Name: a simple and scalable fabrication method for organic electronic devices on textiles
Uploaded: 2017-03-13T15:00:00.000+00:00
Duration: 6 min 21 s
Description: Watch this Scientific Journal Video about A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles at JoVE.com

The authors would like to acknowledge the BPI PIAVE AUTONOTEX grant for the financial support.

1.パターニングは、繊維上の導電性高分子<ol><li>処理中に簡単に処理するための平坦な表面上の10センチメートル×10センチの繊維シートを修正しました。織物の場合は、300ミクロンの厚さと、50％までのニット方向ストレッチ機能を持つ100％インターロックニットポリエステル生地を使用。 </li><li>パターニング設計を含むマスクを作成するには、125μmの厚さのポリイミドフィルムを使用します。パターンの例が図1に示されています。 <ol><li>パターンにポリイミドマスク10をレーザーカッター（ 例えば、Protolaser S、LPKF）を使用します。電極のパターン設計は、 図1に示されています。 </li><li>コートPDMS物（10：1塩基剤比を硬化する）は200μmとでの湿潤膜厚で自動テープキャスティングツール（K制御プリントコーター、ドクターブレード）を用いて、マスク（ポリイミドフィルム）の上6m /秒分の塗布速度。 3センチメートルのx 5cmのマスクのために約0.5ミリリットルを使用してください。目を実行しますヒュームフードの下でプロセスです。 </li></ol></li><li>静かにPDMSでコーティングされたマスクに生地を移します。 PDMSは、完全に織物構造に吸収されるべき後、10分間のままにしておきます。 </li><li> 10分間、100℃の空気オーブン中でサンプルを硬化します。 </li><li>導電性ポリマーを準備：PEDOT：PSS分散液（80ミリリットル）、エチレングリコール（20mL）で、4 - ドデシルベンゼンスルホン酸（40μL）、およびヒュームフード中の3-メタクリロ（1ミリリットル）。 </li><li>ブラシコートPEDOT：溶液の均一な浸透まで織物のPDMSを含まない領域にPSS溶液が得られます。均一なパターンの色を達成するために、この手順を繰り返します。約1mL / cm 2で適用します。 </li><li> PSS溶液：PEDOTを乾燥させるために1時間、110℃で生地を治します。ナイロンのような高温処理に敏感である織物、60℃に温度を下げてください。 </li></ol> 2.有機デバイスの製造注：第1 describでプロトコル織物上の導電材料の選択的堆積をエス。次のセクションでは、ストレッチセンサ、OECTトランジスタ、皮膚電極、および容量センサのように、有機デバイスを製造するために必要な追加手順について説明します。 <ol><li>セクション1で説明したように、織物の図3aに示されるストレッチセンサ、パターン電極線を製造するために、1.1〜1.5ステップ。 注：パターン設計の例は、 図3aに示されています。このようなセンサの製造は、任意の追加の手順は必要ありません。 </li><li> 図3bに示すトランジスタの設計を製造するために、パターン1節で説明する手順以下のナイロン織リボン上のトランジスタアレイは、わずかにPDMSのアニーリングおよびPEDOTを変更：PSSは、60℃で硬化させることによりナイロンの熱劣化を回避するために手順を硬化させます長い時間のためのC。 </li><li> 図3cに示される皮膚電極の製造については、堆積パターン化されたPEDOT上のイオン性ゲル：PSSテキスタイル。 <ol><li>イオン液体、1-エチル-3-メチルイミダゾリウム・エチル硫酸塩を含むイオン性液体ゲル混合物を調製します。架橋剤としては、ポリ（エチレングリコール）ジアクリレート。それぞれ、0.6 / 0.35 / 0.05の（v / v）の比で光開始剤、2-ヒドロキシ-2-メチルプロピオフェノン。 </li><li>コートPEDOT：イオン液体（20μL/ cm 2）を持つPSS電極とドロップキャスティングによって（25μL/ cm 2）をステップ2.3.1からイオン性液体ゲル混合物を追加します。 </li><li>ゲルが固化するまで、10〜15分間架橋反応を開始するためにUV光（365 nm）に露光します。ドラフト内で、この手順を実行します。 UV露光中にUV-保護ケージを使用してください。 </li></ol></li><li>静電容量センサの製造のために、PEDOTを使用：PSSのテキスタイル電極は、絶縁材料（ 図3d）で絶縁。 <ol><li>キーボードのようなPEDOT絶縁：PDMSを使用して、PSS電極を、キーボードのデザインは、&lt;図2bに見られます/ strong&gt;の。生地の上にPDMS製剤を分配し、スキージで過剰を取り除きます。 </li><li> 10分間100℃のオーブンで生地を置きます。ドラフト内で、この手順を実行します。 </li></ol></li></ol>

