The authors are grateful for the financial support from Ministry of Science and Technology.

1. Préparation de Silver Précurseur encre <ol><li> Ajouter 1,85 g de diéthanolamine (DEA) en 3,15 ml d&#39;eau déminéralisée. </li><li> Dissoudre 0,15 g de nitrate d&#39;argent dans 5 ml d&#39;eau désionisée. </li><li> Mélanger la solution aqueuse de nitrate d&#39;argent avec la DEA à un ratio de 1: 1 en volume d&#39;avoir précurseur d&#39;encre 10 ml d&#39;argent juste avant l&#39;utilisation. </li></ol> 2. Fabrication de étirables conducteur mince Films <ol><li> Préparation de l&#39;encre AgNW <ol><li> Diluer 2 ml de 0,5% en poids dans l&#39;isopropanol AgNWs avec 18 ml d&#39;eau déminéralisée. </li><li> Placez-le dans un bain à ultrasons pendant 30 secondes à 25 ° C. </li></ol></li><li> Fabrication de films minces par AgNW revêtement auto-pulvérisation <ol><li> Couper la norme des lames de microscope en morceaux de taille égale à 1 × 2,5 cm 2. Préparer 16 morceaux de verre de cette taille et les nettoyer avec un tissu de nettoyage de lentille éthanol-mouillé. </li><li> Transfert 16 ml AgNW encre (de la section 1) dans la peinture tasse de airbrUSH avec une pipette. Monter l&#39;aérographe sur un robot commandé par ordinateur pour le revêtement par pulvérisation. </li><li> Placez 8 de morceaux de verre dans un arrangement 4 × 2 sur la scène et les fixer avec des bandes résistantes à la chaleur. La superficie totale de tous les substrats de verre sur la scène est de 4 × 5 cm 2. </li><li> Régler la pression de travail et la température étape de chauffage à 3 bar et 100 ° C, séparément. </li><li> Ouvrez le logiciel de commande du robot. Cliquez pour sélectionner la séquence de commande de mouvement de la brosse dans la colonne &quot;Commande&quot;. Tapez les paramètres d&#39;entrée nécessaires pour terminer le programme d&#39;auto-pulvérisation, comme le montre la figure 1. Exécutez le programme. Remarque: La commande &quot;Line Speed&quot; rend le Voyage de l&#39;aérographe à 200 mm / sec. Par la commande &quot;Brush Espace&quot;, l&#39;aérographe va et vient dans la direction du côté court du tableau de substrat de verre tandis que les mouvements de la scène le long de la direction du côté long et l&#39;espace entre deux coups est de 5 mm. La «ligne de départ» et «Line End &quot;commandes déterminent les positions des points de l&#39;opération d&#39;auto-pulvérisation départ et de fin. Les positions d&#39;entre eux dépendent de la position de l&#39;ensemble de substrat de verre sur la scène. La&quot; commande Attendre Point &quot;fixe un temps d&#39;attente de 20 secondes dans la fin de chaque cycle de l&#39;auto-pulvérisation. &quot;Loop Adresse&quot; commande permet à plusieurs cycles de pulvérisation et le nombre de cycles d&#39;auto-pulvérisation est 15 fois. instruction plus détaillée des commandes peut être trouvée dans le protocole du fabricant. </li><li> Changez le nombre de cycles d&#39;auto-pulvérisation dans 30 fois. Répétez les étapes 2.2.3 - 2.2.5 pour fabriquer AgNW films minces de 30 cycles de pulvérisation. </li><li> Après revêtement par pulvérisation, cuire nanofils films minces d&#39;argent sur une plaque chaude à 120 ° C pendant 10 min. </li></ol></li><li> Les processus de soudure chimique <ol><li> Fonte 400 ul de précurseur encre argent sur chaque nanofil d&#39;argent par pulvérisation un film mince revêtu sur le substrat de verre. </li><li> Cuire les films sur une plaque chaude à 100 &amp;# 176; C pendant 40 min. </li><li> Rincer les revêtements réactifs soigneusement avec de l&#39;eau déminéralisée pour éliminer les résidus de produits chimiques réactifs et air-sécher les films enduits. </li></ol></li><li> Cast-le pelage processus <ol><li> Fonte 200 ul PU disponible dans le commerce d&#39;émulsion à base d&#39;eau sur chaque film mince composite de nano-argent sur le substrat de verre. </li><li> Air-sécher les films pendant 10 heures pour assurer la pleine solidification. </li><li> Décoller les échantillons de substrats de verre comme composites films autoportants. </li></ol></li></ol> 3. Caractérisation <ol><li> Test Stretching <ol><li> Tournez sur la scène linéaire motorisé et attendre 10 minutes pour que la machine se réchauffer. </li><li> Ouvrez le logiciel de commande de l&#39;étage. Définir le nombre des étapes mobiles du moteur en 8000. Cliquez sur &quot;X +&quot; dans le logiciel de commande de l&#39;étage pour déplacer la scène mobile jusqu&#39;à ce qu&#39;il touche la scène fixe et cliquez sur «SET 0&quot; pour régler la position de til scène mobile à zéro dans le logiciel de commande de l&#39;étage. Remarque: La scène mobile se déplace 0,00125 mm en une seule étape du moteur. Par exemple, la phase mobile se déplace de 1 cm si le moteur se déplace de 8000 mesures. Le signe plus de «X +» signifie que les mouvements de scène mobile dans la direction de rapprochement scène fixe tandis que le signe négatif de «X» signifie déplacer loin de la scène fixe. </li><li> Cliquez sur &quot;X&quot; pour déplacer la scène mobile de laisser 1 cm d&#39;espace entre la scène mobile et fixe. Fixez les deux extrémités de l&#39;échantillon avec les titulaires filaires sur le stade. De ce fait, la zone d&#39;étirage de l&#39;échantillon est de 1 x 1 cm 2. La configuration de la machine d&#39;étirage est représentée sur la figure 2. </li><li> Utilisez les pinces crocodiles, qui sont les autres extrémités des câbles de câblage pour les détenteurs de la scène (Figure 2), de se connecter au multimètre numérique pour les mesures de résistance. </li><li> Définir le nombre des étapes de mobile du moteur de 800. Cliquez sur &quot;X&quot; pour move le mobile une étape mm (souche de 10%) de l&#39;étage fixe pour étirer l&#39;échantillon et enregistrer la résistance. Répétez cette étape jusqu&#39;à ce que la résistance augmente de façon significative (~ souche 150%). </li></ol></li><li> Essai de stabilité <ol><li> Préparer le test comme dans les étapes 3.1.2 - 3.1.4. </li><li> Ouvrez le logiciel de multimètre numérique. Branchez le multimètre numérique à l&#39;ordinateur. Appuyez longuement sur le bouton &quot;REL Δ&quot; sur le multimètre numérique jusqu&#39;à ce qu&#39;une icône de l&#39;ordinateur apparaît dans le coin supérieur gauche de l&#39;écran multimètre numérique. Cliquez sur &quot;Connexion USB&quot; dans le logiciel de multimètre numérique et le logiciel commence à enregistrer résistances mesurées. </li><li> Entrez les commandes dans les champs de saisie dans le panneau du logiciel de contrôle de la phase de programme comme le montre la figure 3 La commande. &quot;: U-4000&quot; signifie pour déplacer la scène mobile de 4000 à quelques pas de la scène fixe alors que la commande &quot;: U4000&quot; moyens pour déplacer la scène mobile 4000 pas en arrièreà l&#39;étage fixe (4000 pour la souche de 50%, 8.000 pour 100% de déformation). Le nombre de cycles d&#39;étirement est de 15 fois. La vitesse par défaut de la scène mobile est de 1 mm / sec. </li><li> Cliquez sur &quot;Exécuter 123&quot; dans le panneau du logiciel de contrôle de la phase de programme à exécuter le programme automatique. Les mouvements de scène mobile dans un mouvement alternatif à étirer l&#39;échantillon avec des cycles d&#39;allongement de forme d&#39;onde triangulaire. </li><li> Cliquez sur l&#39;icône d&#39;enregistrement dans le logiciel de multimètre et exporter les données de profils de réponse de la résistance comme un fichier .xls. </li></ol></li><li> Test de l&#39;éclairage LED <ol><li> Préparer le test comme dans les étapes 3.1.2 - 3.1.3. Connecter les détenteurs câblés en série avec une LED et une alimentation. </li><li> Allumez l&#39;alimentation. Augmenter la tension à 9 V pour allumer la LED. </li><li> Cliquez sur &quot;X&quot; pour déplacer l&#39;étape 1 mm (10% de déformation) mobile éloigné de la scène fixe pour étirer l&#39;échantillon et prendre une photo pour enregistrer la luminosité de la LED. Répétez cette étape jusqu&#39;à ce que lalumière de LED devient faible. Veillez à ce que l&#39;exposition automatique de l&#39;appareil doit être éteint en prenant des photos. </li></ol></li></ol>

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The authors have nothing to disclose.

