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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

DOI :

10.3791/50735-v

December 23rd, 2013

December 23rd, 2013

7,164 Views

1Electrical Engineering Department, Polytechnique Montreal

In this article we describe different techniques for microfluidic rapid prototyping platforms. The proposed techniques are based on ultraviolet (UV) sensitive and temperature curing epoxies, polydimethylsiloxane (PDMS) based tubing, wire-bonding, and anisotropic adhesive films. The assembling procedures presented are developed for both one-time use devices as well as reusable microfluidic systems.

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High Throughput

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