Name: laser-induced forward transfer for flip-chip packaging of single dies
Uploaded: 2015-03-20T14:00:00
Description: Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

This work was carried out in the framework of the project &#8220;MIRAGE,&#8221; funded by the European Commission within the FP7 program.

1. LIFT-assisteret Flip-chip Bonding BEMÆRK: Der er tre faser i realiseringen LIFT-assisteret flip-chip forsamlinger, nemlig-mikro-bumpe af substraterne ved hjælp af LIFT teknik, fastgørelse af optoelektroniske chips til de rumlede substrater ved hjælp termo-kompression flip-chip bonding metode, og endelig indkapsling af de bundne forsamlinger. Hver af disse faser er omtalt i de følgende afsnit: <ol><li> Micro-bumpe hjælp LIFT: <ol><li> For donor forberedelse, deponere en tynd film a...

<ol>
	<li>Davis, E., Harding, W., Schwartz, R., Coring, J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Solid+logic+technology:+versatile,+high+performance+microelectronics.">Solid logic technology: versatile, high performance microelectronics.</a> IBM J. Res. Develop. 8, 102-114 (1964).</li><li>Bigas, M., Cabruja, E., Lozano, M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Bonding+techniques+for+hybrid+active+pixel+sensors+(HAPS).">Bonding techniques for hybrid active pixel sensors (HAPS).</a> Nucl. Instrum. Methods Phys. Res. A. 574 (2), 392-400 (2007).</li><li>Bohandy, J., Kim, B. F., Adrian, F. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Metal+deposition+from+a+supported+metal+film+using+an+excimer+laser.">Metal deposition from a supported metal film using an excimer laser.</a> J. Appl. Phys. 60 (4), 1538-1539 (1986).</li><li>Kaur, K. S., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Shadowgraphic+studies+of+triazene+assisted+laser-induced+forward+transfer+of+ceramic+thin+films.">Shadowgraphic studies of triazene assisted laser-induced forward transfer of ceramic thin films.</a> J. Appl. Phys. 105 (11), 113119 (2009).</li><li>Boutopoulos, C., Pandis, C., Giannakopoulos, K., Pissis, P., Zergioti, I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Polymer/carbon+nanotube+composite+patterns+via+laser+induced+forward+transfer.">Polymer/carbon nanotube composite patterns via laser induced forward transfer.</a> Appl. Physc. Lett. 96, 041104 (2010).</li><li>Xu, J., Liu, J., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser-assisted+forward+transfer+of+multi-spectral+nanocrystal+quantum+dot+emitters.">Laser-assisted forward transfer of multi-spectral nanocrystal quantum dot emitters.</a> Nanotechnology. 18 (2), 025403 (2007).</li><li>Doraiswamy, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Excimer+laser+forward+transfer+of+mammalian+cells+using+a+novel+triazene+absorbing+layer.">Excimer laser forward transfer of mammalian cells using a novel triazene absorbing layer.</a> Appl. Surf. Sci. 252 (13), 4743-4747 (2006).</li><li>Papazoglou, S., Raptis, Y. S., Chatzandroulis, S., Zergioti, <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=I.A+study+on+the+pulsed+laser+printing+of+liquid+phase+exfoliated+graphene+for+organic+electronics.">I.A study on the pulsed laser printing of liquid phase exfoliated graphene for organic electronics.</a> Appl. Phys. A. , (2014).</li><li>Chatzipetrou, M., Tsekenis, G., Tsouti, V., Chatzandroulis, S., Zergioti, I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Biosensors+by+means+of+the+laser+induced+forward+transfer+technique.">Biosensors by means of the laser induced forward transfer technique.</a> Appl. Surf. Sci. 278, 250-254 (2013).</li><li>Stewart, J. S., Lippert, T., Nagel, M., Nuesch, F., Wokaun, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Red-green-blue+polymer+light-emitting+diode+pixels+printed+by+optimized+laser-induced+forward+transfer.">Red-green-blue polymer light-emitting diode pixels printed by optimized laser-induced forward transfer.</a> Appl. Phys. Lett. 100 (20), 203303 (2012).</li><li>Kaur, K., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Waveguide+mode+filters+fabricated+using+laser-induced+forward+transfer.">Waveguide mode filters fabricated using laser-induced forward transfer.</a> Opt. Express. 19 (10), 9814-9819 (2011).</li><li>Kuznetsov, A. I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+fabrication+of+large-scale+nanoparticle+arrays+for+sensing+applications.">Laser fabrication of large-scale nanoparticle arrays for sensing applications.</a> ACS Nano. 5 (6), 4843-4849 (2011).</li><li>Rapp, L., Diallo, A. K., Alloncle, A. P., Videlot-Ackermann, C., Fages, F., Delaporte, P. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Pulsed-laser+printing+of+organic+thin-film+transistors.">Pulsed-laser printing of organic thin-film transistors.</a> Appl. Phys. Lett. 95 (17), 171109 (2009).</li><li>Bosman, E., Kaur, K. S., Missinne, J., Van Hoe, B., Van Steenberge, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Assembly+of+optoelectronics+for+efficient+chip-to-waveguide+coupling.">Assembly of optoelectronics for efficient chip-to-waveguide coupling.</a> , 630-634 (2013).</li><li>Kaur, K. S., Missinne, J., Van Steenberge, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Flip-chip+bonding+of+vertical-cavity+surface-emitting+lasers+using+laser-induced+forward+transfer.">Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.</a> Appl. Phys. Lett. 104 (6), 061102 (2014).</li><li>Kaur, K. S., al, e. t. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser-induced+forward+transfer+of+focussed+ion+beam+pre-machined+donors.">Laser-induced forward transfer of focussed ion beam pre-machined donors.</a> Appl. Surf. Sci. 257 (15), 6650-6653 (2011).</li></ol>

