Name: fabrication and characterization of a conformal skin-like electronic system for quantitative, cutaneous wound management
Uploaded: 2015-09-02T14:00:00
Description: Watch this Scientific Journal Video about Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management at JoVE.com

Dit werk werd ondersteund door het opstarten van de financiering van de School of Engineering, Virginia Commonwealth University en een aantal van elektronische apparaten werden bereid bij de microfabrication faciliteiten in de Wright Virginia Microelectronics Center. Wij erkennen onderzoekers die bijdragen voor het apparaat en de klinische gegevens (figuren 3 en 5 in dit document), overgenomen van de gepubliceerde artikel 10 gemaakt. W.-HY dankzij Yoshiaki Hattori voor de op maat gemaakte, gegevensregistratie software.

De experimenten voor toestel fabricage, huid lamineren en karakterisering getoond in figuren 1, 2 en 4 betrof twee vrijwilligers, allemaal uitgevoerd in de Bio-gekoppelde nanoengineering Laboratory Virginia Commonwealth University (VCU), Richmond, VA, USA. Deze studie werd goedgekeurd door de VCU Institutional Review Board (protocol nummer: HM20001454) en volgde de richtlijnen van de VCU Human Research onderzoek. Het apparaat en de klinische gegevens getoond in<...

<ol>
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This article highlights the methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination near the wound tissues, which offers quantitative measurement of skin temperature and thermal conductivity mapping on the skin. 
The key features include the utilization of novel techniques of materials transfer printing and hard-soft materials integration to design and develop the flexible/stretchable, soft electronic device. The use of biocompatible, elec...

In klinisch onderzoek en biomedisch onderzoek, is bewaking van wondgenezing gericht op een invasieve methode die is gebaseerd op de histologische evaluatie weefsel morfologische verandering wonden 1,2. Onlangs, de snelle ontwikkelingen in de elektronische technologieën maken voor de ontwikkeling van hoge precisie beeldvorming en analyse-instrumenten die visueel kan inspecteren het wondgenezingsproces via digitale imaging 3,4 of confocale scanning microscopie en spectroscopie van 4,5. Echter, deze imaging aanpak vereisen dure en gecompliceerde optische instrumenten en operaties, en nog belangrijker, moeten patiënten tijdens het testen te immobiliseren. Derhalve bestaat er een behoefte aan nieuwe apparaten en systemen die kwantitatief, niet-invasief, gemakkelijk te gebruiken, goedkoop en multifunctionele nauwkeuriger wondbehandelingen aanbieden zijn. Hier introduceren we een huid-achtige elektronische systeem dat nauwkeurige, real-time in kaart brengen van de temperatuur en thermische condu biedtctivity en levert een precieze niveau van verwarming bij wondplaatsen via conforme lamineren van het apparaat niet-invasief. Deze inrichting bevat een klasse van technologie, huid epidermale gemonteerde elektronische systemen die zijn ontworpen om te passen mechanische en materiaaleigenschappen (totale dikte, buigstijfheid, effectief moduli en massadichtheid) van de epidermis 6-9. Het apparaat is ontworpen in een biocompatibele, huidvriendelijke, water-proof, en herbruikbare vorm die kan worden gewassen en gedesinfecteerd voor klinische toepassingen bij patiënten 10. De conforme elektronische inrichting aangebracht nabij het ​​wondweefsel vangt de ontsteking fase (één van wondgenezing), veroorzaakt door verhoogde bloedtoevoer en enzymatische reacties op de wond 11,12 door kwantitatieve registratie van temperatuur 8 en thermische geleiding 13, gecorreleerd aan hydratatie . Experimentele en computationele studies te bepalen een optimale mechanica ontwerp accommaten natuurlijke bewegingen en toegepaste stammen zonder mechanische breuk en vastleggen van de onderliggende fysica van het uitrekken van de mechanica van de huid-achtige elektronica die conformally laminaten op de huid oppervlak, dat de verwerving van high fidelity signalen biedt. De in dit artikel beschreven protocollen presenteren de methoden van microfabrication voor huid-achtige elektronische systemen, het testen van de voorbereiding met inbegrip apparaat schoonmaken, installeren van apparatuur in een klinische setting en klinische toepassingen voor de kwantitatieve controle van de temperatuur en thermische geleidbaarheid op cutane wonden.

