Name: microfluidic fabrication techniques for high-pressure testing of microscale supercritical co2 foam transport in fractured unconventional reservoirs
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Description: Watch this Scientific Journal Video about Microfluidic Fabrication Techniques for High-Pressure Testing of Microscale Supercritical CO2 Foam Transport in Fractured Unconventional Reservoirs at JoVE.co

来自怀俄明大学的作者感谢支持作为非常规和紧密油层水-碳氢化合物-岩石相互作用机械控制中心的一部分，该中心是由美国能源部能源前沿研究中心资助的，能源部，能源局（BES）颁发的DE-SC0019165奖。来自堪萨斯大学的作者们感谢美国国家科学基金会EPSCoR研究基础设施改进计划：轨道-2聚焦EPSCOR协作奖（OIA-1632892）用于资助该项目。作者们还感谢怀俄明大学化学工程系的孙金迪，感谢她在仪器培训方面给予的慷慨帮助。SAA感谢来自怀俄明大学的凯尔·温克尔曼，感谢他在构建成像和紫外线支架方面的帮助。最后，但不是最不重要的，作者感谢约翰瓦瑟鲍尔从微玻璃，有限责任公司有用的讨论SLE技术。

注意：此协议涉及处理高压装置、高温炉、危险化学品和紫外线。请仔细阅读所有相关材料安全数据表，并遵守化学品安全指南。在开始喷射过程之前，请检查压力测试（静液压和气动）安全准则，包括所需的培训、所有设备的安全操作、相关危险、紧急触点等。
1. 设计几何图案
<ol><li>设计一个光掩贴，包括几何特征和感兴趣的流动路径（图1，...

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这项工作提出了一个与制造平台相关的协议，用于制造坚固的高压玻璃微流体器件。这项工作中提出的协议通过在手套箱内执行几个最终的制造步骤来缓解对洁净室的需要。建议使用洁净室（如果有）以尽量减少污染的可能性。此外，蚀刻机的选择应基于所需的表面粗糙度。使用HF和HCl的混合物作为蚀刻，往往减少表面粗糙度30。这项工作涉及微流体平台，使复杂流体在复杂渗透...