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The authors have nothing to disclose.

導電性材料のパターニングは、機能的な電子デバイスの製造における最初のステップの1つです。製造プロセスは、アカウントにこのような材料の化学的および物理的特性を取る必要があり、プロセスフローは、製造工程の間に材料の相互互換性を考慮する必要があるので、これは、挑戦的になることができます。有機電子デバイスの微細加工では、これらの2つの側面が原因有機物の高度に?...

ウェアラブルエレクトロニクスの分野では3回、現在の市場の上、2025年に500億ユーロの価値があると予想される急成長している市場です。現在のウェアラブルデバイスが直面する主な課題は、侵入型固体電子添付ファイルがウェアラブルシステムで確立されたデバイスの使用を制限しているということです。日常生活の中ですでに存在している繊維製品を使用することでこの制限を回避するために非常に魅力的かつ直接的なアプローチです。 、その弾性能力を、私たちが着る衣服の一部が皮膚に密着して自然にあります。市場で入手可能なスマート服の多くの例は、今日はファッショナブルな方法1で人間と電子機器をつなぐ、薄い、プラスチックディスプレイ、キーボード、および織物に埋め込まれた光源装置に基づいています。スポーツの練習では、ヘルスモニタリングは、一般的に、接着剤、電極と金属リストバンドを使用するために快適な選択肢を提供するテキスタイル電極、に依存しています。ここでは、導電性繊維であります直接長時間着用中に皮膚刺激やその他の不快感を防ぐために、伸縮性のある生地と統合。また、テキスタイルは、運動2をキャプチャするために、曲率センサを統合する機能ロボットアクチュエータ3の開発のためのせん断センサーを統合するために、そして確かに汗4中の検体を検出することによりバイオセンサーを統合するために多くの機会を提供しています。 現代の着用可能な技術は、独自の特性を有する電子デバイスを提供炭素系半導体材料に依存します。有機物の「ソフト」な性質は、従来の固体エレクトロニクスに比べ、人体とのインタフェースのための良好な機械的性質を提供しています。機械的にフレキシブル基板とペアこの機械的適合性は、そのような繊維のような装置における非平面形状因子の使用を可能にします。有機物の使用は、これらの混合ELEに生命科学にも関連していますctronicとイオン伝導性5。また、有機半導体および光電子材料は、ディスプレイ、トランジスタ、ロジック、および電源機能6、7、8、9を有する機能素子の多種多様な力を与えます。このような有機デバイスの製造における主な困難は、繊維の非平面表面上の機能材料の制御された沈着です。従来の微細加工技術は、主に織物基材の構造的次元を有する堆積プロセスの不適合性によって制限されます。 ここでは、構造化繊維製品上の導電性ポリマーの選択的な堆積を可能にし、シンプルでスケーラブルな製造プロトコルを記述します。提示方法は、ウェアラブルとコンフォーマル電子デバイスの製造を可能にします。アプローチは、Cのパターンに基づいていますommercially利用可能な導電性ポリマー、ポリ（3,4-エチレンジオキシチオフェン）：ポリ（スチレンスルホネート）（PEDOT：PSS）及び織物のエラストマーステンシル材料、ポリジメチルシロキサン（PDMS）。この組み合わせは、水性PEDOTの効率的な閉じ込めを可能にする：PSS溶液、ならびに繊維製品のソフトで伸縮性の特性を保持するため。このシンプルで信頼性の高い製造方法は、費用効率的かつ工業的にスケーラブルな方法で直接繊維製品上のさまざまな電子機器を製造するための道を開きます。

