Name: scalable solution-processed fabrication strategy for high-performance, flexible, transparent electrodes with embedded metal mesh
Uploaded: 2017-06-23T15:00:00
Description: Watch this Scientific Journal Video about Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh at JoVE.com

This work was partially supported by the General Research Fund of the Research Grants Council of the Hong Kong Special Administrative Region (Award No. 17246116), the Young Scholar Program of the National Natural Science Foundation of China (61306123), the Basic Research Program-General Program from the Science and Technology Innovation Commission of Shenzhen Municipality (JCYJ20140903112959959), and the Key Research and Development Program from the Zhejiang Provincial Department of Science and Technology (2017C01058). The authors would like to thank Y.-T. Huang and S. P. Feng for their help with the optical measurements.

CAUTION: Please pay attention to electron beam safety. Please wear the correct protective glasses and clothes. Also, handle the all flammable solvents and solutions carefully.
1. Photolithography-based Fabrication of the EMTE
<ol>
	<li>Photolithography for fabricating the mesh pattern.
	<ol>
		<li>Clean FTO glass substrates (3 cm x 3 cm) with liquid detergent using cotton swab. Rinse them thoroughly with deionized (DI) water using a clean cotton swab. Further clean them usin...

<ol>
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Our fabrication method can be further modified to allow for scalability of the feature sizes and areas of the sample and for the use of various materials. The successful fabrication of sub-micrometer-linewidth (Figure 3a-3c) copper EMTEs using EBL proves that EMTE structure and key steps in LEIT fabrication, including electroplating and imprint transfer, can be reliably scaled down to a sub-micrometer range. Similarly, other large-area lithography processes, such as phase-shift photolith...

Worldwide, studies are being conducted to look for replacements for rigid transparent conductive oxides (TCOs), such as indium tin oxide and fluorine-doped tin oxide (FTO) &#64257;lms, in order to fabricate flexible/stretchable TEs to be used in future flexible/stretchable optoelectronic devices1. This necessitates novel materials with new fabrication methods.
Nanomaterials, such as graphene2, conducting polymers3,4, carbon nanotubes5, and random metal nanowire networks6,7,8,9,10,11, have been studied and have demonstrated their capabilities in flexible TEs, addressing the shortcomings of existing TCO-based TEs, including &#64257;lm fragility12, low infrared transmittance13, and low abundance14. Even with this potential, it is still challenging to attain high electrical and optical conductance without deterioration under continuous bending.
In this framework, regular metal meshes15,16,17,18,19,20 are evolving as a promising candidate and have accomplished remarkably high optical transparency and low sheet resistance, which can be tunable on demand. However, the extensive use of metal mesh-based TEs has been hindered due to numerous challenges. First, fabrication often involves the expensive, vacuum-based deposition of metals16,17,18,21. Second, the thickness may easily cause electrical short-circuiting22,23,24,25 in thin-film organic optoelectronic devices. Third, the weak adhesion with the substrate surface results in poor flexibility26,27. The abovementioned limitations have created a demand for novel metal mesh-based TE structures and scalable approaches for their fabrication.
In this study, we report a novel structure of flexible TEs that contains a metal mesh completely embedded in a polymer film. We also describe an innovative, solution-based, and low-cost fabrication approach that combines lithography, electrodeposition, and imprint transfer. FoM values as high as 15k have been achieved on sample EMTEs. Due to the embedded nature of EMTEs, remarkable chemical, mechanical, and environmental stability were observed. Furthermore, the solution-processed fabrication technique established in this work can potentially be used for the low-cost and high-throughput production of the proposed EMTEs. This fabrication technique is scalable to finer metal-mesh linewidths, larger areas, and a range of metals.

