Preparation of 3D-printed Substrate, Fabrication of Interconnects and Adjustment of Printer Parameters for the First Layer
2:53
Curing Parameter Adjustments for the First Layer
3:44
Inkjet Printing and Curing of the First Device Layer
4:41
Inspection of the Surface Properties of the Respective Substrates for Printability and Inkjet Printing and Curing of Subsequent Device Layers
6:37
Results: Surface Analyses and Measurement Results from a Capacitive Sensor System Prototype
7:50
Conclusion
Hier präsentieren wir ein Protokoll für die Herstellung von Inkjet-drucken mehrschichtigen Sensor Strukturen auf additiv hergestellte Substrate und Folie.