<table><tbody><tr><td>SYLGARD 184, Silicone elastomer kit (Base and Curing agent)</td><td>Dow Corning</td><td></td><td>PDMS elastomer</td></tr><tr><td colspan="4">&lt;strong&gt;The conducting polymer formulation&lt;/strong&gt;</td></tr><tr><td>CleviosTM PH 1000 PEDOT:PSS</td><td>Heraeus</td><td></td><td>Conductive polymer</td></tr><tr><td>Ethylene glycol</td><td>Sigma-Aldrich</td><td>03750-250ML</td><td>Solvent (EG), CAS: 107-21-1</td></tr><tr><td>3-methacryloxypropyltrimethoxysilane</td><td>Sigma-Aldrich</td><td>M6514</td><td>Cros linker (GOPs), CAS: 2530-85-0</td></tr><tr><td>4-dodecylbenzenesulfonic acid</td><td>Sigma-Aldrich</td><td>44198</td><td>DBSA; CAS: 121-65-3</td></tr><tr><td colspan="4">&lt;strong&gt;The ionic liquid gel&lt;/strong&gt;</td></tr><tr><td>UV lamp DFE 2340</td><td>C.I.F/ ATHELEC</td><td>DP134</td><td>UV-365 nm</td></tr><tr><td>1-Ethyl-3-methylimidazolium ethyl sulfate</td><td>Sigma-Aldrich</td><td>51682-100G-F</td><td>Ionic Liquid (IL), CAS: 342573-75-5</td></tr><tr><td>Poly(ethylene glycol) diacrylate</td><td>Sigma-Aldrich</td><td>455008-100ML</td><td>Mn 700, CAS: 26570-48-9</td></tr><tr><td>2-Hydroxy-2-methylpropiophenon</td><td>Sigma-Aldrich</td><td>405655-50ML</td><td>Phot Initiator (PI), CAS: 7473-98-5</td></tr><tr><td>The textile fabric</td><td>VWR</td><td>Spec-Wipe 7 Wipers</td><td>100% interlock knit polyester fabric</td></tr><tr><td>The polyimide film</td><td>DuPont</td><td>HN100</td><td>Polyimide film with 125 &amp;micro;m thickness</td></tr></tbody></table>

a simple and scalable fabrication method for organic electronic devices on textiles

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices cannot be worn under everyday conditions. Therefore, textiles are commonly considered the best substrate to accommodate electronic devices in wearable use. In this paper, we describe how to selectively pattern organic electroactive materials on textiles from a solution in an easy and scalable manner. This versatile deposition technique enables the fabrication of wearable organic electronic devices on clothes.

織物に色やパターンを適用する従来の方法は、染料の選択的堆積を可能にするために取り外し可能なマスキング層に依存しています。織物上のPSS電極： 図1では、我々は、PEDOTのパターニングにこのようなアプローチの適応を示しています。 PSS溶液：マスキング層として、我々は、水性PEDOTの非制御可能な拡散を抑制することができる疎水性のポリジメチ?...

Watch this Scientific Journal Video about A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles at JoVE.com

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

本稿では、ウェアラブルと有機電子デバイスの直接統合を可能にする選択的織物上に有機材料を堆積するためのプロトコルを提示します。製造されたデバイスは、完全に機械的な外観を尊重し、検知機能を有効にする、繊維に組み込むことができます。

テキスタイル上の有機電子デバイスのためのシンプルでスケーラブルな製造方法

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices ...

a-simple-scalable-fabrication-method-for-organic-electronic-devices

Research

JoVE Journal

Bioengineering

10.4K ビュー.  Ecole Nationale Supérieure des Mines de Saint-Étienne, CMP-EMSE, MOC. 本稿では、ウェアラブルと有機電子デバイスの直接統合を可能にする選択的織物上に有機材料を堆積するためのプロトコルを提示します。製造されたデバイスは、完全に機械的な外観を尊重し、検知機能を有効にする、繊維に組み込むことができます。 