水力压裂已经使用相当长一段时间，作为刺激流量的手段，特别是在紧密地层1。水力压裂所需的大量水与环境因素、供水问题2、地层损伤3、成本4和地震影响5。因此，人们对替代压裂方法（如无水压裂和使用泡沫）的兴趣正在上升。替代方法可提供重要好处，如减少用水6，与水敏感地层7相容，最小至无堵塞地层8，压裂液9，可回收性10，易于清理和支撑承载能力6。CO2泡沫是一种潜在的无水压裂液，与传统压裂技术6、7、11相比，有助于提高石油液体的高效生产，提高地下CO2的储存能力，其环境足迹可能更小。
在最佳条件下，超临界CO2泡沫（SCCO2泡沫）在压力超过给定储层的最低杂容压力（MMP）提供一个多接触杂误系统，能够直接流入层层中渗透性较低的部分，从而提高清扫效率和资源回收12，13。scCO2提供扩散和液体等气体密度 14，非常适合地下应用，如石油回收和碳捕获、利用和储存 （CCUS）13。地下泡沫成分的存在有助于减少CO215长期储存中泄漏的风险。此外，scCO2泡沫系统的耦合压缩热冲击效应可作为有效的压裂系统11。CO2泡沫系统在地下应用中的特性已在各种尺度上进行了广泛的研究，例如砂包系统中其稳定性和粘度的特性，以及它在位移工艺3、6、12、15、16、17中的有效性。断裂水平泡沫动力学及其与多孔介质的相互作用与在紧密和断裂地层中使用泡沫直接相关的方面较少。
微流体平台可直接可视化和量化相关的微尺度过程。这些平台提供对流体动力学和化学反应的实时控制，以研究孔径尺度现象以及回收考虑1.泡沫的生成、传播、运输和动力学可以在模拟断裂系统和与从紧密地层中回收石油有关的断裂-微裂纹-基质导流通路中可视化。断裂和矩阵之间的流体交换根据几何体直接表示18从而强调简单化和现实性表现的重要性。多年来，已经开发了一些相关的微流体平台，以研究各种过程。例如，Tigglaar 和同事讨论玻璃微反应器设备的制造和高压测试，通过光纤的平面连接来测试通过连接到微反应器的玻璃毛细管的流量19.他们提出了与粘结检查、压力测试和现场反应监测相关的发现。 1H NMR 光谱。因此，对于相对较大的喷射率、用于渗透介质中复杂流体原位可视化的多相流体预生成系统而言，其平台可能并不尽如人意。Marre 和同事讨论了使用玻璃微反应器来研究高压化学和超临界流体过程的问题20.它们包括作为应力分布的有限元模拟的结果，以探索负载下模块化器件的机械性能。它们使用非超前模块化连接进行可互换的微反应器制造，硅/Pyrex微流体器件不透明;这些设备适用于化学反应工程中运动学研究、合成和生产，其中可视化不是主要问题。缺乏透明度使得这个平台不适合在代理介质中直接、就地可视化复杂流体。Paydar 和同事提出了一种使用 3D 打印构建模块化微流体原型的新方法21.这种方法似乎不适合高压应用，因为它使用光治聚合物，并且器件只能承受高达 0.4 MPa。文献中报告与破碎系统运输有关的大多数微流体实验研究侧重于环境温度和相对低压条件1.有几项研究侧重于直接观测模拟地下条件的微流体系统。例如，Jimenez-Martinez 和同事介绍了关于复杂裂缝和矩阵网络中关键孔径尺度流动和传输机制的两项研究22,23.作者在储层条件下（8.3 MPa和45°C）使用微流体研究三相系统，以提高生产效率;他们评估斯科2 用于重新刺激， 其中从以前的压裂剩余的盐水是不可混杂的 Co2 和残余碳氢化合物23.油湿硅微流体器件与油-盐水-scCO的混合相关2 在增强型石油回收 （EOR） 应用中;然而，这项工作并不直接涉及骨折的孔径尺度动力学。另一个例子是 Rognmo 等人的工作， 他研究高压的升级方法， 原位 Co2 泡沫生成24.文献中大多数利用微制造的报告都涉及 CO2-EOR 和它们通常不包括重要的制造细节。据作者所知，文献中目前缺少了用于制造用于断裂地层高压装置的系统协议。
这项工作提供了一个微流体平台，能够研究scCO2泡沫结构，气泡形状，大小和分布，在存在油的层压稳定性为EOR和水力压裂和含水层补救应用。讨论了使用光学光刻和选择性激光诱导蚀刻29（SLE）的微流体器件的设计和制造。此外，本文还描述了旨在模拟断裂紧密地层中流体的传输的断裂模式。模拟路径的范围可能从简化的模式到基于断层扫描数据的复杂微裂纹，或者提供真实裂缝几何信息的其他方法。该协议描述了使用光刻、湿蚀和热粘结的玻璃微流体器件的分步制造说明。内部开发的准直紫（UV）光源用于将所需的几何图案转移到薄薄的光刻层上，最终使用湿蚀工艺将其传输到玻璃基板。作为质量保证的一部分，蚀刻图案的特点是使用共和显微镜。作为光刻/湿蚀的替代方案，采用SLE技术创建微流体器件，并介绍了平台的比较分析。流量实验的设置包括气瓶和泵、压力控制器和传感器、流体混合器和蓄能器、微流体装置、高压不锈钢支架以及高分辨率摄像机和照明系统。最后，介绍了流量实验的代表性观测样本。

