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DOI :
10.3791/61026-v
May 13th, 2020
Chapters
0:04
Introduction
0:52
Fabrication Process and Electrical Characterization
2:33
Biasing Chip Mounting on Gridbar
3:14
Lamella Preparation and Biasing Chip Mounting
6:50
In Situ Transmission Electron Microscopy (TEM)
7:42
Results: Representative In Situ Electrical TEM
9:04
Conclusion
ここでは、積層金属絶縁金属構造のための透過電子顕微鏡(TEM)を用いたその際のナノ構造変化を分析するためのプロトコルを紹介します。次世代のプログラマブルロジック回路とニューロミカシングハードウェア用の抵抗スイッチングクロスバーに重要な用途があり、その基礎となる動作機構と実用的な適用性を明らかにする。
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