<table border="0" cellpadding="0" cellspacing="0" width="1139">
	<tbody>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Acetone</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">W332615</td>
			<td style="width:528px;">Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Isopropanol</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">190764</td>
			<td>Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">FTO Glass Substrates</td>
			<td style="width:251px;">South China Xiang S&#38;T, China</td>
			<td style="width:119px;"></td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Photoresist&#160;</td>
			<td style="width:251px;">Clariant, Switzerland</td>
			<td style="width:119px;">54611L11</td>
			<td>AZ 1500 Positive tone resist (20cP)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">UV Mask Aligner&#160;</td>
			<td style="width:251px;">Chinese Academy of Sciences, China</td>
			<td>URE-2000/35</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Photoresist Developer&#160;</td>
			<td style="width:251px;">Clariant, Switzerland</td>
			<td style="width:119px;">184411</td>
			<td>AZ 300 MIF Developer</td>
		</tr>
		<tr height="42">
			<td height="42" style="height:42px;width:241px;">Cu, Ag, Au, Ni, and Zn Electroplating solutions</td>
			<td style="width:251px;">Caswell, USA</td>
			<td style="width:119px;"></td>
			<td>Ready to use solutions (PLUG N&#39; PLATE)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Keithley 2400 SourceMeter</td>
			<td style="width:251px;">Keithley, USA</td>
			<td style="width:119px;">41J2103</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">COC Plastic Films</td>
			<td style="width:251px;">TOPAS, Germany</td>
			<td style="width:119px;">F13-19-1</td>
			<td>Grade 8007 (Glass transition temperature: 78 &#176;C)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Hydraulic Press&#160;</td>
			<td style="width:251px;">Specac Ltd., UK</td>
			<td style="width:119px;">GS15011</td>
			<td>With low tonnage kit ( 0-1 ton guage)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Temperature Controller&#160;</td>
			<td style="width:251px;">Specac Ltd., UK</td>
			<td style="width:119px;">GS15515</td>
			<td>Water cooled heated platens and controller</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Chiller&#160;</td>
			<td style="width:251px;">Grant Instruments, UK</td>
			<td style="width:119px;">T100-ST5</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Polymethyl Methacrylate (PMMA)</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">200336</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Anisole</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">96109</td>
			<td>Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">EBL Setup</td>
			<td style="width:251px;">Philips, Netherlands</td>
			<td style="width:119px;">FEI XL30</td>
			<td>Scanning electron microscope equipped with a JC Nabity pattern generator&#160;&#160;</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Isopropyl Ketone&#160;</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">108-10-1</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Silver Paste</td>
			<td style="width:251px;">Ted Pella, Inc, USA</td>
			<td style="width:119px;">16031</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">UV&#8211;Vis Spectrometer&#160;</td>
			<td style="width:251px;">Perkin Elmer, USA</td>
			<td style="width:119px;">L950</td>
			<td></td>
		</tr>
	</tbody>
</table>

scalable solution-processed fabrication strategy for high-performance, flexible, transparent electrodes with embedded metal mesh

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a polymer film. This paper also presents a low-cost, vacuum-free fabrication method for this novel TE; the approach combines lithography, electroplating, and imprint transfer (LEIT) processing. The embedded nature of the EMTEs offers many advantages, such as high surface smoothness, which is essential for organic electronic device production; superior mechanical stability during bending; favorable resistance to chemicals and moisture; and strong adhesion with plastic film. LEIT fabrication features an electroplating process for vacuum-free metal deposition and is favorable for industrial mass production. Furthermore, LEIT allows for the fabrication of metal mesh with a high aspect ratio (i.e., thickness to linewidth), significantly enhancing its electrical conductance without adversely losing optical transmittance. We demonstrate several prototypes of flexible EMTEs, with sheet resistances lower than 1 &#937;/sq and transmittances greater than 90%, resulting in very high figures of merit (FoM) &#8211; up to 1.5 x 104 &#8211; which are amongst the best values in the published literature.

Figure 1 displays the schematic and fabrication flowchart of the EMTE samples. As presented in Figure 1a, the EMTE consists of a metal mesh fully embedded in a polymer film. The upper face of the mesh is on the same level as the substrate, displaying a generally smooth platform for subsequent device production. The fabrication technique is schematically explained in Figure 1b-e. Afte...