<table>
	<tbody>
		<tr>
			<td>1/4&#8221; bolts and nuts</td>
			<td></td>
			<td></td>
			<td>For fabrication of the metallic plates to sandwich the glass chip between them for thermal bonding</td>
		</tr>
		<tr>
			<td>3.45 x 3.45 mm UV LED</td>
			<td>Kingbright</td>
			<td></td>
			<td>To emitt LED light</td>
		</tr>
		<tr>
			<td>3D measuring Laser microscope</td>
			<td>OLYMPUS</td>
			<td>LEXT OLS4000</td>
			<td>To measure channel depths</td>
		</tr>
		<tr>
			<td>40 mm x 40 mm x 10 mm 12V DC Cooling Fan</td>
			<td>Uxcell</td>
			<td></td>
			<td>To cool the UV LED lights</td>
		</tr>
		<tr>
			<td>120 mm x 38 mm 24V DC Cooling Fan</td>
			<td>Uxcell</td>
			<td></td>
			<td>To cool the UV LED lights</td>
		</tr>
		<tr>
			<td>5 ml (6 ml) NORM-JECT Syringe</td>
			<td>HENKE SASS WOLF</td>
			<td>Lot #16M14CB</td>
			<td>To rinse the chip before each experiment</td>
		</tr>
		<tr>
			<td>Acetone (Certified ACS)</td>
			<td>Fisher Chemical</td>
			<td>Lot #177121</td>
			<td>For cleaning</td>
		</tr>
		<tr>
			<td>Acid/ corossion resistive tweezer</td>
			<td>TED PELLA</td>
			<td></td>
			<td>To handle the glass piece in corosive solutions</td>
		</tr>
		<tr>
			<td>Acid/solvent resistance tweezers</td>
			<td>TED PELLA, INC</td>
			<td>#53009 and #53010</td>
			<td>To handle the glass in corrosive solutions</td>
		</tr>
		<tr>
			<td>Alloy X</td>
			<td>AMERICAN SPECIAL METALS</td>
			<td>Heat Number: ZZ7571XG11</td>
			<td></td>
		</tr>
		<tr>
			<td>Ammonium hydroxide (ACS reagent)</td>
			<td>Sigma Aldrich</td>
			<td>Lot #SHBG9007V</td>
			<td>To clean the chip at the end of process</td>
		</tr>
		<tr>
			<td>AutoCAD</td>
			<td>Autodesk, San Rafael, CA</td>
			<td></td>
			<td>To design 2D patterns and 3D chips</td>
		</tr>
		<tr>
			<td>BD Etchant for PSG-SiO2 systems</td>
			<td>TRANSENE</td>
			<td>Lot #028934</td>
			<td>An improved buffered etch formulation for delineation of phosphosilica glass &#8211; SiO2 (PSG), and borosilica glass &#8211; SiO2 (BSG) systems</td>
		</tr>
		<tr>
			<td>Blank Borofloat substrate</td>
			<td>TELIC</td>
			<td>CG-HF</td>
			<td>Upper substrate for UV etching</td>
		</tr>
		<tr>
			<td>Borofloat substrate with metalizations</td>
			<td>TELIC</td>
			<td>PG-HF-LRC-Az1500</td>
			<td>Lower substrate for UV etching</td>
		</tr>
		<tr>
			<td>Capture One photo editing software</td>
			<td>Phase One</td>
			<td></td>
			<td>To Capture/Edit/Convert the pictures taken by Phase One Camera</td>
		</tr>
		<tr>
			<td>Capture station</td>
			<td>DT Scientific</td>
			<td>DT Versa</td>
			<td>To place of the chip in the field of view of the camera</td>
		</tr>
		<tr>
			<td>Carbon dioxide gas (Grade E)</td>
			<td>PRAXAIR</td>
			<td>UN 1013, CAS Number 124-38-9</td>
			<td>non-aqeous portion of foam</td>
		</tr>
		<tr>
			<td>Chromium etchant 1020</td>
			<td>TRANSENE</td>
			<td>Lot #025433</td>
			<td>High-purity ceric ammonium nitrate systems for precise, clean etching of chromium and chromium oxide films.</td>
		</tr>
		<tr>
			<td>Circulating baths with digital temperature controller</td>
			<td>PolyScience</td>
			<td></td>
			<td>To control the brine and CO2 temperatures</td>
		</tr>
		<tr>
			<td>CO2</td>
			<td>Airgas</td>
			<td>100% pure - 001013 - CAS: 124-38-9</td>
			<td>For CO2/scCO2 injection</td>
		</tr>
		<tr>
			<td>Computer</td>
			<td></td>
			<td>NVIDIA Tesla K20 Graphic Card - 706 MHz Core - 5 GB GDDR5 SDRAM - PCI Express 2.0 x16</td>
			<td>To process and visualize the images obtained via the Phase One camera</td>
		</tr>
		<tr>
			<td>Custom made high pressure glass chip holder</td>
			<td></td>
			<td></td>
			<td>To tightly hold the chip and its connections for high pressure testing</td>
		</tr>
		<tr>
			<td>Cutrain (Custom)</td>
			<td></td>
			<td></td>
			<td>To protect against UV/IR Radiations</td>
		</tr>
		<tr>
			<td>Deionized water (DI)</td>
			<td></td>
			<td></td>
			<td>For cleaning</td>
		</tr>
		<tr>
			<td>Digital camera with monochromatic 60 MP sensor</td>
			<td>Phase One</td>
			<td>IQ260</td>
			<td>Visualization system</td>
		</tr>
		<tr>
			<td>Ethanol, Anhydrous, USP Specs</td>
			<td>DECON LABORATORIES, INC.</td>
			<td>Lot #A12291505J, CAS# 64-17-5</td>
			<td>For cleaning</td>
		</tr>
		<tr>
			<td>Facepiece reusable respirator</td>
			<td>3M</td>
			<td>6502QL, Gases, Vapors, Dust, Medium</td>
			<td>To protect against volatile solution inhalation</td>
		</tr>
		<tr>
			<td>Fused Silica (UV Grade) wafer</td>
			<td>SIEGERT WAFER</td>
			<td>UV grade</td>
			<td>Glass precursor for SLE printing</td>
		</tr>
		<tr>
			<td>GIMP</td>
			<td>Open-source image processing software</td>
			<td></td>
			<td>To characterize image texture and properties</td>
		</tr>
		<tr>
			<td>Glovebox (vinyl anaerobic chamber)</td>
			<td>Coy</td>
			<td></td>
			<td>To provide a clean, dust-free environment</td>
		</tr>
		<tr>
			<td>Heated ultrasonic cleaning bath</td>
			<td>Fisher Scientific</td>
			<td></td>
			<td>To accelerate the etching process</td>
		</tr>
		<tr>
			<td>Hexamethyldisilazane (HMDS) Cleanroom&#174; MB</td>
			<td>KMG</td>
			<td>62115</td>
			<td>Primer for photoresist coating</td>
		</tr>
		<tr>
			<td>Hose (PEEK tubing)</td>
			<td>IDEX HEALTH &#38; SCIENCE</td>
			<td>Natural 1/16&#34; OD x .010&#34; ID x 5ft, Part # 1531</td>
