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DOI :
10.3791/60583-v
•
9:39 min
March 1st, 2020
Chapters
0:05
Introduction
1:04
Wafer Cleaning, Hexamethyldisilane (HMDS) Deposition, and Lithography
3:28
Sputter, Photoresist Lift-off and Processing, Manual back Alignment, and Lithography on the Backside of the Wafer
4:46
Etching and Final Cleaning
7:41
Results: Immersing Silica-GEMs in Water
9:02
Conclusion
ここでは、集積回路微細加工技術を用いてSiO2/Siウエハースからガス包絡膜(GEM)を実現するための段階的なプロトコルです。シリカ-GEMを水に浸すと、水を使うシリカの組成にもかかわらず、水の侵入が防止されます。
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