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DOI :
10.3791/55735-v
•
7:15 min
June 2nd, 2017
Chapters
0:05
Title
6:50
Conclusion
5:52
Results: In Situ Electromechanical Characterization of a Single-crystal Copper Specimen
0:45
Microfabrication of Silicon Frames
2:13
Laser Patterning of Metal Copper Specimens
3:38
Microdevice-based Electromechanical Testing Systems (MEMTS) Assembly
4:38
In Situ Transmission Electron Microscopy (TEM) Experiments
使用宏观样品,隔离电气和热效应对电辅助变形(EAD)是非常困难的。已经开发了金属样品微观和纳米结构以及定制测试程序,以评估施加的电流对形成的影响,而不会有焦耳加热和这些样品上位错的演变。
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