ビデオ: A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a stable interface that permits efficient electron transport and protects underlying substrates from oxidative degradation. Group IV semiconductors can be effectively protected with highly-ordered self-assembled monolayers (SAMs) composed of simple alkyl chains that act as impervious barriers to both organic and aqueous solutions. Simple alkyl SAMs, however, are inert and not amenable to traditional patterning techniques. The motivation for immobilizing organic molecular systems on semiconductors is to impart new functionality to the surface that can provide optical, electronic, and mechanical function, as well as chemical and biological activity. 
Microcontact printing (&mu;CP) is a soft-lithographic technique for patterning SAMs on myriad surfaces.1-9 Despite its simplicity and versatility, the approach has been largely limited to noble metal surfaces and has not been well developed for pattern transfer to technologically important substrates such as oxide-free silicon and germanium. Furthermore, because this technique relies on the ink diffusion to transfer pattern from the elastomer to substrate, the resolution of such traditional printing is essentially limited to near 1 &mu;m.10-16
In contrast to traditional printing, inkless &mu;CP patterning relies on a specific reaction between a surface-immobilized substrate and a stamp-bound catalyst. Because the technique does not rely on diffusive SAM formation, it significantly expands the diversity of patternable surfaces. In addition, the inkless technique obviates the feature size limitations imposed by molecular diffusion, facilitating replication of very small (&lt;200 nm) features.17-23 However, up till now, inkless &mu;CP has been mainly used for patterning relatively disordered molecular systems, which do not protect underlying surfaces from degradation.
Here, we report a simple, reliable high-throughput method for patterning passivated silicon and germanium with reactive organic monolayers and demonstrate selective functionalization of the patterned substrates with both small molecules and proteins. The technique utilizes a preformed NHS-reactive bilayered system on oxide-free silicon and germanium. The NHS moiety is hydrolyzed in a pattern-specific manner with a sulfonic acid-modified acrylate stamp to produce chemically distinct patterns of NHS-activated and free carboxylic acids. A significant limitation to the resolution of many &mu;CP techniques is the use of PDMS material which lacks the mechanical rigidity necessary for high fidelity transfer. To alleviate this limitation we utilized a polyurethane acrylate polymer, a relatively rigid material that can be easily functionalized with different organic moieties. Our patterning approach completely protects both silicon and germanium from chemical oxidation, provides precise control over the shape and size of the patterned features, and gives ready access to chemically discriminated patterns that can be further functionalized with both organic and biological molecules. The approach is general and applicable to other technologically-relevant surfaces.

Here we describe a simple method for patterning oxide-free silicon and germanium with reactive organic monolayers and demonstrate functionalization of the patterned substrates with small molecules and proteins. The approach completely protects surfaces from chemical oxidation, provides precise control over feature morphology, and provides ready access to chemically discriminated patterns.

ソフトリソグラフィ機能化およびパターニング酸化物フリーシリコンとゲルマニウム

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a ...

生物工学

Fabrication of Large-area Free-standing Ultrathin Polymer Films

This procedure describes a method for the fabrication of large-area and ultrathin free-standing polymer films. Typically, ultrathin films are prepared using either sacrificial layers, which may damage the film or affect its mechanical properties, or they are made on freshly cleaved mica, a substrate that is difficult to scale. Further, the size of ultrathin film is typically limited to a few square millimeters. In this method, we modify a surface with a polyelectrolyte that alters the strength of adhesion between polymer and deposition substrate. The polyelectrolyte can be shown to remain on the wafer using spectroscopy, and a treated wafer can be used to produce multiple films, indicating that at best minimal amounts of the polyelectrolyte are added to the film. The process has thus far been shown to be limited in scalability only by the size of the coating equipment, and is expected to be readily scalable to industrial processes. In this study, the protocol for making the solutions, preparing the deposition surface, and producing the films is described.