Le processus de soudage chimique peut aider à renforcer le contact entre les nanofils d&#39;argent. Comme le montre la figure 4b, les jonctions fil / de fils sont recouverts d&#39;argent après l&#39;application de l&#39;encre d&#39;argent par pulvérisation réactive sur le film mince revêtu AgNW. La récupération de l&#39;argent repose fortement sur ​​le formaldéhyde généré par la dégradation de DEA, et ainsi le processus de brasage ou de réduction de l&#39;argent peut être accélérée ...

Appareils déformables avec une grande extensibilité ont été identifiés comme des pièces essentielles à la réalisation de l&#39;électronique portable et portables de la prochaine génération. 1 Ces appareils extensibles montrent non seulement une grande flexibilité que ces appareils sur des feuilles de plastique, 2, 3, mais aussi présenter une excellente la performance dans des conditions d&#39;étirement ou une torsion grave 4. Pour réaliser les électronique élastique, matériaux avec grande performance électrique sous une déformation importante est nécessaire. Les récents progrès dans les sciences des matériaux ont montré la possibilité de synthétiser ces matériaux fonctionnels et les ont utilisées pour concevoir des dispositifs optoélectroniques extensibles 5-9 avec une grande tolérance aux déformations de forme complexe. Parmi tous les matériaux fonctionnels électroniques, conducteurs extensibles sont nécessaires pour alimenter en énergie électrique les dispositifs optoélectroniques et sont d&#39;une importance critique pour les performances de l&#39;appareil ainsi.Parce que les matériaux conducteurs réguliers, comme le métal ou oxyde d&#39;indium-étain, manque de robustesse mécanique sous grande déformation, les interconnexions en ces matières sont incapables de présenter une bonne conductivité électrique sous processus d&#39;étirement. Ainsi, des substrats élastiques recouvertes d&#39;une fine couche de matériaux conducteurs souples, tels que des nanotubes de carbone, une graphène, 10 ou AgNWs, 11 à 14 sont conçus pour être conducteurs avec une excellente aptitude à l&#39;étirage. En raison de la conductivité apparente élevée, films minces AgNW ont été montré pour être le matériau le plus prometteur pour les conducteurs extensibles composites. 13 Les réseaux de percolation de films minces AgNW peut effectivement accueillir de grandes déformations élastiques dans le processus d&#39;étirement avec une grande conductance électrique, et sont considérés comme une électrode extensible candidat prometteur. Pour mettre en œuvre des films minces AgNW que conducteurs extensibles, il est nécessaire d&#39;avoir des contacts électriques efficaces entre AgNWs. Après le dépôt d&#39;un liquided séchage sur des surfaces de substrat, AgNWs pile régulièrement ensemble pour former un maillage de percolation avec des points de contact en vrac, qui produisent en grandes résistances électriques. Ainsi, on a besoin de recuire les contacts entre les nanofils par haute température ou haute pression méthodes de recuit 15-20 pour réduire les résistances de contact. Contrairement à ces procédés de recuit dans la littérature, ici, nous allons montrer un procédé chimique simple pour recuire AgNW connexions de réseau dans des conditions de laboratoire normales. 21 Le procédé de fabrication est représenté sur la figure 4A. Une encre réactif est utilisé pour fritter la pulvérisation revêtus de couches minces sur AgNW une plaque de verre. Après réaction, les contacts entre les nanofils sont recouverts d&#39;argent, et donc le réseau AgNW est soudé chimiquement ensemble. Une méthode de coulée et de Peel est ensuite utilisé pour transférer le réseau AgNW soudée à un substrat PU étirable pour former un conducteur composite, qui peut présenter aucun changement évident in conductivité électrique, même à grande contrainte de traction de 120%.