<table border="0" cellpadding="0" cellspacing="0">
	<tbody>
		<tr>
			<td>3&#34; Silicon wafer</td>
			<td>University Wafer, USA</td>
			<td>N/A</td>
			<td>Use as carrier to fabricate the device</td>
		</tr>
		<tr>
			<td>Acetone</td>
			<td>Fisher Scientific, USA</td>
			<td>A18-1</td>
			<td>Use to clean a wafer and to remove photoresist</td>
		</tr>
		<tr>
			<td>Isopropanol (IPA)</td>
			<td>Fisher Scientific, USA</td>
			<td>A459-1</td>
			<td>Use to clean a wafer</td>
		</tr>
		<tr>
			<td>AZ4620 photoresist</td>
			<td>AZ Electrionic Materials, USA</td>
			<td>N/A</td>
			<td>Use to make patterns on metals and polymers</td>
		</tr>
		<tr>
			<td>AZ400K developer</td>
			<td>AZ Electrionic Materials, USA</td>
			<td>N/A</td>
			<td>Use to develop AZ4620 photoresist</td>
		</tr>
		<tr>
			<td>Chromium etchant</td>
			<td>Transene, USA</td>
			<td>1020AC</td>
			<td>Use to etch Cr layer of device</td>
		</tr>
		<tr>
			<td>Copper etchant</td>
			<td>Transene, USA</td>
			<td>ASP-100</td>
			<td>Use to etch Cu layer of device</td>
		</tr>
		<tr>
			<td>Sylgard 184 Silicone Elastomer Kit (PDMS)</td>
			<td>Dow Corning, USA</td>
			<td>39100000</td>
			<td>Use as a substrate for &#39;dry&#39; retrieval</td>
		</tr>
		<tr>
			<td>PI2545 polyimide</td>
			<td>HD MicroSystem, USA</td>
			<td>N/A</td>
			<td>Use to encapsulate metal layer</td>
		</tr>
		<tr>
			<td>Solaris</td>
			<td>Smooth-On, USA</td>
			<td>N/A</td>
			<td>Use as substrate and to encapsulate device</td>
		</tr>
		<tr>
			<td>Petridish</td>
			<td>Carolina, USA</td>
			<td>741255</td>
			<td>Use as mold to make substrate</td>
		</tr>
		<tr>
			<td>Water-Soluble Wave Solder Tape 5414</td>
			<td>3M, USA</td>
			<td>AM000000217</td>
			<td>Use to retrive device from PDMS layer</td>
		</tr>
		<tr>
			<td>High Activity Liquid Stainless Steel Flux</td>
			<td>Worthington, USA</td>
			<td>331929</td>
			<td>Use to remove oxidation layer on Cu</td>
		</tr>
		<tr>
			<td>Flexible, micro-film cable</td>
			<td>Elform, USA</td>
			<td>N/A (customized)</td>
			<td>Use to make the electrical connection between the electronic device and the data acquisition system</td>
		</tr>
		<tr>
			<td>pH Neutral Cleaner</td>
			<td>Australian Gold, USA</td>
			<td>N/A</td>
			<td>Use as disinfectant solution to clean device in clinical testing</td>
		</tr>
		<tr>
			<td>Solder</td>
			<td>Kester, USA</td>
			<td>24-6337-9703</td>
			<td>Use as material to solder hard wires</td>
		</tr>
		<tr>
			<td>Ultraviolet lamp</td>
			<td>Cole-Parmer, USA</td>
			<td>97600-00</td>
			<td>Use to activate PDMS layer as hydrophilic surface</td>
		</tr>
		<tr>
			<td>Multiplexer</td>
			<td>FixYourBoard, USA</td>
			<td>U802</td>
			<td>Use to acquire measurements from six sensing components&#160;</td>
		</tr>
		<tr>
			<td>DC/AC current source</td>
			<td>Keithley, USA</td>
			<td>6221</td>
			<td>Use to supply current</td>
		</tr>
		<tr>
			<td>SMD Digital Hot Air Rework Station</td>
			<td>Aoyue, China</td>
			<td>968A+</td>
			<td>Use to solder hard wires, to electrically connect between the device and external instruments</td>
		</tr>
		<tr>
			<td>Infrared camera</td>
			<td>FLIR, USA</td>
			<td>435-0001-01-00</td>
			<td>Use to take infrared images in experiment</td>
		</tr>
		<tr>
			<td>Digital multimeter</td>
			<td>Fluke, USA</td>
			<td>117</td>
			<td>Use to check electrical connection</td>
		</tr>
		<tr>
			<td>Lock-in amplifier</td>
			<td>Stanford Research System, USA</td>
			<td>SR830</td>
			<td>Use to perform four-point-probe-measurement</td>
		</tr>
		<tr>
			<td>Electron beam evaporator</td>
			<td>9 scale Vacuum Products, USA</td>
			<td>N/A (customized)</td>
			<td>Use to deposit thin films (Cu and SiO2)</td>
		</tr>
	</tbody>
</table>

fabrication and characterization of a conformal skin-like electronic system for quantitative, cutaneous wound management

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of cutaneous wound healing on the skin. Existing methods, however, still rely on visual inspections through various microscopic tools and devices that normally include high-cost, sophisticated systems and require well trained personnel for operation and data analysis. Here, we describe methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination to the skin surface near the wound tissues, which provides recording of high fidelity electrical signals such as skin temperature and thermal conductivity. The methods of device fabrication provide details of step-by-step preparation of the microelectronic system that is completely enclosed with elastomeric silicone materials to offer electrical isolation. The experimental study presents multifunctional, biocompatible, waterproof, reusable, and flexible/stretchable characteristics of the device for clinical applications. Protocols of clinical testing provide an overview and sequential process of cleaning, testing setup, system operation, and data acquisition with the skin-like electronics, gently mounted on hypersensitive, cutaneous wound and contralateral tissues on patients.

Figuur 1 geeft een overzicht van de kenmerken van de conforme, huidachtige elektronisch systeem, ontworpen voor kwantitatieve cutane wondbehandelingen bij patiënten. De multifunctionele elektronisch apparaat bestaat uit microschaal fractal structuren 3,14 en continuvezelmateriaal serpentijn sporen 9,17 op een dunne elastomeer membraan dat uitzonderlijke mechanische rekbaarheid en buigzaamheid biedt. Het compatibel apparaat dat geheel wordt omsloten door siliconen lagen maakt zacht...

Watch this Scientific Journal Video about Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management at JoVE.com

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

This article presents methods to fabricate and characterize a conformal, skin-like electronic system and protocols for the use in clinical applications, particularly on cutaneous wound management.

Fabricage en karakterisering van een Conformal Skin-achtige Electronic System for Quantitative, Cutane Wound Management

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of ...

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