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DOI :
10.3791/52623-v
March 20th, 2015
Chapters
0:05
Title
1:48
Micro-bumping Using Laser-induced Forward Transfer
3:52
Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
5:23
Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
6:28
Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
7:50
Conclusion
우리는 광전자 부품의 플립 칩 실장 용 레이저 유발 순방향 전송 (LIFT) 기술의 사용을 입증한다. 이 방법은 간단하고 비용 효과적인 저온, 광전자 응용을위한 고밀도 회로를 실현하기위한 칩 크기에 당김 미세 피치 및 접착 용 빠르고 유연한 솔루션을 제공한다.
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