January 16th, 2019
•Microstructurally small fatigue crack growth behavior is investigated using a novel methodological approach combining crack growth rate measurement and strain-field analysis to reveal the cumulative deformation field at sub-grain level.
Tags
Related Videos
Concurrent Quantitative Conductivity and Mechanical Properties Measurements of Organic Photovoltaic Materials using AFM
Measuring Material Microstructure Under Flow Using 1-2 Plane Flow-Small Angle Neutron Scattering
Real-Time DC-dynamic Biasing Method for Switching Time Improvement in Severely Underdamped Fringing-field Electrostatic MEMS Actuators
Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
Ultrasonic Fatigue Testing in the Tension-Compression Mode
Uncoupling Coriolis Force and Rotating Buoyancy Effects on Full-Field Heat Transfer Properties of a Rotating Channel
Carrier Lifetime Measurements in Semiconductors through the Microwave Photoconductivity Decay Method
Intermediate Strain Rate Material Characterization with Digital Image Correlation
Crack Monitoring in Resonance Fatigue Testing of Welded Specimens Using Digital Image Correlation
Calibration of Vector Network Analyzer for Measurements in Radio Frequency Propagation Channels
ABOUT JoVE
Copyright © 2024 MyJoVE Corporation. All rights reserved