Watch this Scientific Journal Video about Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh at JoVE.com

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

This protocol describes a solution-based fabrication strategy for high-performance, flexible, transparent electrodes with fully-embedded, thick metal mesh. Flexible transparent electrodes fabricated by this process demonstrate among the highest reported performances, including ultra-low sheet resistance, high optical transmittance, mechanical stability under bending, strong substrate adhesion, surface smoothness, and environmental stability.

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a ...

The overall goal of this procedure is to use a solution-based fabrication process that combines lithography, electric deposition, and imprint transfer to produce a high performance, flexible, transparent conductive film with a self-anchored, fully embedded micro metal mesh. This mesh can help address key challenges facing future metal-mesh based flexible electronic devices, such as non-flat surface typography, low fabrication throughput, and high manufacturing cost. Embedded metal mesh provides several advantages, such as crucial self-smoothness, mechanical stability, and a high-burning stress, strong adhesion to the flexible substrate, and resistance against moisture, oxygen, and chemicals.Our process will place this by based the metal deposition with solution-based electric deposition, and is simple for pursuing high throughput, like volume and low cost production. My group helped Dr.Wendy Lee's group to test the dimensional stabilities of metal-mesh fabrication process by patterning 400 nanometer metal-mesh with our home built, electro beam lithography system. My assistant Xiong Ze is going to demonstrate the electro beam patterning process.To begin EMTE fabrication, clean a three centimeter by three centimeter piece of flooring-doped tin oxide coated glass with liquid detergent and a cotton swab. Thoroughly rinse the glass substrate with deionized water, and remove traces of detergent with another swab. Sonicate the FTO glass in isopropanol for 30 seconds at 40 kilohertz.Then dry the clean glass with compressed air. Next, place the clean, dry FTO glass in a spin-coater and apply 100 microliters of positive photo-resist. Spin-coat the glass at 4, 000 RPM for 60 seconds to produce a 1.8 micron-thick film.Bake the coated glass at 100 degrees Celsius for 50 seconds. Cover the coated glass with a mesh-pattern mask, and expose the photo-resist to sufficient UV light to achieve a radiant fluence of 20 millijoules per square centimeter. Then, immerse the coated glass in the appropriate developer for 50 seconds to remove the exposed photo-resist.Rinse the sample in deionized water and dry it under a stream of compressed air. Next, place 100 miloliters of acquiesce copper electro-plating solution in a 250 milliliter beaker. Immerse the sample in the plating solution.And connect it to the negative terminal of a two-electrode electro-deposition apparatus. Then, connect a copper metal bar to the positive terminal of the apparatus. Apply a constant five milliamp current to achieve a current density of three milliamps per square centimeter for 15 minutes, to deposit a 1.5 micron thick layer of copper on the sample.The croqueting is the critical step in the fabrication. Current density and electroplating time effect the morphology of the metal mesh and the final performance, and should be tested and optimized with your own samples. Thoroughly rinse the electroplated sample with deionized water, and dry it under a stream of compressed air.Immerse the sample in acetone for five minutes to dissolve the remaining photo resist to leave a bare metal mesh atop the FTO glass surface. Rinse and dry the sample with deionized water and compressed air. Next, place the sample on the platen of a hydraulic press with the metal mesh facing up.Cover the sample with a 100 micron thick cyclic olefin copolymer film with a glass transition temperature of 78 degrees Celsius. Heat the platens to 100 degrees Celsius, and then apply 15 millipascals of imprint pressure to the sample for five minutes. Pull the platens to 40 degrees Celsius before releasing the imprint pressure.Pressure and temperature are important prime interests in the imprint transfer step. Make sure your imprint and pressure is uniform and high enough for complete