Name: fabrication and characterization of a conformal skin-like electronic system for quantitative, cutaneous wound management
Uploaded: 2015-09-02T14:00:00
Description: Watch this Scientific Journal Video about Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management at JoVE.com

Ce travail a été soutenu par le fonds de démarrage de l&#39;École de génie, Université Virginia Commonwealth et certains appareils ont été préparés dans les installations de microfabrication dans le Virginia Wright Microelectronics Center. Nous reconnaissons chercheurs qui ont fait des contributions de l&#39;appareil et les données cliniques (figures 3 et 5 dans le présent document), acquis de l&#39;article publié le 10. W.-HY grâce Yoshiaki Hattori pour le logiciel d&#39;enregistrement de données sur mesure.

Les expériences pour la fabrication de l&#39;appareil, la stratification de la peau, et la caractérisation présentés dans les figures 1, 2, et 4 impliqués deux volontaires, tous effectués dans le laboratoire Bio-Nanoengineering interfacé à Virginia Commonwealth University (VCU), Richmond, Virginie, Etats-Unis. Cette étude a été approuvée par l&#39;Institutional Review Board VCU (numéro de protocole: HM20001454) et a suivi les lignes directrices de recherche de la recherche ...

<ol>
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This article highlights the methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination near the wound tissues, which offers quantitative measurement of skin temperature and thermal conductivity mapping on the skin. 
The key features include the utilization of novel techniques of materials transfer printing and hard-soft materials integration to design and develop the flexible/stretchable, soft electronic device. The use of biocompatible, elec...

Dans l&#39;étude clinique et la recherche biomédicale, la surveillance de la cicatrisation des plaies a mis l&#39;accent sur ​​une méthode invasive qui est basé sur l&#39;évaluation histologique du tissu changement morphologique dans les plaies 1,2. Récemment, les progrès rapides dans les technologies électroniques permettent le développement de haute précision imagerie et d&#39;analyse des outils qui peuvent inspecter visuellement le processus de cicatrisation via l&#39;imagerie numérique 3,4 ou la microscopie confocale à balayage et la spectroscopie 4,5. Cependant, ces approches d&#39;imagerie nécessitent coût élevé, des outils et des opérations optiques complexes, et plus important encore, les patients doivent être immobilisé pendant le test. Par conséquent, il existe un besoin pour de nouveaux appareils et systèmes qui sont quantitative, non-invasive, facile à utiliser, peu coûteux, et multifonctionnelle pour offrir une gestion plus précise de la plaie. Ici, nous introduisons un système électronique ressemble à une peau qui fournit précis, la cartographie en temps réel de la température et thermiques Conductivité et délivre un niveau précis de chauffage au niveau des sites de plaies conforme par le dispositif de laminage de façon non invasive. Ce dispositif présente une classe de technologie, des systèmes montés peau épidermiques électroniques qui sont conçus pour correspondre aux propriétés mécaniques et matérielles (épaisseur totale, la rigidité en flexion, modules efficaces, et la densité de masse) de l&#39;épiderme 6-9. Le dispositif est conçu dans un, respectueux de la peau, résistant à l&#39;eau biocompatible et forme réutilisable qui peut être lavé et désinfecté pour des applications cliniques sur des patients 10. Le dispositif électronique conforme monté à proximité des tissus de la plaie capte la phase d&#39;inflammation (l&#39;un des processus de cicatrisation des plaies), causé par l&#39;augmentation du flux sanguin et des réactions enzymatiques à la plaie 11,12, grâce à l&#39;enregistrement quantitatif de température 8 et une conductivité thermique 13, en corrélation avec hydratation . Des études expérimentales et informatiques déterminent une conception mécanique optimale à Accommodmangé mouvements naturels et les souches appliquées sans rupture mécanique et capturer les sous-jacents de la physique étirement mécanique de l&#39;électronique de la peau comme celle stratifiés de façon conforme à la surface de la peau, qui propose l&#39;acquisition de signaux haute fidélité. Les protocoles décrits dans cet article présentent les méthodes de microfabrication pour les systèmes électroniques comme une peau, test de préparation y compris le nettoyage de l&#39;appareil, la configuration de l&#39;équipement dans un cadre clinique, et les applications cliniques pour le suivi quantitatif de la température et de la conductivité thermique sur les plaies cutanées.