<table border="0" cellpadding="0" cellspacing="0" width="833">
	<tbody>
		<tr height="21">
			<td height="21" style="height:21px;width:173px;">Silver nanowire</td>
			<td style="width:195px;">Sigma-Aldrich</td>
			<td style="width:117px;">778095-25ML</td>
			<td style="width:349px;">AgNW, 120 nm in diameter and 20-50 mm in length, 0.5 wt% in IPA</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Silver nitrate crystal</td>
			<td>Macron Fine Chemicals</td>
			<td>MK216903</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Diethanolamine</td>
			<td>Sigma-Aldrich</td>
			<td>D8885-500G</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Polyurethane emulsion</td>
			<td>First Chemical</td>
			<td>20130326036</td>
			<td>35 wt% water-based anionic polyester-polyurethane emulsion</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Airbrush</td>
			<td>Taiwan Airbrush &#38; Equipment</td>
			<td>AFC-sensor&#160;</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Desktop robot</td>
			<td>Dispenser Tech</td>
			<td>DT-200&#160;</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Digital dispenser controller</td>
			<td>Dispenser Tech</td>
			<td>9000E&#160;</td>
			<td></td>
		</tr>
		<tr height="42">
			<td height="42" style="height:42px;width:173px;">Auto-spraying program</td>
			<td style="width:195px;">Dispenser Tech</td>
			<td style="width:117px;">Smart robot edit version 3.0.0.5</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Air compressor&#160;</td>
			<td>PUMA Industrial</td>
			<td>NCS-10&#160;</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Linear motorized stage</td>
			<td>TANLIAN E-O</td>
			<td>Customized</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:173px;">Stage control software</td>
			<td style="width:195px;">TANLIAN E-O</td>
			<td style="width:117px;">Customized</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Digital multimeter</td>
			<td>HILA INTERNATIONAL</td>
			<td>DM-2690TU</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:173px;">Digital multimeter software</td>
			<td style="width:195px;">HILA INTERNATIONAL</td>
			<td style="width:117px;">NA</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Power supply</td>
			<td>CHERN TAIH</td>
			<td>CT-605</td>
			<td></td>
		</tr>
		<tr height="21">
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a fabrication method for highly stretchable conductors with silver nanowires

Électronique élastique sont identifiés comme une technologie clé pour les applications électroniques de la prochaine génération. Un des défis dans la fabrication de dispositifs électroniques étirable est la préparation de conducteurs extensibles avec une grande stabilité mécanique. Dans cette étude, nous avons développé un procédé de fabrication simple à souder chimiquement les points de contact entre les réseaux de nanofils d&#39;argent (AgNW). AgNW nanomesh a été déposé d&#39;abord sur une lame de verre par l&#39;intermédiaire d&#39;un procédé de revêtement par pulvérisation. Une encre réactive composée de nanoparticules d&#39;argent (AGNPS) précurseurs a été appliquée sur la pulvérisation revêtu films minces AgNW. Après chauffage pendant 40 min, AGNPS ont été préférentiellement générés au cours des jonctions de nanofils de souder les nanomesh AgNW, et renforcé le réseau conducteur. Le film mince AgNW chimiquement modifié a ensuite été transféré à du polyuréthane (PU) substrats par méthode de coulée. Les films minces AgNW soudés sur PU ne présentaient pas de changement évident de la conductivité électrique sous étirement ou rollinProcédé d&#39;allongement avec des souches g jusqu&#39;à 120%.

La morphologie de la couche mince après AgNW processus de soudage chimique est représentée sur la figure 4B. AGNPS récupérés poussent préférentiellement sur ​​la surface de AgNWs et envelopper les jonctions fils / fils. Figure 5 montre la variation de la résistance de la feuille avec des souches de l&#39;allongement appliqué pour le dessoudé et les films minces soudées contenant quantité différente de AgNWs. Après le processus de souda...

Watch this Scientific Journal Video about A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires at JoVE.com

A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

A simple synthesis method is used to chemically solder silver nanowire thin film to fabricate highly stretchable and conductive metal conductors.

Un procédé de fabrication pour les conducteurs hautement extensible avec de l&#39;argent nanofils

Stretchable electronics are identified as a key technology for electronic applications in the next generation. One of the challenges in fabrication of ...

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9.8K vues.  National Taiwan University. A simple synthesis method is used to chemically solder silver nanowire thin film to fabricate highly stretchable and conductive metal conductors.

Vidéo: A Fabrication Method for Highly Stretchable Conductors with Silver Nanowires