We describe a method for the fabrication of large-area (up to 13 cm diameter) and ultrathin (as thin as 8 nm) polymer films. Instead of using a sacrificial interlayer to delaminate the film from its substrate, we use a self-limiting surface treatment suitable for arbitrarily large areas.

大面積自立超薄ポリマーフィルムの作製

This procedure describes a method for the fabrication of large-area and ultrathin free-standing polymer films.  Typically, ultrathin films are prepared ...

化学

Microfabrication of Chip-sized Scaffolds for Three-dimensional Cell cultivation

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell cultivation. These technologies offer a wide spectrum of advantages not only for manufacturing but also for different applications. The size and shape of formed cell clusters can be influenced by the exact and reproducible architecture of the microfabricated scaffold and, therefore, the diffusion path length of nutrients and gases can be controlled.1 This is unquestionably a useful tool to prevent apoptosis and necrosis of cells due to an insufficient nutrient and gas supply or removal of cellular metabolites.
Our polymer chip, called CellChip, has the outer dimensions of 2 x 2 cm with a central microstructured area. This area is subdivided into an array of up to 1156 microcontainers with a typical dimension of 300 m edge length for the cubic design (cp- or cf-chip) or of 300 m diameter and depth for the round design (r-chip).2
So far, hot embossing or micro injection moulding (in combination with subsequent laborious machining of the parts) was used for the fabrication of the microstructured chips. Basically, micro injection moulding is one of the only polymer based replication techniques that, up to now, is capable for mass production of polymer microstructures.3 However, both techniques have certain unwanted limitations due to the processing of a viscous polymer melt with the generation of very thin walls or integrated through holes. In case of the CellChip, thin bottom layers are necessary to perforate the polymer and provide small pores of defined size to supply cells with culture medium e.g. by microfluidic perfusion of the containers.
In order to overcome these limitations and to reduce the manufacturing costs we have developed a new microtechnical approach on the basis of a down-scaled thermoforming process. For the manufacturing of highly porous and thin walled polymer chips, we use a combination of heavy ion irradiation, microthermoforming and track etching. In this so called "SMART" process (Substrate Modification And Replication by Thermoforming) thin polymer films are irradiated with energetic heavy projectiles of several hundred MeV introducing so-called "latent tracks" Subsequently, the film in a rubber elastic state is formed into three dimensional parts without modifying or annealing the tracks. After the forming process, selective chemical etching finally converts the tracks into cylindrical pores of adjustable diameter.

We present two processes for the microfabrication of porous polymer chips for three-dimensional cell cultivation. The first one is hot embossing combined with a solvent vapour welding process. The second one uses a recently developed microthermoforming process combined with ion track technology leading to a significant simplification of manufacture.

三次元細胞培養用チップサイズの足場の微細加工

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell ...

生物学

Printing Fabrication of Bulk Heterojunction Solar Cells and In Situ Morphology Characterization

Polymer-based materials hold promise as low-cost, flexible efficient photovoltaic devices. Most laboratory efforts to achieve high performance devices have used devices prepared by spin coating, a process that is not amenable to large-scale fabrication. This mismatch in device fabrication makes it difficult to translate quantitative results obtained in the laboratory to the commercial level, making optimization difficult. Using a mini-slot die coater, this mismatch can be resolved by translating the commercial process to the laboratory and characterizing the structure formation in the active layer of the device in real time and in situ as films are coated onto a substrate. The evolution of the morphology was characterized under different conditions, allowing us to propose a mechanism by which the structures form and grow. This mini-slot die coater offers a simple, convenient, material efficient route by which the morphology in the active layer can be optimized under industrially relevant conditions. The goal of this protocol is to show experimental details of how a solar cell device is fabricated using a mini-slot die coater and technical details of running in situ structure characterization using the mini-slot die coater.

Printing Fabrication of Bulk Heterojunction Solar Cells and In Situ Morphology Characterization

Here, we present a protocol to fabricate organic thin film solar cells using a mini-slot die coater and related in-line structure characterizations using synchrotron scattering techniques.