transfer. The temperature should be approximately 20 degrees higher than the substrate material glass transition temperature.Carefully peel the polymer film with the embedded mesh from the FTO glass surface to obtain the EMTE. To begin preparing a submicron EMTE, clean a three centimeter by three centimeter piece of FTO glass with liquid detergent and deionized water followed by sonication in isopropanol. Place the clean, dry FTO glass in a spin-coater, and apply 100 microliters of 4%by weight PMMA in anastole.Spin-coat the glass at 2500 RPM for 60 seconds to produce a 150 nanometer thick film. Bake the film at 170 degrees Celsius for 30 minutes, then start the electron beam lithography system and prepare a mesh pattern with a pattern generator. Place the sample in the electron beam lithography system and run the patterning process.Develop the PMMA by immersion in a one to three mixture of methyl-isopropyl-ketone and isopropanol for 60 seconds. Rinse the patterned sample with deionized water and dry it under a stream of compressed air. Next, place the patterned sample in copper-electroplating solution and connect the sample to the negative terminal of a two electrode electrodeposition apparatus.Connect the positive terminal to a copper, metal bar. Apply a constant current to achieve a current density of three milliamps per square centimeter for two minutes to plate 200 nanometers of copper on the sample. Rinse the sample with deionized water and immerse the sample in acetone for five minutes to dissolve the PMMA.Next, place the sample on the platen of a hydraulic press. Cover the sample with a 100 micron thick cyclic olefin co-polymer film with a glass transition temperature of 78 degrees Celsius. Heat the platens to 100 degrees Celsius and apply 15 millipascals of imprint pressure for five minutes.Cool the platens to 40 degrees Celsius before releasing the pressure. Carefully peel the film from the FTO glass to obtain the submicron EMTE. To begin sheet resistance measurements, first spread silver past on opposite edges of the EMTE and allow the paste to dry.Place the four probes of the sheet resistance measurement device on the lines of silver paste per the device manufacturer's instructions. Measure and record the sheet resistance. To perform optical transmission measurements, first place the EMTE on the sample holder of a calibrated UV vis spectrophotometer set to 100%transmittance.Align the sample perpendicular to the beam. Acquire a transmission spectrum of the EMTE to assess the electro-transparency. Copper EMTEs were fabricated with various grid patterns to evaluate the effect of the grid geometry on the electrode properties.The ratio of electrical conductance to optical conductance for copper EMTEs at 550 nanometers was over 1.5 times 10 to the fourth. Thicker meshes corresponded to lower optical transmittance and sheet resistance. Larger pitches corresponded to greater sheet resistance and transmittance.EMTEs were fabricated with various metals using a 50 micron pitch mesh, all of which showed flat, featureless transmittance spectra. With the same relationship between mesh thickness and transmittance, the transmittance and sheet resistance can first be tuned by adjusting the geometry and composition of the mesh. The sheet resistance of copper EMTEs was evaluated with respect to compressive and tensile bending tests.No significant change was observed for four millimeter and five millimeter compressive bending tests. Sheet resistance is gradually increased with tensile bending tests. No degradation and sheet resistance was observed over 24 hours of exposure to water isopropanol or a hot and humid atmosphere.New students can learn this technique within a few days. Once mastered, the whole fabrication process can be done in two to three hours and the equipment is ready. This technique paves the way for using scalable solution process fabrication methods to develop novel micro and nano structured devices, such as our self-anchored, high aspect ratio micro metal-mesh, embedded in flexible substrate.Many applications such as touch panels, displace sensors, and solar cells can benefit from our high performance, embedded metal mesh transparent electrodes. After watching this video, you should have a good understanding of how to use this solution-based fabrication process to produce metal-mesh transparent actuals. Thanks for watching, we're open to collaborations.

