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DOI :
10.3791/699-v
May 12th, 2008
Chapters
0:01
Introduction
0:39
Hot Embossing I: Moulding procedure
3:05
Hot Embossing II: Trimming and milling
4:05
Bonding of a microporous membrane to the back of the microcontainers
5:11
SMART: Substrate Modification And Replication by Thermoforming
5:16
SMART Technology I: Irradiation
8:27
SMART Technology III: Track Etching
6:19
SMART Technology II: Microthermoforming
我々は、三次元細胞培養用多孔性ポリマーチップの微細加工のための2つのプロセスを提示する。最初のものは、溶剤蒸気の溶接プロセスと組み合わせて熱エンボス加工です。もう一つは製造の大幅な簡素化につながるイオン飛跡技術と組み合わせた最近開発microthermoformingプロセスを使用しています。
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