			<td>Flow connections</td>
		</tr>
		<tr>
			<td>Hydrochloric acid, certified ACS plus</td>
			<td>Fisher Chemical</td>
			<td>Lot # 187244</td>
			<td>Solvent in RCA semiconductor cleaning protocol</td>
		</tr>
		<tr>
			<td>Hydrogen Peroxide</td>
			<td>Fisher Chemical</td>
			<td>H325-500</td>
			<td>Solvent in RCA semiconductor cleaning protocol</td>
		</tr>
		<tr>
			<td>ImageJ</td>
			<td>NIH</td>
			<td></td>
			<td>To characterize image texture and properties</td>
		</tr>
		<tr>
			<td>ISCO syringe pump</td>
			<td>TELEDYNE ISCO</td>
			<td>D-SERIES (100DM, 500D)</td>
			<td>To pump the fluids</td>
		</tr>
		<tr>
			<td>Kaiser LED light box</td>
			<td>Kaiser</td>
			<td></td>
			<td>To illuminate the chip</td>
		</tr>
		<tr>
			<td>Laser printing machine</td>
			<td>LightFab GmbH, Germany.</td>
			<td>FILL</td>
			<td>Glass-SLE chip fabrication</td>
		</tr>
		<tr>
			<td>Laser safety glasses</td>
			<td>FreeMascot</td>
			<td>B07PPZHNX4</td>
			<td>To protect against UV/IR Radiations</td>
		</tr>
		<tr>
			<td>LED Engin 5W UV Lens</td>
			<td>LEDiL</td>
			<td></td>
			<td>To emitt LED light</td>
		</tr>
		<tr>
			<td>Light Fab 3D Printer (femtosecond laser)</td>
			<td>Light Fab</td>
			<td></td>
			<td>To selectively laser Etch of fused silica</td>
		</tr>
		<tr>
			<td>LightFab 3D printer</td>
			<td>LightFab GmbH, Germany</td>
			<td></td>
			<td>To SLE print the fused silica chips</td>
		</tr>
		<tr>
			<td>MATLAB</td>
			<td>MathWorks, Inc., Natick, MA</td>
			<td></td>
			<td>To characterize image texture and properties</td>
		</tr>
		<tr>
			<td>Metallic plates</td>
			<td></td>
			<td></td>
			<td></td>
		</tr>
		<tr>
			<td>Micro abrasive sand blasters (Problast 2)</td>
			<td>VANIMAN</td>
			<td>Problast 2 &#8211; 80007</td>
			<td>To craete holes in cover plates</td>
		</tr>
		<tr>
			<td>MICROPOSIT 351 developer</td>
			<td>Dow</td>
			<td>10016652</td>
			<td>Photoresist developer solution</td>
		</tr>
		<tr>
			<td>Muffle furnace</td>
			<td>Thermo Scientific</td>
			<td>Thermolyne Type 1500</td>
			<td>Thermal bonding</td>
		</tr>
		<tr>
			<td>N2 pure research grade</td>
			<td>Airgas</td>
			<td>Research Plus - NI RP300</td>
			<td>For drying the chips in each step</td>
		</tr>
		<tr>
			<td>NMP semiconductor grade - 0.1&#956;m Filtered</td>
			<td>Ultra Pure Solutions, Inc</td>
			<td>Lot #02191502T</td>
			<td>Organic solvent</td>
		</tr>
		<tr>
			<td>Oven</td>
			<td>Gravity Convection Oven</td>
			<td>18EG</td>
			<td></td>
		</tr>
		<tr>
			<td>Phase One IQ260 with an achromatic sensor</td>
			<td>Phase One</td>
			<td>IQ260</td>
			<td>To visulize transport in microfluidic devices using an ISO 200 setting and an aperture at f/8.</td>
		</tr>
		<tr>
			<td>Photomask</td>
			<td>Fine Line Imaging</td>
			<td>20,320 DPI FILM</td>
			<td>Pattern of channels</td>
		</tr>
		<tr>
			<td>Photoresist (SU-8)</td>
			<td>MICRO CHEM</td>
			<td>Product item: Y0201004000L1PE, Lot Number: 18110975</td>
			<td>Photoresist</td>
		</tr>
		<tr>
			<td>Polarized light microscope</td>
			<td>OLYMPUS</td>
			<td>BX51</td>
			<td>Visual examination of micro channels</td>
		</tr>
		<tr>
			<td>Ports (NanoPort Assembly)</td>
			<td>IDEX HEALTH &#38; SCIENCE</td>
			<td>NanoPort Assembly Headless, 10-32 Coned, for 1/16&#34; OD, Part # N-333</td>
			<td>Connections to the chip</td>
		</tr>
		<tr>
			<td>Python</td>
			<td>Python Software Foundation</td>
			<td></td>
			<td>To characterize image texture and properties</td>
		</tr>
		<tr>
			<td>Safety face shield</td>
			<td>Sellstrom</td>
			<td>S32251</td>
			<td>To protect against UV/IR Radiations</td>
		</tr>
		<tr>
			<td>Sealing film (Parafilm)</td>
			<td>Bemis Company, Inc</td>
			<td></td>
			<td>Isolation of containers</td>
		</tr>
		<tr>
			<td>Shutter Control Software</td>
			<td>Schneider-Kreuznach</td>
			<td></td>
			<td>To adjust shutter settings</td>
		</tr>
		<tr>
			<td>Smooth ceramic plates</td>
			<td></td>
			<td></td>
			<td></td>
		</tr>
		<tr>
			<td>Stirring hot plate</td>
			<td>Corning&#174;</td>
			<td>PC-620D</td>
			<td>To heat the solutions</td>
		</tr>
		<tr>
			<td>Sulfuric acid, ACS reagent 95.0-98.0%</td>
			<td>Sigma Aldrich</td>
			<td>Lot # SHBK0108</td>
			<td>Solvent in RCA semiconductor cleaning protocol</td>
		</tr>
		<tr>
			<td>Syringe pump (Standard Infuse/Withdraw PHD ULTRA)</td>
			<td>Harvard Apparatus</td>
			<td>70-3006</td>
			<td>To saturate the chip before each experiment</td>
		</tr>
		<tr>
			<td>Torque wrench</td>
			<td>Snap-on</td>
			<td>TE25A-34190</td>
			<td>To tighten the screws</td>
		</tr>
		<tr>
			<td>UV power meter</td>
			<td>Optical Associates, Incorporated</td>
			<td>Model 308</td>
			<td>To measure the intesity of UV light</td>
		</tr>
		<tr>
			<td>UV power meter</td>
			<td>Optical Associates, Incorporated</td>
			<td>Model 308</td>
			<td>To quantify the strength of UV light</td>
		</tr>
		<tr>
			<td>UV radiation stand (LED lights)</td>
			<td></td>
			<td></td>
			<td>To transfer the pattern to glass (photoresist layer)</td>
		</tr>
		<tr>
			<td>Vaccum pump</td>
			<td>WELCH VACCUM TECHNOLOGY, INC</td>
			<td>1380</td>
			<td>To dry the chip</td>
		</tr>
		<tr>
			<td>Variable DC power supplies</td>
			<td>Eventek</td>
			<td>KPS305D</td>
			<td>To power the UV LED lights</td>
		</tr>
	</tbody>
</table>

