Name: laser-induced forward transfer for flip-chip packaging of single dies
Uploaded: 2015-03-20T14:00:00
Description: Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

This work was carried out in the framework of the project &#8220;MIRAGE,&#8221; funded by the European Commission within the FP7 program.

1. LIFT辅助倒装芯片粘接注意：有参与实现升降辅助倒装芯片组件中，即微凸点利用提技术的基板，使用热压倒装芯片接合方法将所述光电芯片的凸点基板三个阶段，并最后封装保税组件。每一个阶段将在以下部分中讨论： <ol><li>使用LIFT微碰撞： <ol><li>为供体的制备，沉积的施主材料的薄膜上的激光透明载体衬底。对于本实验，蒸发铟金属的200nm厚的薄膜上的尺寸为玻璃载?...

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在本文中，我们已经证明了使用称为LIFT激光的直接写入技术单个VCSEL芯片热压倒装接合。所涉及的微凸点铟的印刷到利用提技术在基片接触焊点的组件的制造步骤。其次的VCSEL芯片热压倒装接合到撞底物和最终的封装。 电梯辅助接合芯片的电学，光学和机械可靠性是通过测量它们的LIV曲线和执行标准8585老化试验来评价。光学特性，机械稳定性所获得的成功，和耐用性明显突?...

激光诱导的正向转移（LIFT）是用于单步模式定义及与微米和亚微米分辨率材料转移一个多功能直写添加剂的制造方法。在本文中，我们报告一个芯片级利用LIFT作为凸点技术的垂直腔表面发射激光器（VCSEL）倒装芯片封装。倒装芯片在系统封装和集成的电子和光电（OE）组件的关键技术。为了实现致密的集成组件的精细间距焊接是必不可少的。虽然细间距粘接已经证明通过一些标准技术，但有在组合在一起的其他重要特性，如柔软性，成本效益，速度，精度和低加工温度方面的空隙。为了满足这些要求，我们证明LIFT辅助热压粘合方法，OE组件的精细间距焊接。 以LIFT，要被打印的材料（称为供体 ）的薄膜沉积到一个表面上的激光的透明支撑基板（简称为载体 ）的， 图1示出了这种技术的基本原理。足够的强度的入射激光脉冲然后聚焦在载波施主接口，提供转发来自照射区中的供体像素转移到另一衬底上所需地放于靠近所述推进力（称为接收器 ）。 LIFT最早在1986报道Bohandy作为一种技术来打印微米大小的铜线用于修复受损的光掩模3。因为它的第一示范这一技术已获得显著兴趣作为微纳米制造技术的受控图案化和打印的各种材料，如陶瓷4，碳纳米管5，量子点6，活细胞7，图烯8，对于不同的应用，例如生物传感器9中，有机发光二极管10，光电元件11，电浆传感器12，有机电子器件13和倒装芯片键合14,15。 升降机相比具有若干优点，例如简单性，速度，灵活性，成本效益，高分辨率和准确性的OE组件的倒装芯片封装的现有倒装芯片凸点和粘结技术。

<table border="0" cellpadding="0" cellspacing="0" width="663">
	<tbody>
		<tr height="42">
			<td height="42" style="height:42px;width:216px;">Name of Material/ Equipment</td>
			<td style="width:161px;">Company</td>
			<td style="width:119px;">Catalog Number</td>
			<td style="width:167px;">Comments/Description</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Laser source</td>
			<td style="width:161px;">3D MicroMac (3DMM)</td>
			<td style="width:119px;">2912-295</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Photodetector</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">818 series</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Source measurement unit</td>
			<td style="width:161px;">Keithley&#160;</td>
			<td style="width:119px;">2401</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Power meter</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">1930</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Underfill</td>
			<td style="width:161px;">Norlands</td>
			<td style="width:119px;">NOA 86</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">UV lamp</td>
			<td style="width:161px;">Omnicure</td>
			<td style="width:119px;">Series 1000 UV</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Probe station</td>
			<td style="width:161px;">Cascade Microtech</td>
			<td style="width:119px;">model 42</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Flip-chip bonder</td>
			<td style="width:161px;">Dr. Tresky</td>
			<td style="width:119px;">T-320 X</td>
			<td></td>
		</tr>
	</tbody>
</table>

laser-induced forward transfer for flip-chip packaging of single dies

倒装芯片（FC）封装是一个关键的技术用于实现在微电子工业的高性能，超小型化和高密度电路。在该技术中，芯片和/或所述衬底撞着和两个通过这些导电性凸点接合。许多凸点技术已被开发，并自1960年1诸如模版印刷，螺柱凸点，蒸发和电解/电镀2引入FC技术的深入研究。尽管进展，这些方法都取得了它们都从一个遭受或需要解决诸如成本，复杂的处理步骤，加工温度高，制造时间，最重要的是，缺乏灵活性多个缺点。在本文中，我们展示了被称为激光诱导转发转移（LIFT）的简单和具有成本效益的基于激光的凸点形成技术3。使用LIFT技术广泛凹凸材料可以BË打印在单步具有很大的灵活性，高的速度和准确性在RT。另外，升降机使凸起和接合向下芯片级，它是用于制造超微型电路是至关重要的。

图7示出了从许多倒装接合的VCSEL芯片之一被记录，一个典型的LIV曲线。测量光功率给供应商之间的良好匹配引用值所指示的绑定设备后粘接的成功运作。该曲线也被记录优先和后封装和比较后可知，得到密封剂已经没有对芯片的功能影响（ 见图7）。另外，记录的倒装接合的VCSEL和那些从裸片记录的IV曲线之间的比较产生了很好的匹配，从而，这表明由于发生向解除凸块?...

Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

我们演示了如何使用激光诱导转发转移（LIFT）技术光电元器件的倒装芯片组装的。这种方法提供了一种简单，经济有效的，低的温度下，细间距凸点和粘结片上大规模用于光电应用实现高密度电路快速且灵活的解决方案。

激光诱导转发转移单人死于倒装芯片封装

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