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Fabrication of Nano-engineered Transparent Conducting Oxides by Pulsed Laser Deposition

Nanosecond Pulsed Laser Deposition (PLD) in the presence of a background gas allows the deposition of metal oxides with tunable morphology, structure, density and stoichiometry by a proper control of the plasma plume expansion dynamics. Such versatility can be exploited to produce nanostructured films from compact and dense to nanoporous characterized by a hierarchical assembly of nano-sized clusters. In particular we describe the detailed methodology to fabricate two types of Al-doped ZnO (AZO) films as transparent electrodes in photovoltaic devices: 1) at low O2 pressure, compact films with electrical conductivity and optical transparency close to the state of the art transparent conducting oxides (TCO) can be deposited at room temperature, to be compatible with thermally sensitive materials such as polymers used in organic photovoltaics (OPVs); 2) highly light scattering hierarchical structures resembling a forest of nano-trees are produced at higher pressures. Such structures show high Haze factor (&gt;80%) and may be exploited to enhance the light trapping capability. The method here described for AZO films can be applied to other metal oxides relevant for technological applications such as TiO2, Al2O3, WO3 and Ag4O4.

We describe the experimental method to deposit nanostructured oxide thin films by nanosecond Pulsed Laser Deposition (PLD) in the presence of a background gas. By using this method Al-doped ZnO (AZO) films, from compact to hierarchically structured as nano-tree forests, can be deposited.

Nanosecond Pulsed  Laser Deposition (PLD) in the presence of a background gas allows the deposition  of metal oxides with tunable morphology, structure, ...

Picoinjection of Microfluidic Drops Without Metal Electrodes

Existing methods for picoinjecting reagents into microfluidic drops require metal electrodes integrated into the microfluidic chip. The integration of these electrodes adds cumbersome and error-prone steps to the device fabrication process. We have developed a technique that obviates the needs for metal electrodes during picoinjection. Instead, it uses the injection fluid itself as an electrode, since most biological reagents contain dissolved electrolytes and are conductive. By eliminating the electrodes, we reduce device fabrication time and complexity, and make the devices more robust. In addition, with our approach, the injection volume depends on the voltage applied to the picoinjection solution; this allows us to rapidly adjust the volume injected by modulating the applied voltage. We demonstrate that our technique is compatible with reagents incorporating common biological compounds, including buffers, enzymes, and nucleic acids.

We have developed a technique for picoinjecting microfluidic drops that does not require metal electrodes. As such, devices incorporating our technique are simpler to fabricate and to use.

Existing methods for picoinjecting reagents into microfluidic drops require metal electrodes integrated into the microfluidic chip. The integration of ...

Research and Development of High-performance Explosives

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance tests to verify theoretical calculations. For newly developed formulations, the process begins with small-scale mixes, thermal testing, and impact and friction sensitivity. Only then do subsequent larger scale formulations proceed to detonation testing, which will be covered in this paper. Recent advances in characterization techniques have led to unparalleled precision in the characterization of early-time evolution of detonations. The new technique of Photonic Doppler Velocimetry (PDV) for the measurement of detonation pressure will be shared and compared with traditional fiber-optic detonation velocity and plate-dent calculation of detonation pressure. In particular, the role of aluminum in explosive formulations will be discussed. Recent developments led to the development of explosive formulations that result in reaction of aluminum very early in the detonation product expansion. This enhanced reaction leads to changes in the detonation velocity and pressure due to reaction of the aluminum with oxygen in the expanding gas products.

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance tests to verify theoretical calculations. This paper will share typical development tests associated with the measurement of detonation velocity and detonation pressure.

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance ...

Fabrication of Fully Solution Processed Inorganic Nanocrystal Photovoltaic Devices

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal inks. For the photoactive absorber layer, colloidal CdTe and CdSe nanocrystals (3-5 nm) are synthesized using an inert hot injection technique and cleaned with precipitations to remove excess starting reagents. Similarly, gold nanocrystals (3-5 nm) are synthesized under ambient conditions and dissolved in organic solvents. In addition, precursor solutions for transparent conductive indium tin oxide (ITO) films are prepared from solutions of indium and tin salts paired with a reactive oxidizer. Layer-by-layer, these solutions are deposited onto a glass substrate following annealing (200-400 &#176;C) to build the nanocrystal solar cell (glass/ITO/CdSe/CdTe/Au). Pre-annealing ligand exchange is required for CdSe and CdTe nanocrystals where films are dipped in NH4Cl:methanol to replace long-chain native ligands with small inorganic Cl- anions. NH4Cl(s) was found to act as a catalyst for the sintering reaction (as a non-toxic alternative to the conventional CdCl2(s) treatment) leading to grain growth (136&#177;39 nm) during heating. The thickness and roughness of the prepared films are characterized with SEM and optical profilometry. FTIR is used to determine the degree of ligand exchange prior to sintering, and XRD is used to verify the crystallinity and phase of each material. UV/Vis spectra show high visible light transmission through the ITO layer and a red shift in the absorbance of the cadmium chalcogenide nanocrystals after thermal annealing. Current-voltage curves of completed devices are measured under simulated one sun illumination. Small differences in deposition techniques and reagents employed during ligand exchange have been shown to have a profound influence on the device properties. Here, we examine the effects of chemical (sintering and ligand exchange agents) and physical treatments (solution concentration, spray-pressure, annealing time and annealing temperature) on photovoltaic device performance.