microfluidic fabrication techniques for high-pressure testing of microscale supercritical co2 foam transport in fractured unconventional reservoirs

许多微流体平台的压力限制是断裂介质微流体实验研究中的一个重大挑战。因此，这些平台尚未被充分利用，无法直接观测断裂中的高压传输。这项工作引入了微流体平台，能够直接观察具有代理渗透介质和破碎系统的器件中的多相流。这些平台提供了解决重要和及时问题的途径，例如与 CO2捕获、利用和存储相关的问题。这项工作提供了制造技术和实验设置的详细说明，可用于分析超临界CO2（SCCO2）泡沫的行为，其结构和稳定性。这些研究提供了关于加强石油回收过程和水力裂缝在非常规储层资源回收中的作用的重要见解。本工作介绍了使用两种不同技术开发的微流体器件的比较研究：光刻/湿蚀/热粘结与选择性激光诱导蚀刻。这两种技术都使器件具有化学和物理抗性，能够耐受与感兴趣的地下系统对应的高压和温度条件。这两种技术都为高精度蚀刻微通道和能够利用的片上实验室设备提供了路径。然而，光刻/湿蚀刻能够制造具有复杂几何形状的复杂通道网络，这将是激光蚀刻技术的一项具有挑战性的任务。这项工作总结了分步光刻、湿蚀和玻璃热粘结方案，并介绍了泡沫运输的代表性观测结果，与非常规紧固和页岩层的石油回收有关。最后，本文描述了使用高分辨率单色传感器来观察 scCO2泡沫行为，其中同时观察整个渗透介质，同时保留解析小至 10 μm 的特征所需的分辨率。