I dette papir, har vi vist termo-kompression flip-chip bonding af enkelte VCSEL chips ved hjælp af en laser baseret direkte-write teknik kaldet LIFT. Forsamlingen fabrikationstrin involveret trykning af mikro-bump af indium på underlaget kontaktpuderne vha LIFT teknik. Dette blev efterfulgt af termo-kompression flip-chip binding af VCSEL chips til de stødte substrater og endelig deres indkapsling. Elektrisk, optisk og mekanisk pålidelighed lift-assisteret bundne chips blev vurderet ved a...

Laser-induceret Forward Transfer (LIFT) er en alsidig direkte skrive additiv fremstillingsmetode til éntrins mønster definition og materialeoverførsel med micron og sub-micron-opløsning. I dette papir, vi rapporterer brugen af ​​LIFT som ramlede teknik til flip-chip emballage lodret hulrum overflade udsender lasere (VCSEL&#39;er) på en chip-skala. Flip-chip er en nøgleteknologi i systemet pakning og integration af elektroniske og optoelektroniske (OE) komponenter. For at opnå tætte integration af komponenter fine pitch binding er afgørende. Selv fine pitch bonding er blevet påvist ved nogle af de standard teknikker, men der er et tomrum med hensyn til at kombinere sammen de andre vigtige funktioner såsom fleksibilitet, omkostningseffektivitet, hastighed, præcision og forarbejdning temperatur lav. For at opfylde disse krav demonstrere vi LIFT-assisteret termo-kompression bonding metode til fine pitch limning af OE-komponenter. I LIFT, en tynd film af materialet, der skal trykkes (benævnt donor) afsættes på den ene side af en laser-transparent bærende underlag (benævnt bærer). Figur 1 viser det grundlæggende princip for denne teknik. En hændelse laser puls af tilstrækkelig intensitet derefter fokuseret på carrier-donor-interface, der giver skruens kraft til at sende overføre donor pixel fra den bestrålede zone på en anden substrat (kaldet modtager) placeret tæt. LIFT blev først rapporteret i 1986 af Bohandy som en teknik til at udskrive mikrometerstore kobberkabler til reparation af beskadigede foto-masker 3. Siden sin første demonstration denne teknik har fået betydelig interesse som en mikro-nano fabrikation teknologi til styret mønsterdannelse og trykning af en bred vifte af materialer, såsom keramiske 4, CNTs 5, QDs 6, levende celler 7, grafENE 8, til forskellige formål, såsom biosensorer 9, OLED 10, optoelektroniske komponenter 11, plasmoniske sensorer 12, organisk-elektronik 13 og flip-chip bonding 14,15. LIFT giver flere fordele i forhold til de eksisterende flip-chip ramlede og limning teknikker såsom enkelhed, hurtighed, fleksibilitet, omkostningseffektivitet, høj opløsning og nøjagtighed for flip-chip emballage OE-komponenter.