A Method to Fabricate Disconnected Silver Nanostructures in 3D

The standard nanofabrication toolkit includes techniques primarily aimed at creating 2D patterns in dielectric media. Creating metal patterns on a submicron scale requires a combination of nanofabrication tools and several material processing steps. For example, steps to create planar metal structures using ultraviolet photolithography and electron-beam lithography can include sample exposure, sample development, metal deposition, and metal liftoff. To create 3D metal structures, the sequence is repeated multiple times. The complexity and difficulty of stacking and aligning multiple layers limits practical implementations of 3D metal structuring using standard nanofabrication tools. Femtosecond-laser direct-writing has emerged as a pre-eminent technique for 3D nanofabrication.1,2 Femtosecond lasers are frequently used to create 3D patterns in polymers and glasses.3-7 However, 3D metal direct-writing remains a challenge. Here, we describe a method to fabricate silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm. The method enables the fabrication of patterns not feasible using other techniques, such as 3D arrays of disconnected silver voxels.8 Disconnected 3D metal patterns are useful for metamaterials where unit cells are not in contact with each other,9 such as coupled metal dot10,11or coupled metal rod12,13 resonators. Potential applications include negative index metamaterials, invisibility cloaks, and perfect lenses.
In femtosecond-laser direct-writing, the laser wavelength is chosen such that photons are not linearly absorbed in the target medium. When the laser pulse duration is compressed to the femtosecond time scale and the radiation is tightly focused inside the target, the extremely high intensity induces nonlinear absorption. Multiple photons are absorbed simultaneously to cause electronic transitions that lead to material modification within the focused region. Using this approach, one can form structures in the bulk of a material rather than on its surface.
Most work on 3D direct metal writing has focused on creating self-supported metal structures.14-16 The method described here yields sub-micrometer silver structures that do not need to be self-supported because they are embedded inside a matrix. A doped polymer matrix is prepared using a mixture of silver nitrate (AgNO3), polyvinylpyrrolidone (PVP) and water (H2O). Samples are then patterned by irradiation with an 11-MHz femtosecond laser producing 50-fs pulses. During irradiation, photoreduction of silver ions is induced through nonlinear absorption, creating an aggregate of silver nanoparticles in the focal region. Using this approach we create silver patterns embedded in a doped PVP matrix. Adding 3D translation of the sample extends the patterning to three dimensions.

Femtosecond-laser direct-writing is frequently used to create three-dimensional (3D) patterns in polymers and glasses. However, patterning metals in 3D remains a challenge. We describe a method for fabricating silver nanostructures embedded inside a polymer matrix using a femtosecond laser centered at 800 nm.

Une méthode pour fabriquer des nanostructures d&#39;argent déconnectés en 3D

The standard nanofabrication toolkit includes  techniques primarily aimed at creating 2D patterns in dielectric media. Creating  metal patterns on a ...

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Monolayer Contact Doping of Silicon Surfaces and Nanowires Using Organophosphorus Compounds

Monolayer Contact Doping (MLCD) is a simple method for doping of surfaces and nanostructures1. MLCD results in the formation of highly controlled, ultra shallow and sharp doping profiles at the nanometer scale. In MLCD process the dopant source is a monolayer containing dopant atoms.
In this article a detailed procedure for surface doping of silicon substrate as well as silicon nanowires is demonstrated. Phosphorus dopant source was formed using tetraethyl methylenediphosphonate monolayer on a silicon substrate. This monolayer containing substrate was brought to contact with a pristine intrinsic silicon target substrate and annealed while in contact. Sheet resistance of the target substrate was measured using 4 point probe. Intrinsic silicon nanowires were synthesized by chemical vapor deposition (CVD) process using a vapor-liquid-solid (VLS) mechanism; gold nanoparticles were used as catalyst for nanowire growth. The nanowires were suspended in ethanol by mild sonication. This suspension was used to dropcast the nanowires on silicon substrate with a silicon nitride dielectric top layer. These nanowires were doped with phosphorus in similar manner as used for the intrinsic silicon wafer. Standard photolithography process was used to fabricate metal electrodes for the formation of nanowire based field effect transistor (NW-FET). The electrical properties of a representative nanowire device were measured by a semiconductor device analyzer and a probe station.

A detailed procedure for surface doping of Silicon interfaces is provided. The ultra-shallow surface doping is demonstrated by using phosphorus containing monolayers and rapid annealing process. The method can be used for doping of macroscopic area surfaces as well as nanostructures.

Monocouche Contactez-dopage du silicium Surfaces et nanofils utilisant des composés organophosphorés

Monolayer Contact Doping (MLCD) is a simple method for doping of surfaces and nanostructures1. MLCD results in the formation of highly controlled, ultra ...

