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DOI :
10.3791/61484-v
September 22nd, 2020
Chapters
0:05
Introduction
0:47
Preparing Coating Salts
1:56
Preparing the Electrodes
3:10
Assembly and Coating
5:03
Characterization with Electrochemistry
6:07
Results: Morphological and Electrochemical Analysis of the Metal-Composite Deposition
7:16
Conclusion
此处介绍的是无洗澡电镀协议,其中含有复合颗粒的停滞金属盐膏在高负载下被减少为金属复合材料。此方法解决了将复合材料颗粒嵌入金属基质的其他常见电镀形式(喷射、刷子、浴)所面临的挑战。
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