<table border="0" cellpadding="0" cellspacing="0" width="663">
	<tbody>
		<tr height="42">
			<td height="42" style="height:42px;width:216px;">Name of Material/ Equipment</td>
			<td style="width:161px;">Company</td>
			<td style="width:119px;">Catalog Number</td>
			<td style="width:167px;">Comments/Description</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Laser source</td>
			<td style="width:161px;">3D MicroMac (3DMM)</td>
			<td style="width:119px;">2912-295</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Photodetector</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">818 series</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Source measurement unit</td>
			<td style="width:161px;">Keithley&#160;</td>
			<td style="width:119px;">2401</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Power meter</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">1930</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Underfill</td>
			<td style="width:161px;">Norlands</td>
			<td style="width:119px;">NOA 86</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">UV lamp</td>
			<td style="width:161px;">Omnicure</td>
			<td style="width:119px;">Series 1000 UV</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Probe station</td>
			<td style="width:161px;">Cascade Microtech</td>
			<td style="width:119px;">model 42</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Flip-chip bonder</td>
			<td style="width:161px;">Dr. Tresky</td>
			<td style="width:119px;">T-320 X</td>
			<td></td>
		</tr>
	</tbody>
</table>

laser-induced forward transfer for flip-chip packaging of single dies

Flip-chip (FC) emballagen er en nøgleteknologi for at realisere høj ydeevne, ultra-miniaturiserede og high-density kredsløb i mikro-elektronik industri. I denne teknik chippen og / eller substratet stød og de to er bundet via disse ledende bump. Mange ramlede teknikker er blevet udviklet og intensivt undersøgt siden indførelsen af FC-teknologi i 1960 1 som stencil trykning, stud bumpe, fordampning og strømløs / galvanisering 2. Trods de fremskridt, disse metoder har gjort de lider alle af en eller flere end én ulemper, der skal løses, såsom omkostninger, komplekse bearbejdningstrin, høje forarbejdningstemperaturer, fremstilling tid og vigtigst den manglende fleksibilitet. I dette papir, viser vi en enkel og omkostningseffektiv laserbaseret bump danner teknik kendt som laserinduceret Forward Transfer (elevator) 3. Brug af løfteren teknik en bred vifte af bump materialer kan be trykt i et enkelt trin med stor fleksibilitet, høj hastighed og præcision ved stuetemperatur. Desuden LIFT muliggør ramlede og limning ned til chip-skala, som er afgørende for at fabrikere ultra-miniature kredsløb.

Figur 7 viser et typisk LIV kurve, der blev optaget fra en af de mange flip-chip bonded VCSEL chips. Et godt match mellem den målte optisk effekt til leverandøren citerede værdier angivet velfungerende den bundne enheder efter bonding. Kurverne blev også registreret prioriteret og post-indkapsling og ved sammenligning blev det bekræftet, at indkapslingen ikke havde indvirkning på chippen funktionalitet (som vist i figur 7). Også en sammenligning mellem de IV kurver er konstateret...

Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Vi demonstrere brugen af ​​Laser-induceret Forward Transfer (LIFT) teknik til flip-chip samling af optoelektroniske komponenter. Denne fremgangsmåde giver en enkel, omkostningseffektiv, lav temperatur, hurtig og fleksibel løsning for fine pitch bumpe og limning på chip-skala for at opnå høj tæthed kredsløb til optoelektroniske applikationer.

Laser-induceret Forward Transfer for Flip-chip Pakning af Single Dies

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics ...

Research

JoVE Journal

Engineering

Compact Quantum Dots for Single-molecule Imaging

Kompakte Quantum Dots for Single-molekyle Imaging

Single-molecule imaging is an important tool for  understanding the mechanisms of biomolecular function and for visualizing the  spatial and temporal ...

Analysis of Contact Interfaces for Single GaN Nanowire Devices

Analyse af kontaktflader til enlige GaN Nanotråd Devices

Single GaN nanowire (NW) devices fabricated on SiO2 can exhibit  a strong degradation after annealing due to the  occurrence of void formation at the ...

Measurement and Analysis of Atomic Hydrogen and Diatomic Molecular AlO, C2, CN, and TiO Spectra Following Laser-induced Optical Breakdown

Measurement and Analysis of Atomic Hydrogen and Diatomic Molecular AlO, C2, CN, and TiO Spectra Following Laser-induced Optical Breakdown

Måling og analyse af Atomic Brint og diatomiske Molekylær AlO, C<sub&gt; 2.</sub&gt;, CN, og TiO Spectra flg. Laser-induceret Optisk Fordeling

In this work, we present time-resolved measurements of atomic and diatomic spectra following laser-induced optical breakdown. A typical LIBS arrangement ...

Laser-induced Breakdown Spectroscopy: A New Approach for Nanoparticle's Mapping and Quantification in Organ Tissue

Laser-induceret Fordeling spektroskopi: En ny tilgang til Nanopartikel kortlægning og kvantificering i Organ Tissue

Emission spectroscopy of laser-induced plasma was applied to elemental analysis of biological samples. Laser-induced breakdown spectroscopy (LIBS) ...

Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping

Silicium-oxid-halvleder Quantum Dots for Single-elektron Pumpning

As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by ...

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

Integration af Light fældefangst Sølv Nanostrukturer i hydrogeneret Mikrokrystallinsk silicium solceller ved Transfer Printing

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly ...

Laser-induced Forward Transfer of Ag Nanopaste

Laser-induceret Forward Overførsel af Ag Nanopasta

Over the past decade, there has been much development of non-lithographic methods1-3 for printing metallic inks or other functional materials. Many of ...

Fabrication of 1-D Photonic Crystal Cavity on a Nanofiber Using Femtosecond Laser-induced Ablation

Fabrikation af 1-D Photonic Crystal Cavity på en Nanofiber Brug Femtosekund Laser-induceret Ablation

We present a protocol for fabricating 1-D Photonic Crystal (PhC) cavities on subwavelength-diameter tapered optical fibers, optical nanofibers, using ...

Scanning Light Scattering Profiler (SLPS) Based Methodology to Quantitatively Evaluate Forward and Backward Light Scattering from Intraocular Lenses

Scanning Light Scattering Profiler SLPS Based Methodology to Quantitatively Evaluate Forward and Backward Light Scattering from Intraocular Lenses

Scanning Light Scattering Profiler (SLPS) -baseret metode til kvantitativ evaluering af fremadrettet og bagudlysudspredning fra intraokulære linser

The scanning light scattering profiler (SLSP) methodology has been developed for the full-angle quantitative evaluation of forward and backward light ...

All-electronic Nanosecond-resolved Scanning Tunneling Microscopy: Facilitating the Investigation of Single Dopant Charge Dynamics

All-elektroniske nanosekund-løst Scanning Tunneling Mikroskopi: At lette undersøgelsen af enkelt Dopant afgift Dynamics

The miniaturization of semiconductor devices to scales where small numbers of dopants can control device properties requires the development of new ...