バルクヘテロ接合太陽電池の印刷作製と<em&gt;その場で</em&gt;形態キャラクタリゼーション

Polymer-based materials hold promise as low-cost, flexible efficient photovoltaic devices. Most laboratory efforts to achieve high performance devices ...

工学

Fabrication of Fully Solution Processed Inorganic Nanocrystal Photovoltaic Devices

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal inks. For the photoactive absorber layer, colloidal CdTe and CdSe nanocrystals (3-5 nm) are synthesized using an inert hot injection technique and cleaned with precipitations to remove excess starting reagents. Similarly, gold nanocrystals (3-5 nm) are synthesized under ambient conditions and dissolved in organic solvents. In addition, precursor solutions for transparent conductive indium tin oxide (ITO) films are prepared from solutions of indium and tin salts paired with a reactive oxidizer. Layer-by-layer, these solutions are deposited onto a glass substrate following annealing (200-400 &#176;C) to build the nanocrystal solar cell (glass/ITO/CdSe/CdTe/Au). Pre-annealing ligand exchange is required for CdSe and CdTe nanocrystals where films are dipped in NH4Cl:methanol to replace long-chain native ligands with small inorganic Cl- anions. NH4Cl(s) was found to act as a catalyst for the sintering reaction (as a non-toxic alternative to the conventional CdCl2(s) treatment) leading to grain growth (136&#177;39 nm) during heating. The thickness and roughness of the prepared films are characterized with SEM and optical profilometry. FTIR is used to determine the degree of ligand exchange prior to sintering, and XRD is used to verify the crystallinity and phase of each material. UV/Vis spectra show high visible light transmission through the ITO layer and a red shift in the absorbance of the cadmium chalcogenide nanocrystals after thermal annealing. Current-voltage curves of completed devices are measured under simulated one sun illumination. Small differences in deposition techniques and reagents employed during ligand exchange have been shown to have a profound influence on the device properties. Here, we examine the effects of chemical (sintering and ligand exchange agents) and physical treatments (solution concentration, spray-pressure, annealing time and annealing temperature) on photovoltaic device performance.

This protocol describes the synthesis and solution deposition of inorganic nanocrystals layer by layer to produce thin film electronics on non-conductive surfaces. Solvent-stabilized inks can produce complete photovoltaic devices on glass substrates via spin and spray coating following post-deposition ligand exchange and sintering.

完全に解決策が処理無機ナノ結晶太陽電池素子の作製

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal ...

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a polymer film. This paper also presents a low-cost, vacuum-free fabrication method for this novel TE; the approach combines lithography, electroplating, and imprint transfer (LEIT) processing. The embedded nature of the EMTEs offers many advantages, such as high surface smoothness, which is essential for organic electronic device production; superior mechanical stability during bending; favorable resistance to chemicals and moisture; and strong adhesion with plastic film. LEIT fabrication features an electroplating process for vacuum-free metal deposition and is favorable for industrial mass production. Furthermore, LEIT allows for the fabrication of metal mesh with a high aspect ratio (i.e., thickness to linewidth), significantly enhancing its electrical conductance without adversely losing optical transmittance. We demonstrate several prototypes of flexible EMTEs, with sheet resistances lower than 1 &#937;/sq and transmittances greater than 90%, resulting in very high figures of merit (FoM) &#8211; up to 1.5 x 104 &#8211; which are amongst the best values in the published literature.

This protocol describes a solution-based fabrication strategy for high-performance, flexible, transparent electrodes with fully-embedded, thick metal mesh. Flexible transparent electrodes fabricated by this process demonstrate among the highest reported performances, including ultra-low sheet resistance, high optical transmittance, mechanical stability under bending, strong substrate adhesion, surface smoothness, and environmental stability.

埋め込み金属メッシュを用いた高性能で柔軟で透明な電極のための拡張可能なソリューション処理製作戦略

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a ...

