一边为中...

<ol>
	<li>Stix, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Toward+&#8220;Point+one.">Toward &#8220;Point one.</a> Sci Am. Feb. , 90-95 (1995).</li><li>Appenzeler, T. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=The+Man+Who+Dared+to+Think+Small.">The Man Who Dared to Think Small.</a> Science. 254, 1300-1301 (1991).</li><li>Madou, M. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fundamentals+of+Microfabrications+The+Science+of+Miniaturization.">Fundamentals of Microfabrications The Science of Miniaturization.</a> , (2002).</li><li>Xia, Y., Whitesides, G. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Soft+Lithography.">Soft Lithography.</a> Angew Chem Int Ed. 38, 551-575 (1998).</li><li>Judy, J. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Microelectromechanical+systems+(MEMS)+fabrication,+design+and+applications.">Microelectromechanical systems (MEMS) fabrication, design and applications.</a> Smart Mater Struct. 10, 1134-1154 (2001).</li><li>Jain, V. K. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=.">.</a> Micromanufacturing Process. , (2012).</li><li>Keum, H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+micro-masonry+using+elastomeric+stamps+for+three-dimensional+microfabrication.">Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication.</a> J Micromech Microeng. 22, 55018 (2012).</li><li>Keum, H., Chung, H., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrical+Contact+at+The+Interface+between+Silicon+and+Transfer-Printed+Gold+Films+by+Eutectic+Joining.">Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining.</a> ACS Appl Mater Interfaces. 5, 6061 (2013).</li><li>Keum, H., Seong, M., Sinha, S., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrostatically+Driven+Collapsible+Au+Thin+Films+Assembled+Using+Transfer+Printing+for+Thermal+Switching.">Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching.</a> Appl Phys Lett. 100, 211904 (2012).</li><li>Klaassen, E. H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+and+deep+reactive+ion+etching:+a+new+technology+for+microstructures.">Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures.</a> Sens Actuators A. 52, 132-139 (1996).</li><li>Barth, P. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+for+fabrication+of+sensors+actuators+and+microstructures.">Silicon fusion bonding for fabrication of sensors actuators and microstructures.</a> Sens Actuators. A21 - A23, 919-926 (1990).</li></ol>

微砖石，在图4中提出的，涉及硅熔融键合在一材料粘接工序。硅熔融键合是通过将样品中的快速热退火炉（RTA炉）和样品加热至950℃保持10分钟来实现。这种退火条件是双方可采用习之-硅和硅- 二氧化硅结合10,11。可替代地，结合有硅条如在图5C中发现的凹采用共晶键合，因此，该粘合温度是大约在Si-Au共晶体的温度（363℃）30分钟8。以确保共晶键...

微机电系统（MEMS），如大型普通三维机器的小型化，是必不可少的通过提供增强性能和降低制造成本的1,2推进现代技术。但是，不能维持在MEMS技术进步的现行税率不连续创新的制造技术3-6。常见的单片微加工主要依赖层 - 层过程的集成电路（IC）的制造开发。这种方法已经在使批量生产高性能的MEMS器件相当成功的。但是，由于其复杂的层 - 层和电化学性质减色，制造多样形状的3D MEMS结构和设备，同时便于在宏观世界，是非常具有挑战性的，以实现使用这种单片微加工。为了让更多的灵活的三维微细加工用量少过程的复杂性，我们德韦大步三维添加剂micromanufacturing策略（称为“微/纳米砖石&#39;），它涉及的微/纳米材料的转移印花为基础的组装与快速热退火功能材料粘接技术相结合。 转印是一种方法，从那里它们被使用的弹性体邮票控制干附着力产生或生长到不同衬底上的衬底转移固体微尺度材料（ 即，“固体墨”）。微砌体的典型过程开始转移印花。预制的固体油墨转印用微针戳即弹性邮票的一种高级形式，并在印刷结构被采用快速热退火（RTA），以提高油墨的油墨和油墨 - 基底粘附随后退火打印。该制造方法能够使异常微尺度结构和设备不能使用其他现有METHO收容的结构DS 7。 微砖石提供了不存在在其他方法中的一些吸引人的特点：（一）整合异种材料的功能和结构的固体油墨组装MEMS传感器的能力和执行器的三维结构中都集成; （二）组装的固体油墨的接口都可以充当电及热接触9,10; （三）装配空间分辨率可高（〜1微米）通过利用高度可扩展和易于理解的平版印刷工艺产生的固体油墨和高精密的 ​​机械阶段的转移印花7;及（d）的功能和结构的固体油墨可集成在刚性和柔性基板中的平面或曲线的几何形状。