<table border="0" cellpadding="0" cellspacing="0">
	<tbody>
		<tr>
			<td>3&#34; Silicon wafer</td>
			<td>University Wafer, USA</td>
			<td>N/A</td>
			<td>Use as carrier to fabricate the device</td>
		</tr>
		<tr>
			<td>Acetone</td>
			<td>Fisher Scientific, USA</td>
			<td>A18-1</td>
			<td>Use to clean a wafer and to remove photoresist</td>
		</tr>
		<tr>
			<td>Isopropanol (IPA)</td>
			<td>Fisher Scientific, USA</td>
			<td>A459-1</td>
			<td>Use to clean a wafer</td>
		</tr>
		<tr>
			<td>AZ4620 photoresist</td>
			<td>AZ Electrionic Materials, USA</td>
			<td>N/A</td>
			<td>Use to make patterns on metals and polymers</td>
		</tr>
		<tr>
			<td>AZ400K developer</td>
			<td>AZ Electrionic Materials, USA</td>
			<td>N/A</td>
			<td>Use to develop AZ4620 photoresist</td>
		</tr>
		<tr>
			<td>Chromium etchant</td>
			<td>Transene, USA</td>
			<td>1020AC</td>
			<td>Use to etch Cr layer of device</td>
		</tr>
		<tr>
			<td>Copper etchant</td>
			<td>Transene, USA</td>
			<td>ASP-100</td>
			<td>Use to etch Cu layer of device</td>
		</tr>
		<tr>
			<td>Sylgard 184 Silicone Elastomer Kit (PDMS)</td>
			<td>Dow Corning, USA</td>
			<td>39100000</td>
			<td>Use as a substrate for &#39;dry&#39; retrieval</td>
		</tr>
		<tr>
			<td>PI2545 polyimide</td>
			<td>HD MicroSystem, USA</td>
			<td>N/A</td>
			<td>Use to encapsulate metal layer</td>
		</tr>
		<tr>
			<td>Solaris</td>
			<td>Smooth-On, USA</td>
			<td>N/A</td>
			<td>Use as substrate and to encapsulate device</td>
		</tr>
		<tr>
			<td>Petridish</td>
			<td>Carolina, USA</td>
			<td>741255</td>
			<td>Use as mold to make substrate</td>
		</tr>
		<tr>
			<td>Water-Soluble Wave Solder Tape 5414</td>
			<td>3M, USA</td>
			<td>AM000000217</td>
			<td>Use to retrive device from PDMS layer</td>
		</tr>
		<tr>
			<td>High Activity Liquid Stainless Steel Flux</td>
			<td>Worthington, USA</td>
			<td>331929</td>
			<td>Use to remove oxidation layer on Cu</td>
		</tr>
		<tr>
			<td>Flexible, micro-film cable</td>
			<td>Elform, USA</td>
			<td>N/A (customized)</td>
			<td>Use to make the electrical connection between the electronic device and the data acquisition system</td>
		</tr>
		<tr>
			<td>pH Neutral Cleaner</td>
			<td>Australian Gold, USA</td>
			<td>N/A</td>
			<td>Use as disinfectant solution to clean device in clinical testing</td>
		</tr>
		<tr>
			<td>Solder</td>
			<td>Kester, USA</td>
			<td>24-6337-9703</td>
			<td>Use as material to solder hard wires</td>
		</tr>
		<tr>
			<td>Ultraviolet lamp</td>
			<td>Cole-Parmer, USA</td>
			<td>97600-00</td>
			<td>Use to activate PDMS layer as hydrophilic surface</td>
		</tr>
		<tr>
			<td>Multiplexer</td>
			<td>FixYourBoard, USA</td>
			<td>U802</td>
			<td>Use to acquire measurements from six sensing components&#160;</td>
		</tr>
		<tr>
			<td>DC/AC current source</td>
			<td>Keithley, USA</td>
			<td>6221</td>
			<td>Use to supply current</td>
		</tr>
		<tr>
			<td>SMD Digital Hot Air Rework Station</td>
			<td>Aoyue, China</td>
			<td>968A+</td>
			<td>Use to solder hard wires, to electrically connect between the device and external instruments</td>
		</tr>
		<tr>
			<td>Infrared camera</td>
			<td>FLIR, USA</td>
			<td>435-0001-01-00</td>
			<td>Use to take infrared images in experiment</td>
		</tr>
		<tr>
			<td>Digital multimeter</td>
			<td>Fluke, USA</td>
			<td>117</td>
			<td>Use to check electrical connection</td>
		</tr>
		<tr>
			<td>Lock-in amplifier</td>
			<td>Stanford Research System, USA</td>
			<td>SR830</td>
			<td>Use to perform four-point-probe-measurement</td>
		</tr>
		<tr>
			<td>Electron beam evaporator</td>
			<td>9 scale Vacuum Products, USA</td>
			<td>N/A (customized)</td>
			<td>Use to deposit thin films (Cu and SiO2)</td>
		</tr>
	</tbody>
</table>

fabrication and characterization of a conformal skin-like electronic system for quantitative, cutaneous wound management

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of cutaneous wound healing on the skin. Existing methods, however, still rely on visual inspections through various microscopic tools and devices that normally include high-cost, sophisticated systems and require well trained personnel for operation and data analysis. Here, we describe methods and protocols to fabricate a conformal, skin-like electronics system that enables conformal lamination to the skin surface near the wound tissues, which provides recording of high fidelity electrical signals such as skin temperature and thermal conductivity. The methods of device fabrication provide details of step-by-step preparation of the microelectronic system that is completely enclosed with elastomeric silicone materials to offer electrical isolation. The experimental study presents multifunctional, biocompatible, waterproof, reusable, and flexible/stretchable characteristics of the device for clinical applications. Protocols of clinical testing provide an overview and sequential process of cleaning, testing setup, system operation, and data acquisition with the skin-like electronics, gently mounted on hypersensitive, cutaneous wound and contralateral tissues on patients.

La figure 1 présente un aperçu des caractéristiques de la conformation, système électronique ressemble à une peau, conçus pour la gestion quantitative, des plaies cutanées sur les patients. Le dispositif électronique multifonctionnel est constitué de structures fractales microscopique de 3,14 et de serpentine filamentaire retrace 9,17 sur une membrane élastomère mince qui offre une extensibilité mécanique exceptionnelle et cintrabilité. L&#39;appareil compatible qui ...

Watch this Scientific Journal Video about Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management at JoVE.com

Fabrication and Characterization of a Conformal Skin-like Electronic System for Quantitative, Cutaneous Wound Management

This article presents methods to fabricate and characterize a conformal, skin-like electronic system and protocols for the use in clinical applications, particularly on cutaneous wound management.

Fabrication et caractérisation d&#39;un système électronique conforme de la peau comme pour la gestion quantitative, cutanée plaies

Recent advances in the development of electronic technologies and biomedical devices offer opportunities for non-invasive, quantitative assessment of ...

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