Reactive Vapor Deposition of Conjugated Polymer Films on Arbitrary Substrates

We demonstrate a method of conformally coating conjugated polymers on arbitrary substrates using a custom-designed, low-pressure reaction chamber. Conductive polymers, poly(3,4-ethylenedioxythiophene) (PEDOT) and poly(3,4-propylenedioxythiophene) (PProDOT), and a semiconducting polymer, poly(thieno[3,2-b]thiophene) (PTT), were deposited on unconventional highly-disordered and textured substrates with high surface areas, such as paper, towels and fabrics. This reported deposition chamber is an improvement of previous vapor reactors because our system can accommodate both volatile and nonvolatile monomers, such as 3,4-propylenedioxythiophene and thieno[3,2-b]thiophene. Utilization of both solid and liquid oxidants are also demonstrated. One limitation of this method is that it lacks sophisticated in situ thickness monitors. Polymer coatings made by the commonly used solution-based coating methods, such as spin-coating and surface grafting, are often not uniform or susceptible to mechanical degradation. This reported vapor phase deposition method overcomes those drawbacks and is a strong alternative to common solution-based coating methods. Notably, polymer films coated by the reported method are uniform and conformal on rough surfaces, even at a micrometer scale. This feature allows for future application of vapor deposited polymers in electronics devices on flexible and highly textured substrates.

This paper presents a protocol for reactive vapor deposition of poly(3,4-ethylenedioxythiophene), poly(3,4-propylenedioxythiophene), and poly(thieno[3,2-b]thiophene) films on glass slides and rough substrates, such as textiles and paper.

任意の基板上への共役ポリマー薄膜の反応性蒸着

We demonstrate a method of conformally coating conjugated polymers on arbitrary substrates using a custom-designed, low-pressure reaction chamber. ...

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, but several challenging points remain, such as a low absorption efficiency due to a thin active layer and low flexibility. We present an advanced method to fabricate a flexible phototransistor array with an improved electrical performance. The outstanding electrical performance is driven by a low dark current owing to deep impurity doping. Stretchable and flexible metal interconnectors simultaneously offer electrical and mechanical stabilities in a highly deformed state. The protocol explicitly describes the fabrication process of the phototransistor using a thin silicon membrane. By measuring I-V characteristics of the completed device in deformed states, we demonstrate that this approach improves the mechanical and electrical stabilities of the phototransistor array. We expect that this approach to a flexible phototransistor can be widely used for the applications of not only next-generation imaging systems/optoelectronics but also wearable devices such as tactile/pressure/temperature sensors and health monitors.

We present a detailed method to fabricate a deformable lateral NIPIN phototransistor array for curved image sensors. The phototransistor array with an open mesh form, which is composed of thin silicon islands and stretchable metal interconnectors, provides flexibility and stretchability. The parameter analyzer characterizes the electrical property of the fabricated phototransistor.

横 NIPIN フォト トランジスタを用いた柔軟な画像センサーの作製

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, ...

Hybrid Printing for the Fabrication of Smart Sensors

A method to combine additively manufactured substrates or foils and multilayer inkjet printing for the fabrication of sensor devices is presented. First, three substrates (acrylate, ceramics, and copper) are prepared. To determine the resulting material properties of these substrates, profilometer, contact angle, scanning electron microscope (SEM), and focused ion beam (FIB) measurements are done. The achievable printing resolution and suitable drop volume for each substrate are, then, found through the drop size tests. Then, layers of insulating and conductive ink are inkjet printed alternately to fabricate the target sensor structures. After each printing step, the respective layers are individually treated by photonic curing. The parameters used for the curing of each layer are adapted depending on the printed ink, as well as on the surface properties of the respective substrate. To confirm the resulting conductivity and to determine the quality of the printed surface, four-point probe and profilometer measurements are done. Finally, a measurement set-up and results achieved by such an all-printed sensor system are shown to demonstrate the achievable quality.

Here we present a protocol for the fabrication of inkjet-printed multilayer sensor structures on additively manufactured substrates and foil.

ハイブリッド スマート センサーの作製のための印刷

A method to combine additively manufactured substrates or foils and multilayer inkjet printing for the fabrication of sensor devices is presented. First, ...

