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DOI :
10.3791/53683-v
April 13th, 2016
Chapters
0:05
Title
1:28
Steps for Performing Tomography Scans at Beamline 8.3.2 (ALS, LBNL)
4:02
Setting up the Scan Parameters Using the Data Acquisition Computer
4:54
Results: Multi-scale Features Imaged in an Entire Micro-electronic Package Using Synchrotron Radiation Microtomography
6:11
Conclusion
在这项研究中同步加速器辐射微断层摄影术中,非破坏性的三维成像技术中,用于研究整个微电子封装为16×16毫米的截面积。由于同步的高通量和亮度样品成像,在短短3分钟,8.7微米的空间分辨率。
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