本节介绍从 scCO2 泡沫流穿过与微裂纹阵列相连的主裂缝的物理观测示例。通过光刻或 SLE 制造的玻璃微流体装置放置在支架内，并放置在摄像机的视野中，该摄像机具有 6000 万像素的单色全帧传感器。 图11 说明了微流体器件的制造过程及其在实验装置中的放置。 图 12 说明了在生成/隔离前20 分钟内，UV 光刻微流体器件（4 MPa 和 40°C）?...

Watch this Scientific Journal Video about Microfluidic Fabrication Techniques for High-Pressure Testing of Microscale Supercritical CO2 Foam Transport in Fractured Unconventional Reservoirs at JoVE.co

Microfluidic Fabrication Techniques for High-Pressure Testing of Microscale Supercritical CO2 Foam Transport in Fractured Unconventional Reservoirs

本文介绍了一种协议，以及两种微流体制造技术的比较研究，即光刻/湿蚀/热粘结和选择性激光诱导蚀刻（SLE），适用于高压条件。这些技术构成直接观测储层条件下代理渗透介质和破碎系统中流体流动的有利平台。

破碎非常规储层微尺度超临界CO泡沫运输的高压 试验微流体制造技术

Pressure limitations of many microfluidic platforms have been a significant challenge in microfluidic experimental studies of fractured media. As a ...