Scalable Fabrication of Stretchable, Dual Channel, Microfluidic Organ Chips

A significant number of lead compounds fail in the pharmaceutical pipeline because animal studies often fail to predict clinical responses in human patients. Human Organ-on-a-Chip (Organ Chip) microfluidic cell culture devices, which provide an experimental in vitro platform to assess efficacy, toxicity, and pharmacokinetic (PK) profiles in humans, may be better predictors of therapeutic efficacy and safety in the clinic compared to animal studies. These devices may be used to model the function of virtually any organ type and can be fluidically linked through common endothelium-lined microchannels to perform in vitro studies on human organ-level and whole body-level physiology without having to conduct experiments on people. These Organ Chips consist of two perfused microfluidic channels separated by a permeable elastomeric membrane with organ-specific parenchymal cells on one side and microvascular endothelium on the other, which can be cyclically stretched to provide organ-specific mechanical cues (e.g., breathing motions in lung). This protocol details the fabrication of flexible, dual channel, Organ Chips through casting of parts using 3D printed molds, enabling combination of multiple casting and post-processing steps. Porous poly (dimethyl siloxane) (PDMS) membranes are cast with micrometer sized through-holes using silicon pillar arrays under compression. Fabrication and assembly of Organ Chips involves equipment and steps that can be implemented outside of a traditional cleanroom. This protocol provides researchers with access to Organ Chip technology for in vitro organ- and body-level studies in drug discovery, safety and efficacy testing, as well as mechanistic studies of fundamental biological processes.

Here, we present a protocol that describes the fabrication of stretchable, dual channel, organ chip microfluidic cell culture devices for recapitulating organ-level functionality in vitro.

伸縮性、デュアル チャネル、オルガン マイクロ流体チップのスケーラブルな作製

A significant number of lead compounds fail in the pharmaceutical pipeline because animal studies often fail to predict clinical responses in human ...

テキスタイル上の有機電子デバイスのためのシンプルでスケーラブルな製造方法

要約

さらに動画を探す

この動画の章

ソフトリソグラフィ機能化およびパターニング酸化物フリーシリコンとゲルマニウム

大面積自立超薄ポリマーフィルムの作製

三次元細胞培養用チップサイズの足場の微細加工

バルクヘテロ接合太陽電池の印刷作製と

完全に解決策が処理無機ナノ結晶太陽電池素子の作製

埋め込み金属メッシュを用いた高性能で柔軟で透明な電極のための拡張可能なソリューション処理製作戦略

任意の基板上への共役ポリマー薄膜の反応性蒸着

横 NIPIN フォトトランジスタを用いた柔軟な画像センサーの作製

ハイブリッドスマートセンサーの作製のための印刷

伸縮性、デュアルチャネル、オルガンマイクロ流体チップのスケーラブルな作製

テキスタイル上の有機電子デバイスのためのシンプルでスケーラブルな製造方法

要約

さらに動画を探す

この動画の章

ソフトリソグラフィ機能化およびパターニング酸化物フリーシリコンとゲルマニウム

大面積自立超薄ポリマーフィルムの作製

三次元細胞培養用チップサイズの足場の微細加工

バルクヘテロ接合太陽電池の印刷作製と

完全に解決策が処理無機ナノ結晶太陽電池素子の作製

埋め込み金属メッシュを用いた高性能で柔軟で透明な電極のための拡張可能なソリューション処理製作戦略

任意の基板上への共役ポリマー薄膜の反応性蒸着

横 NIPIN フォト トランジスタを用いた柔軟な画像センサーの作製

ハイブリッド スマート センサーの作製のための印刷

伸縮性、デュアル チャネル、オルガン マイクロ流体チップのスケーラブルな作製

横 NIPIN フォトトランジスタを用いた柔軟な画像センサーの作製

ハイブリッドスマートセンサーの作製のための印刷

伸縮性、デュアルチャネル、オルガンマイクロ流体チップのスケーラブルな作製