This protocol describes the synthesis and solution deposition of inorganic nanocrystals layer by layer to produce thin film electronics on non-conductive surfaces. Solvent-stabilized inks can produce complete photovoltaic devices on glass substrates via spin and spray coating following post-deposition ligand exchange and sintering.

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal ...

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

This paper reports an array-designed C84-embedded Si substrate fabricated using a controlled self-assembly method in an ultra-high vacuum chamber. The characteristics of the C84-embedded Si surface, such as atomic resolution topography, local electronic density of states, band gap energy, field emission properties, nanomechanical stiffness, and surface magnetism, were examined using a variety of surface analysis techniques under ultra, high vacuum (UHV) conditions as well as in an atmospheric system. Experimental results demonstrate the high uniformity of the C84-embedded Si surface fabricated using a controlled self-assembly nanotechnology mechanism, represents an important development in the application of field emission display (FED), optoelectronic device fabrication, MEMS cutting tools, and in efforts to find a suitable replacement for carbide semiconductors. Molecular dynamics (MD) method with semi-empirical potential can be used to study the nanoindentation of C84-embedded Si substrate. A detailed description for performing MD simulation is presented here. Details for a comprehensive study on mechanical analysis of MD simulation such as indentation force, Young&#39;s modulus, surface stiffness, atomic stress, and atomic strain are included. The atomic stress and von-Mises strain distributions of the indentation model can be calculated to monitor deformation mechanism with time evaluation in atomistic level.

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

This paper reports the nanomaterial fabrication of a fullerene Si substrate inspected and verified by nanomeasurements and molecular dynamic simulation.

This paper reports an array-designed C84-embedded Si substrate fabricated using a controlled self-assembly method in an ultra-high vacuum chamber. The ...

A High Performance Impedance-based Platform for Evaporation Rate Detection

This paper describes the method of a novel impedance-based platform for the detection of the evaporation rate. The model compound hyaluronic acid was employed here for demonstration purposes. Multiple evaporation tests on the model compound as a humectant with various concentrations in solutions were conducted for comparison purposes. A conventional weight loss approach is known as the most straightforward, but time-consuming, measurement technique for evaporation rate detection. Yet, a clear disadvantage is that a large volume of sample is required and multiple sample tests cannot be conducted at the same time. For the first time in literature, an electrical impedance sensing chip is successfully applied to a real-time evaporation investigation in a time sharing, continuous and automatic manner. Moreover, as little as 0.5 ml of test samples is required in this impedance-based apparatus, and a large impedance variation is demonstrated among various dilute solutions. The proposed high-sensitivity and fast-response impedance sensing system is found to outperform a conventional weight loss approach in terms of evaporation rate detection.

This paper presents an impedance-based apparatus for evaporation rate detection of solutions. It offers clear advantages over a conventional weight loss approach: a fast response, high-sensitivity detection, a small sample requirement, multiple sample measurements, and easy disassembly for cleaning and reuse purposes.

This paper describes the method of a novel impedance-based platform for the detection of the evaporation rate. The model compound hyaluronic acid was ...

Detecting the Water-soluble Chloride Distribution of Cement Paste in a High-precision Way

To improve the accuracy of the chloride distribution along the depth of cement paste under cyclic wet-dry conditions, a new method is proposed to obtain a high-precision chloride profile. Firstly, paste specimens are molded, cured, and exposed to cyclic wet-dry conditions. Then, powder samples at different specimen depths are grinded when the exposure age is reached. Finally, the water-soluble chloride content is detected using a silver nitrate titration method, and chloride profiles are plotted. The key to improving the accuracy of the chloride distribution along the depth is to exclude the error in the powderization, which is the most critical step for testing the distribution of chloride. Based on the above concept, the grinding method in this protocol can be used to grind powder samples automatically layer by layer from the surface inward, and it should be noted that a very thin grinding thickness (less than 0.5 mm) with a minimum error less than 0.04 mm can be obtained. The chloride profile obtained by this method better reflects the chloride distribution in specimens, which helps researchers to capture the distribution features that are often overlooked. Furthermore, this method can be applied to studies in the field of cement-based materials, which require high chloride distribution accuracy.