Evaluating Plasmonic Transport in Current-carrying Silver Nanowires

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information support1,2,3. In this context, metal nanowires are especially desirable for realizing dense routing networks4. A prerequisite to operate such shared nanowire-based platform relies on our ability to electrically contact individual metal nanowires and efficiently excite surface plasmon polaritons5 in this information support. In this article, we describe a protocol to bring electrical terminals to chemically-synthesized silver nanowires6 randomly distributed on a glass substrate7. The positions of the nanowire ends with respect to predefined landmarks are precisely located using standard optical transmission microscopy before encapsulation in an electron-sensitive resist. Trenches representing the electrode layout are subsequently designed by electron-beam lithography. Metal electrodes are then fabricated by thermally evaporating a Cr/Au layer followed by a chemical lift-off. The contacted silver nanowires are finally transferred to a leakage radiation microscope for surface plasmon excitation and characterization8,9. Surface plasmons are launched in the nanowires by focusing a near infrared laser beam on a diffraction-limited spot overlapping one nanowire extremity5,9. For sufficiently large nanowires, the surface plasmon mode leaks into the glass substrate9,10. This leakage radiation is readily detected, imaged, and analyzed in the different conjugate planes in leakage radiation microscopy9,11. The electrical terminals do not affect the plasmon propagation. However, a current-induced morphological deterioration of the nanowire drastically degrades the flow of surface plasmons. The combination of surface plasmon leakage radiation microscopy with a simultaneous analysis of the nanowire electrical transport characteristics reveals the intrinsic limitations of such plasmonic circuitry.

Silver nanowires can simultaneously transport electrons and optical information in the form of surface plasmons. A procedure is described here to realize such a shared circuitry and the limitations at propagating both information carriers are evaluated.

Plasmonics is an emerging technology capable of simultaneously transporting a plasmonic signal and an electronic signal on the same information ...

Preparation and Use of Photocatalytically Active Segmented Ag|ZnO and Coaxial TiO2-Ag Nanowires Made by Templated Electrodeposition

Photocatalytically active nanostructures require a large specific surface area with the presence of many catalytically active sites for the oxidation and reduction half reactions, and fast electron (hole) diffusion and charge separation. Nanowires present suitable architectures to meet these requirements. Axially segmented Ag|ZnO and radially segmented (coaxial) TiO2-Ag nanowires with a diameter of 200 nm and a length of 6-20 &#181;m were made by templated electrodeposition within the pores of polycarbonate track-etched (PCTE) or anodized aluminum oxide (AAO) membranes, respectively. In the photocatalytic experiments, the ZnO and TiO2 phases acted as photoanodes, and Ag as cathode. No external circuit is needed to connect both electrodes, which is a key advantage over conventional photo-electrochemical cells. For making segmented Ag|ZnO nanowires, the Ag salt electrolyte was replaced after formation of the Ag segment to form a ZnO segment attached to the Ag segment. For making coaxial TiO2-Ag nanowires, a TiO2 gel was first formed by the electrochemically induced sol-gel method. Drying and thermal annealing of the as-formed TiO2 gel resulted in the formation of crystalline TiO2 nanotubes. A subsequent Ag electrodeposition step inside the TiO2 nanotubes resulted in formation of coaxial TiO2-Ag nanowires. Due to the combination of an n-type semiconductor (ZnO or TiO2) and a metal (Ag) within the same nanowire, a Schottky barrier was created at the interface between the phases. To demonstrate the photocatalytic activity of these nanowires, the Ag|ZnO nanowires were used in a photocatalytic experiment in which H2 gas was detected upon UV illumination of the nanowires dispersed in a methanol/water mixture. After 17 min&#160;of illumination, approximately 0.2 vol% H2 gas was detected from a suspension of ~0.1 g of Ag|ZnO nanowires in a 50 ml 80 vol% aqueous methanol solution.

Preparation and Use of Photocatalytically Active Segmented Ag|ZnO and Coaxial TiO2-Ag Nanowires Made by Templated Electrodeposition

Procedures are outlined to prepare segmented and coaxial nanowires via templated electrodeposition in nanopores. As examples, segmented nanowires consisting of Ag and ZnO segments, and coaxial nanowires consisting of a TiO2 shell and a Ag core were made. The nanowires were used in photocatalytic hydrogen formation experiments.

Préparation et utilisation d&#39;activité photo sectorielle Ag | ZnO et coaxial TiO<sub&gt; 2</sub&gt;-Ag nanofils par Templated électrodéposition

Photocatalytically active nanostructures require a large specific surface area with the presence of many catalytically active sites for the oxidation and ...

Atomically Traceable Nanostructure Fabrication

Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the entire fabrication process being used in order to maintain exquisite control over both feature size and feature density. Here, we demonstrate a method for tracking atomically resolved and controlled structures from initial template definition through final nanostructure metrology, opening up a pathway for top-down atomic control over nanofabrication. Hydrogen depassivation lithography is the first step of the nanoscale fabrication process followed by selective atomic layer deposition of up to 2.8 nm of titania to make a nanoscale etch mask. Contrast with the background is shown, indicating different mechanisms for growth on the desired patterns and on the H passivated background. The patterns are then transferred into the bulk using reactive ion etching to form 20 nm tall nanostructures with linewidths down to ~6 nm. To illustrate the limitations of this process, arrays of holes and lines are fabricated. The various nanofabrication process steps are performed at disparate locations, so process integration is discussed. Related issues are discussed including using fiducial marks for finding nanostructures on a macroscopic sample and protecting the chemically reactive patterned Si(100)-H surface against degradation due to atmospheric exposure.

