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DOI :
10.3791/53614-v
January 4th, 2016
Chapters
0:05
Title
1:02
Cleaning and Etching the Silicon Wafers
4:08
Silicon Wafer Passivation and Photoconductive (PC) Measurement
7:08
Results: Silicon Wafer Photoconductive Measurement after Surface Passivation
8:10
Conclusion
一个RT液体表面钝化技术研究体硅缺陷的重组活性描述。对于该技术是成功的,三个关键的步骤是必需的:(ⅰ)化学清洗和硅的蚀刻,硅的(ⅱ)浸没在15%的氢氟酸和(iii)照明1分钟。
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