A protocol for obtaining a water-soluble chloride profile by using a high precision milling method is presented.

To improve the accuracy of the chloride distribution along the depth of cement paste under cyclic wet-dry conditions, a new method is proposed to obtain a ...

Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of nanowires. DEP is used for nanowire analysis, characterization, and for solution-based fabrication of semiconducting devices. The method works by applying an alternating electric field between metallic electrodes. The nanowire formulation is then dropped onto the electrodes which are on an inclined surface to create a flow of the formulation using gravity. The nanowires then align along the gradient of the electric field and in the direction of the liquid flow. The frequency of the field can be adjusted to select nanowires with superior conductivity and lower trap density. 
In this work, flow-assisted DEP is used to create nanowire field effect transistors. Flow-assisted DEP has several advantages: it allows selection of nanowire electrical properties; control of nanowire length; placement of nanowires in specific areas; control of orientation of nanowires; and control of nanowire density in the device. 
The technique can be expanded to many other applications such as gas sensors and microwave switches. The technique is efficient, quick, reproducible, and it uses a minimal amount of dilute solution making it ideal for the testing of novel nanomaterials. Wafer scale assembly of nanowire devices can also be achieved using this technique, allowing large numbers of samples for testing and large-area electronic applications.

In this paper, flow assisted dielectrophoresis is demonstrated for the self-assembly of nanowire devices. The fabrication of a silicon nanowire field effect transistor is shown as an example.

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of ...

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, but several challenging points remain, such as a low absorption efficiency due to a thin active layer and low flexibility. We present an advanced method to fabricate a flexible phototransistor array with an improved electrical performance. The outstanding electrical performance is driven by a low dark current owing to deep impurity doping. Stretchable and flexible metal interconnectors simultaneously offer electrical and mechanical stabilities in a highly deformed state. The protocol explicitly describes the fabrication process of the phototransistor using a thin silicon membrane. By measuring I-V characteristics of the completed device in deformed states, we demonstrate that this approach improves the mechanical and electrical stabilities of the phototransistor array. We expect that this approach to a flexible phototransistor can be widely used for the applications of not only next-generation imaging systems/optoelectronics but also wearable devices such as tactile/pressure/temperature sensors and health monitors.

We present a detailed method to fabricate a deformable lateral NIPIN phototransistor array for curved image sensors. The phototransistor array with an open mesh form, which is composed of thin silicon islands and stretchable metal interconnectors, provides flexibility and stretchability. The parameter analyzer characterizes the electrical property of the fabricated phototransistor.

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, ...

Fabrication of Superhydrophobic Metal Surfaces for Anti-Icing Applications

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in industry. The wettability of the produced surface was analyzed by bouncing drop experiments and the topography was analyzed by confocal microscopy. In addition, we show various methodologies to measure its durability and anti-icing properties. Superhydrophobic surfaces hold a special texture that must be preserved to keep their water-repellency. To fabricate durable surfaces, we followed two strategies to incorporate a resistant texture. The first strategy is a direct incorporation of roughness to the metal substrate by acid etching. After this surface texturization, the surface energy was decreased by silanization or fluoropolymer deposition. The second strategy is the growth of a ceria layer (after surface texturization) that should enhance the surface hardness and corrosion resistance. The surface energy was decreased with a stearic acid film.
The durability of the superhydrophobic surfaces was examined by a particle impact test, mechanical wear by lateral abrasion, and UV-ozone resistance. The anti-icing properties were explored by studying the ability to repeal subcooled water, freezing delay, and ice adhesion.

We illustrate several methodologies to produce superhydrophobic metal surfaces and to explore their durability and anti-icing properties.

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in ...