<table border="0" cellpadding="0" cellspacing="0" width="758">
	<tbody>
		<tr height="20">
			<td height="20" style="height:20px;width:217px;">Name of Material / Equipment</td>
			<td style="width:97px;">Company</td>
			<td style="width:97px;"></td>
			<td style="width:347px;">Comments / Description</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Az 5214</td>
			<td>Clariant</td>
			<td></td>
			<td>1.5 mm thick photoresist</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Su8-100</td>
			<td>Microchem</td>
			<td></td>
			<td>100 mm Photoresist used in mold</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Sylgard 184</td>
			<td>Dow Corning</td>
			<td></td>
			<td>PDMS mixed to fabricate stamp</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Hydrofluoric Acid</td>
			<td>Honeywell</td>
			<td></td>
			<td>Acid to etch silicon oxide layer</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Silicon on insulator</td>
			<td>Ultrasil</td>
			<td></td>
			<td>Donor substrate was fabricated</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">trichlorosilane</td>
			<td>Sigma-Aldrich</td>
			<td></td>
			<td>Chemical used to help pealing of PDMS from mold</td>
		</tr>
	</tbody>
</table>

micro-masonry for 3d additive micromanufacturing

转印是一种方法来从在那里它们被通过利用弹性体邮票产生一个不同的衬底上的衬底转移固体微/纳米级材料（在本文中被称为“油墨”）。转移印花使异质材料的集成制造被发现在最近的先进设备，如灵活和可拉伸的太阳能电池和LED阵列，无可比拟的结构或功能系统。而转移印花表现出料组件能力的独特功能，利用粘接剂层或表面改性，例如自组装单层（SAM）在基板上用于增强印刷工艺沉积阻碍了其广泛适应于微组装微机电系统（MEMS）结构和设备。为了克服这一缺点，我们开发了转移印花的先进模式，确定性仅仅通过控制表面的接触面积组装个人微尺度物体没有任何表面变化。由于没有粘接剂层或其它修饰和随后的材料键合过程中确保不仅机械结合，但组装材料之间还热和电的连接，从而进一步打开以适应不同的应用在构建寻常的MEMS器件。

微砌体使异质材料结合产生的MEMS结构，是非常具有挑战性的或不可能实现的单片微加工工艺。为了说明其功能，结构（称为“微茶壶&#39;）被制成仅通过微砌筑。 图4A是在一个施主衬底制造硅油墨的光学显微镜图像。所设计的墨是光盘与由单结晶硅的尺寸不同，它们是微茶壶的积木。一旦施主衬底被独立地准备，光盘是转移印刷到一个接收基板和层采用微尖戳， 如图4B退...

Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

Micro-masonry for 3D Additive Micromanufacturing

微砌筑的3D添加剂Micromanufacturing

本文介绍了一种3D添加剂micromanufacturing策略（称为“微砌体&#39;）的微机电系统（MEMS）的结构和设备的柔性制造。这种方法涉及与快速热退火功能材料粘接技术相结合转移印花为主的微/纳米材料组装。

Transfer printing is a method to transfer solid micro/nanoscale materials (herein called &#8216;inks&#8217;) from a substrate where they are generated to ...

Research

JoVE Journal

Engineering

High-resolution, High-speed, Three-dimensional Video Imaging with Digital Fringe Projection Techniques

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses ...

科研

工程学

Scalable Nanohelices for Predictive Studies and Enhanced 3D Visualization

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing ...

Novel 3D/VR Interactive Environment for MD Simulations, Visualization and Analysis

新颖的3D / VR互动环境MD模拟，可视化和分析

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials ...

Energy Dispersive X-ray Tomography for 3D Elemental Mapping of Individual Nanoparticles

能量色散X射线断层摄影术对个人纳米3D元素映射

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial ...

Methods for Measuring the Orientation and Rotation Rate of 3D-printed Particles in Turbulence

测量的方向和旋转速率方法3D打印在湍流颗粒

Experimental methods are presented for measuring the rotational and translational motion of anisotropic particles in turbulent fluid flows. 3D printing ...

3D Printing of Biomolecular Models for Research and Pedagogy

生物分子模型的3D打印技术的研究与教学

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D ...

A 3D-printed Chamber for Organic Optoelectronic Device Degradation Testing

用于有机光电器件降解测试的3维印制腔

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, ...

A Soft Tooling Process Chain for Injection Molding of a 3D Component with Micro Pillars

微柱3D 构件注塑成型的软加工工艺链

The purpose of this paper is to present the method of a soft tooling process chain employing Additive Manufacturing (AM) for fabrication of injection ...

Multi-material Ceramic-Based Components &#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

Multi-material Ceramic-Based Components ÃƒÆ’Ã‚Â¢ÃƒÂ¢Ã¢â‚¬Å¡Ã‚Â¬ÃƒÂ¢Ã¢â€šÂ¬Ã…â€œ Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing CerAM - T3DP

多材料陶瓷基元器件--用热塑性3d 印刷 (ceram-t3dp) 制备黑白氧化锆部件的添加剂

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three ...