该协议是堪萨斯大学和怀俄明大学之间的多学科协作努力。我们需要使用高压微流体测试我们的专利多电聚一体复合纳米粒子。它开始了我们的研究小组和Aryana博士的研究小组之间的合作努力，以利用他最先进的设施。我们感谢NSF为该项目的一部分提供资金，并感谢第三或恢复计划提供他们为这个项目所需的设施和支持。此外，这项工作得到了CMCUF和能源部资助的能源前沿研究中心的部分支持。该协议及其在代理复杂渗透介质及其高压条件下的应用，是怀俄明大学两个研究小组和堪萨斯大学两个研究小组合作的结果。该协议详细介绍了在没有洁净室设施的情况下，坚固微流体平台的制造程序。该平台可在高压条件下直接可视化复杂几何中的流量。所述技术可用于在玻璃基材中老化复杂的通道网络，这些通道网络模仿地下介质的结构，并承受 CO2 利用和储存过程中经历的高压条件。此方法可用于在 CCUS 上下文中提供对不渗透介质中复杂流体的交集和传输的洞察。执行此协议时，患者需要格外小心，以最大限度地降低制造过程中发生人身伤害和故障的风险。此方法的可视化演示能够有效地通信在其成功执行中至关重要的步骤。首先将适量的镀铬蚀刻溶液倒入烧杯中，然后加热至约 40 摄氏度。然后将面膜直接放在用铬和光电电阻覆盖的硅酸盐基板的一侧。通过将基板和蒙版堆栈暴露在紫外光中，将几何图案传输到照片电阻层中。从 UV 级卸下照片面罩和基板堆叠，然后取出照片面罩，将基板和开发人员溶液淹没约 40 秒。级联通过流过层水在基材顶部和所有表面至少三次冲洗基材。让基材干燥后，将其淹没在预热铬蚀中约 40 秒，从而将图案从光电阻转移到镀铬层。从溶液中去除基材，用去维化水进行级联冲洗，让其干燥。使用刷子，将几层 HMDS 涂抹在基材的未覆盖面上，并允许其干燥。在底材上涂抹一层光电阻，然后在 60 至 90 摄氏度的烤箱中放置基板 30 至 40 分钟。之后，根据所需的通道深度，将型板基板留在蚀刻溶液中，以预定的时间量。使用耐溶剂的钳子将基板从蚀刻剂中去除，然后用去离子水进行级联冲洗。将基板暴露在 NMP 溶液中，预热至 65 摄氏度约 30 分钟，以去除光抗性。级联用丙酮冲洗，然后用乙醇和去维水冲洗。将干净的基板放在铬蚀刻中，加热至约 40 摄氏度约 40 摄氏度约 1 分钟。然后使用激光扫描、共声显微镜来描述通道深度。通过将盖板与蚀刻基板对齐，标记空白硅酸盐基板上入口孔和出口孔的位置。使用微型磨料喷砂机和 50 微米氧化铝微型喷砂介质在标记位置的孔中爆破。级联用脱压水冲洗蚀刻的基材和盖板。然后将一到四个过氧化氢硫酸食人鱼溶液煮沸，将基板和盖板淹没在溶液中10分钟。冲洗基板和盖板后，将它们淹没在缓冲液中30至40秒，然后再次冲洗。接下来，在6至1至1水中将基板和盖板淹没10分钟，将过氧化氢、盐酸溶液加热至约75摄氏度。将基板和盖板紧紧压在彼此上，然后将其从溶液中拆下，级联冲洗，并将其浸入去电化水中。确保基板和盖板牢固地连接在一起，相互按压，小心地将其从水中拆下。将基板和盖板浸入 DI 水中时小心对齐，并重复该步骤，直到两者之间未发现气泡。将堆叠基板放在两个光滑 1.5 两厘米厚的玻璃陶瓷板之间，进行粘合。将玻璃陶瓷板放在两个由合金 x 制成的金属板之间。确保玻璃晶圆和陶瓷金属支架居中。手拧紧螺母，将支架放在真空室中 60 分钟，温度约为 100 摄氏度。然后从腔室中取出支架，小心地拧紧螺母。将支架放在熔炉内，并按照手稿指示执行加热程序。从熔炉中取出热粘合微流体装置，然后用水冲洗。然后用盐酸沐浴一小时。向二氧化碳和水泵的水箱中注入足够的液体进行实验，并使用注射器用表面活性剂溶液填充盐水蓄能器和流线。将饱和微流体装置放在耐压支架中，并使用 0.01 英寸内径管将进气口和出口口连接到相应的管路。提高循环浴的温度，控制盐水和二氧化碳线的温度达到所需的温度。逐步增加背压和盐水泵压力，同时保持来自背压调节器出口的持续流量。将压力增加至 7.38 兆帕斯卡并停止泵。将二氧化碳管路压力升高至7.38兆帕斯卡以上，然后打开二氧化碳阀，让与高压表面活性剂溶液混合的超临界二氧化碳流经内联混频器并产生泡沫。等待设备内部完全形成流量，通道饱和，监控出口，以了解泡沫的产生。打开相机可捕获通道内流的详细图像。二氧化碳泡沫的运输和稳定性在UV光刻微流体装置，在生成和隔离前20分钟显示在这里。多相在微裂缝和泡沫中移动，通过微裂缝产生。泡沫产生于选择性激光诱导蚀刻微流体装置中，从无流量的环境条件开始，以高流和低流量从完全发育的超临界二氧化碳泡沫开始。在生成和隔离前 20 分钟，在储层条件下对泡沫的分布和稳定性进行成像。气泡直径的分布是使用图像J.泡沫微结构的定量使用原始图像、后处理图像及其二进制等效材料进行的。尝试此实用方法时，在黄灯下仔细检查镀铬层上的图案非常重要，以确保正确传输所需的图案。这些方法的变体包括高压注油、聚合物溶液和低盐度盐水，以便通过直接可视化了解复杂流体流动的物理特性。

