Taktil semiautomatisk passiv-finger vinkel stimulator (TSPAS)
July 30th, 2020
•Wu Wang1, Jiajia Yang2,4, Yinghua Yu2,3,4, Qiong Wu5,2, Satoshi Takahashi2, Yoshimichi Ejima2, Jinglong Wu6,2
1Cognitive Neuroscience Laboratory, Graduate School of Natural Science and Technology, Okayama University, 2Cognitive Neuroscience Laboratory, Graduate School of Interdisciplinary Science and Engineering in Health Systems, Okayama University, 3Center for Information and Neural Networks, National Institute of Information and Communications Technology, 4Section on Functional Imaging Methods, National Institute of Mental Health, 5School of Education, Suzhou University of Science and Technology, 6Beijing Institute of Technology
Præsenteret er den taktile semiautomatiske passiv-finger vinkel stimulator TSPAS, en ny måde at vurdere taktile rumlige skarphed og taktile vinkel diskrimination ved hjælp af en computer-kontrolleret taktil stimulus system, der gælder hævet vinkel stimuli til et emne passive fingerpad, mens kontrol for bevægelse hastighed, afstand og kontakt varighed.
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