We report a protocol for combining the atomic metrology of the Scanning Tunneling Microscope for surface patterning with selective Atomic Layer Deposition and Reactive Ion Etching. Using a robust process involving numerous atmospheric exposures and transport, 3D nanostructures with atomic metrology are fabricated.

Atomiquement traçable nanostructures Fabrication

Reducing the scale of etched nanostructures below the 10 nm range eventually will require an atomic scale understanding of the entire fabrication process ...

Fabrication Process of Silicone-based Dielectric Elastomer Actuators

This contribution demonstrates the fabrication process of dielectric elastomer transducers (DETs). DETs are stretchable capacitors consisting of an elastomeric dielectric membrane sandwiched between two compliant electrodes. The large actuation strains of these transducers when used as actuators (over 300% area strain) and their soft and compliant nature has been exploited for a wide range of applications, including electrically tunable optics, haptic feedback devices, wave-energy harvesting, deformable cell-culture devices, compliant grippers, and propulsion of a bio-inspired fish-like airship. In most cases, DETs are made with a commercial proprietary acrylic elastomer and with hand-applied electrodes of carbon powder or carbon grease. This combination leads to non-reproducible and slow actuators exhibiting viscoelastic creep and a short lifetime. We present here a complete process flow for the reproducible fabrication of DETs based on thin elastomeric silicone films, including casting of thin silicone membranes, membrane release and prestretching, patterning of robust compliant electrodes, assembly and testing. The membranes are cast on flexible polyethylene terephthalate (PET) substrates coated with a water-soluble sacrificial layer for ease of release. The electrodes consist of carbon black particles dispersed into a silicone matrix and patterned using a stamping technique, which leads to precisely-defined compliant electrodes that present a high adhesion to the dielectric membrane on which they are applied.

This manuscript shows the fabrication process for the manufacture of dielectric elastomer soft actuators based on silicone membranes. The three key stages of production are presented in detail: blade casting of thin silicone membranes; pad printing of compliant electrodes; and the assembly of all the components.

Processus de fabrication des élastomères diélectriques Actionneurs à base de silicone

This contribution demonstrates the fabrication process of dielectric elastomer transducers (DETs). DETs are stretchable capacitors consisting of an ...

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Thermoplastic microfluidic devices offer many advantages over those made from silicone elastomers, but bonding procedures must be developed for each thermoplastic of interest. Solvent bonding is a simple and versatile method that can be used to fabricate devices from a variety of plastics. An appropriate solvent is added between two device layers to be bonded, and heat and pressure are applied to the device to facilitate the bonding. By using an appropriate combination of solvent, plastic, heat, and pressure, the device can be sealed with a high quality bond, characterized as having high bond coverage, bond strength, optical clarity, durability over time, and low deformation or damage to microfeature geometry. We describe the procedure for bonding devices made from two popular thermoplastics, poly(methyl-methacrylate) (PMMA), and cyclo-olefin polymer (COP), as well as a variety of methods to characterize the quality of the resulting bonds, and strategies to troubleshoot low quality bonds. These methods can be used to develop new solvent bonding protocols for other plastic-solvent systems.

Solvent bonding is a simple and versatile method for fabricating thermoplastic microfluidic devices with high quality bonds. We describe a protocol to achieve strong, optically clear bonds in PMMA and COP microfluidic devices that preserve microfeature details, by a judicious combination of pressure, temperature, an appropriate solvent, and device geometry.

Collage de solvant pour la fabrication de PMMA et COP dispositifs microfluidiques

Thermoplastic microfluidic devices offer many advantages over those made from silicone elastomers, but bonding procedures must be developed for each ...