Research

JoVE Journal

Engineering

Microfluidic Fabrication Techniques for High-Pressure Testing of Microscale Supercritical CO2 Foam Transport in Fractured Unconventional Reservoirs

Fabrication of VB2/Air Cells for Electrochemical Testing

Fabrication of VB2/Air Cells for Electrochemical Testing

VB制作<sub&gt; 2</sub&gt; /空气电池电化学测试

A technique to investigate the properties and performance of new multi-electron metal/air battery systems is proposed and presented. A method for ...

科研

工程学

Synthesis and Microdiffraction at Extreme Pressures and Temperatures

在极端的压力和温度的合成和Microdiffraction

High pressure compounds and polymorphs are investigated for a broad range of purposes such as determine structures and processes of deep planetary ...

Fabrication and Testing of Microfluidic Optomechanical Oscillators

制造和微流控光机振荡器测试

Cavity optomechanics experiments that parametrically couple the phonon modes and photon modes have been investigated in various optical systems including ...

Thermal Measurement Techniques in Analytical Microfluidic Devices

在分析微流体装置的热测量技术

Thermal measurement techniques have been used for many applications such as thermal characterization of materials and chemical reaction detection. ...

Adsorption Device Based on a Langatate Crystal Microbalance for High Temperature High Pressure Gas Adsorption in Zeolite H-ZSM-5

基于一个Langatate体微天平的高温高压气体吸附在分子筛吸附器H-ZSM-5

We present a high-temperature and high-pressure gas adsorption measurement device based on a high-frequency oscillating microbalance (5 MHz langatate ...

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

溶剂粘接的PMMA的制备和COP微流体装置

Thermoplastic microfluidic devices offer many advantages over those made from silicone elastomers, but bonding procedures must be developed for each ...

Subsurface Defect Localization by Structured Heating Using Laser Projected Photothermal Thermography

使用激光投射光热法构造加热的地下缺陷定位

The presented method is used to locate subsurface defects oriented perpendicularly to the surface. To achieve this, we create destructively interfering ...

Fabrication of Polymer Microspheres for Optical Resonator and Laser Applications

用于光学谐振器和激光应用的聚合物微球的制造

This paper describes three methods of preparing fluorescent microspheres comprising &#960;-conjugated or non-conjugated polymers: vapor diffusion, ...

Focused Ion Beam Fabrication of LiPON-based Solid-state Lithium-ion Nanobatteries for In Situ Testing

Focused Ion Beam Fabrication of LiPON-based Solid-state Lithium-ion Nanobatteries for In Situ Testing

基于 LiPON 的固态锂离子 Nanobatteries 的聚焦离子束制备方法在原位测试中的研究

Solid-state electrolytes are a promising replacement for current organic liquid electrolytes, enabling higher energy densities and improved safety of ...

In Situ High Pressure Hydrogen Tribological Testing of Common Polymer Materials Used in the Hydrogen Delivery Infrastructure

In Situ High Pressure Hydrogen Tribological Testing of Common Polymer Materials Used in the Hydrogen Delivery Infrastructure

就地氢气输送基础设施用普通高分子材料的高压氢摩擦学试验

High pressure hydrogen gas is known to adversely affect metallic components of compressors, valves, hoses, and actuators. However, relatively little is ...

破碎非常规储层微尺度超临界CO泡沫运输的高压 试验微流体制造技术

破碎非常规储层微尺度超临界CO泡沫运输的_高压试验微流体制造技术