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DOI :
10.3791/52572-v
April 15th, 2015
Chapters
0:05
Title
1:18
PDMS Chip Preparations
2:49
Petri Dish and Cover Slip Preparation
4:50
Preparing the Multi-Electrode Array
7:19
Plating the Cells
8:17
In vitro Neural Network Formation and Analysis
10:04
Conclusion
这手稿描述了一个协议, 在体外模块化网络包括空间上的限制,在功能上相互连接的神经回路的增长。的聚合物掩模被用来图案的蛋白质层,以促进通过培养基底细胞粘附。镀神经元生长在涂层区域自发建立连接并显示出电活性。
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