Challenges in Rheological Characterization of Highly Concentrated Suspensions &#8212; A Case Study for Screen-printing Silver Pastes

A comprehensive rheological characterization of highly concentrated suspensions or pastes is mandatory for a targeted product development meeting the manifold requirements during processing and application of such complex fluids. In this investigation, measuring protocols for a conclusive assessment of different process relevant rheological parameters have been evaluated. This includes the determination of yield stress, viscosity, wall slip velocity, structural recovery after large deformation and elongation at break as well as tensile force during filament stretching.
The importance of concomitant video recordings during parallel-plate rotational rheometry for a significant determination of rheological quantities is demonstrated. The deformation profile and flow field at the sample edge can be determined using appropriate markers. Thus, measurement parameter settings and plate roughness values can be identified for which yield stress and viscosity measurements are possible. Slip velocity can be measured directly and measuring conditions at which plug flow, shear banding or sample spillover occur can be identified clearly. 
Video recordings further confirm that the change in shear moduli observed during three stage oscillatory shear tests with small deformation amplitude in stage I and III but large oscillation amplitude in stage II can be directly attributed to structural break down and recovery. For the pastes investigated here, the degree of irreversible, shear-induced structural change increases with increasing deformation amplitude in stage II until a saturation is reached at deformations corresponding to the crossover of G' and G'', but the irreversible damage is independent of the duration of large amplitude shear. 
A capillary breakup elongational rheometer and a tensile tester have been used to characterize deformation and breakup behavior of highly filled pastes in uniaxial elongation. Significant differences were observed in all experiments described above for two commercial screen-printing silver pastes used for front side metallization of Si-solar cells.

A protocol for a robust and application relevant rheological characterization of highly concentrated suspensions is presented. Silver pastes used for screen-printing application in solar cell production are employed as model systems.

Défis à rhéologique Caractérisation des concentrés - Suspensions très Une étude de cas pour la sérigraphie argent Pastes

A comprehensive rheological characterization of highly concentrated suspensions or pastes is mandatory for a targeted product development meeting the ...

Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition

Ultra-thin film structures have been studied extensively for use as optical coatings, but performance and fabrication challenges remain.&#160; We present an advanced method for fabricating ultra-thin color films with improved characteristics. The proposed process addresses several fabrication issues, including large area processing. Specifically, the protocol describes a process for fabricating ultra-thin color films using an electron beam evaporator for oblique angle deposition of germanium (Ge) and gold (Au) on silicon (Si) substrates.&#160; Film porosity produced by the oblique angle deposition induces color changes in the ultra-thin film. The degree of color change depends on factors such as deposition angle and film thickness. Fabricated samples of the ultra-thin color films showed improved color tunability and color purity. In addition, the measured reflectance of the fabricated samples was converted into chromatic values and analyzed in terms of color. Our ultra-thin film fabricating method is expected to be used for various ultra-thin film applications such as flexible color electrodes, thin film solar cells, and optical filters. Also, the process developed here for analyzing the color of the fabricated samples is broadly useful for studying various color structures.

We present a detailed method for fabricating ultra-thin color films with improved characteristics for optical coatings. The oblique angle deposition technique using an electron beam evaporator allows improved color tunability and purity. Fabricated films of Ge and Au on Si substrates were analyzed by reflectance measurements and color information conversion.

Fabrication de Films couleur ultra-mince avec hautement absorbant Media Depot en Angle Oblique

Ultra-thin film structures have been studied extensively for use as optical coatings, but performance and fabrication challenges remain.&#160; We present ...

Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of nanowires. DEP is used for nanowire analysis, characterization, and for solution-based fabrication of semiconducting devices. The method works by applying an alternating electric field between metallic electrodes. The nanowire formulation is then dropped onto the electrodes which are on an inclined surface to create a flow of the formulation using gravity. The nanowires then align along the gradient of the electric field and in the direction of the liquid flow. The frequency of the field can be adjusted to select nanowires with superior conductivity and lower trap density. 
In this work, flow-assisted DEP is used to create nanowire field effect transistors. Flow-assisted DEP has several advantages: it allows selection of nanowire electrical properties; control of nanowire length; placement of nanowires in specific areas; control of orientation of nanowires; and control of nanowire density in the device. 
The technique can be expanded to many other applications such as gas sensors and microwave switches. The technique is efficient, quick, reproducible, and it uses a minimal amount of dilute solution making it ideal for the testing of novel nanomaterials. Wafer scale assembly of nanowire devices can also be achieved using this technique, allowing large numbers of samples for testing and large-area electronic applications.

In this paper, flow assisted dielectrophoresis is demonstrated for the self-assembly of nanowire devices. The fabrication of a silicon nanowire field effect transistor is shown as an example.

Flux-aidé diélectrophorèse : Une méthode Low Cost pour la Fabrication des dispositifs de nanofils traitable-Solution Haute Performance

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of ...

Un procédé de fabrication pour les conducteurs hautement extensible avec de l'argent nanofils

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Une méthode pour fabriquer des nanostructures d'argent déconnectés en 3D