Name: a simple and scalable fabrication method for organic electronic devices on textiles
Uploaded: 2017-03-13T15:00:00.000+00:00
Duration: 6 min 21 s
Description: Watch this Scientific Journal Video about A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles at JoVE.com

The authors would like to acknowledge the BPI PIAVE AUTONOTEX grant for the financial support.

섬유 1. 패터닝 실시 폴리머 <ol><li> 과정에서 취급이 용이 평면 표면에 10 ㎝의 섬유 시트를 고정한다. 섬유의 경우, 300 ㎛의 두께와 50 % 니트 방향 연신 능력쪽으로 100 % 연동 니트 폴리 에스테르 직물을 사용한다. </li><li> 패터닝 디자인을 포함하는 마스크를 만들기 위해, 125 ㎛의 두께의 폴리이 미드 필름을 사용한다; 패턴의 예는도 1에 도시되어있다. <ol><li> 패턴 폴리이 미드 마스크 (10)에 레이저 커터 (예를 들어, Protolaser S, LPKF)를 사용하여; 전극 패턴의 디자인은도 1에 도시되어있다. </li><li> 코트 PDMS 제제 (10 : 1베이스 에이전트 비율 경화) 200 ㎛ 또는 (A)에서의 습윤 필름 두께로 자동 테이프 캐스팅 도구 (K 제어 프린트 코터, 닥터 블레이드)을 사용하여 마스크 (폴리이 미드 막)의 위에 6m / 분의 도포 속도. 3cm × 5 cm의 마스크 약 0.5 mL를 사용합니다. 일을 수행흄 후드에서 과정입니다. </li></ol></li><li> 조심스럽게 PDMS 코팅 마스크 직물을 전송합니다. PDMS의 완전 섬유 구조체에 흡수되어야 후 10 분 동안 남겨. </li><li> 10 분 동안 100 ℃에서 공기 오븐에서 샘플을 경화. </li><li> 전도성 중합체를 제조 : PEDOT : PSS 분산액 (80 ㎖), 에틸렌 글리콜 (20 ㎖), 4- 도데 실 벤젠 설 폰산 (40 μL) 및 흄 후드의 3- 메타 크릴 (1 mL)을 첨가 하였다. </li><li> 브러쉬 코트 PEDOT : 용액의 균일 침투 될 때까지 섬유의 PDMS없는 영역 PSS 용액이 얻어진다. 균일 한 패턴 색상을 달성하기 위해이 단계를 반복합니다. 약 1 ㎖ / cm 2를 적용합니다. </li><li> PSS의 해결 방법 : PEDOT를 건조 1 시간 동안 110 ° C에서 직물을 치료. 나일론과 같은 고온 처리에 민감한 직물 60 ℃로 온도를 감소시킨다. </li></ol> 2. 유기 소자의 제조 참고 : 제 1 describ의 프로토콜직물에 전도성 물질의 선택적 증착을 에스. 다음 섹션에서는 스트레치 센서, OECT 트랜지스터, 피부 전극 및 정전 용량 센서와 같은 유기 소자를 제작하는 데 필요한 추가 단계를 설명합니다. <ol><li> 제 1 항에 기재된 바와 같이, 섬유에도 3a에 도시 된 신축성 센서, 패턴 전극 라인을 제조하기 위해, 1.1-1.5 단계. 주 : 패턴 디자인의 예는도 3a에 도시되어있다. 이러한 센서의 제조는 추가 단계가 필요하지 않습니다. </li><li> 도 3b에 도시 된 트랜지스터 디자인을 제조하기 위해, 패턴을 제 1에 기재된 단계에 따라 나일론 직조 리본 트랜지스터 어레이 살짝 PDMS 소둔 및 PEDOT을 수정 PSS 60 ℃에서 경화시켜 나일론의 열 열화를 방지하기위한 조치를 경화 긴 시간 동안 C. </li><li> 도 3c에 도시 된 피부 전극의 제조, 들면, 증착PSS 직물 : 패턴 PEDOT에 이온 젤. <ol><li> 이온 성 액체 젤 혼합물을 이온 성 액체를 포함하는, 1- 에틸 -3- 메틸이 미다 졸륨 에틸 술 페이트 준비; 가교제, 폴리 (에틸렌 글리콜) 디 아크릴 레이트; 각각 0.6 / 0.35 / 0.05의 (v / v)의 비율로 광개시제, 2- 히드 록시 -2- methylpropiophenone. </li><li> 코트 PEDOT : 이온 성 액체 (20 μL / cm 2)와 PSS 전극과 드롭 주조에 의해 단계 2.3.1 (25 μL / cm 2)에서 이온 성 액체 젤 혼합물을 추가합니다. </li><li> 겔이 응고 될 때까지 10 ~ 15 분 동안 가교 반응을 개시하기 위해 UV 광 (365 ㎚)에 노출시킨다. 흄 후드에서이 단계를 수행합니다. UV 노출시 자외선 보호 케이지를 사용합니다. </li></ol></li><li> 정전 용량 식 센서의 제조에, PEDOT를 사용하는 절연 재료 (도 3D)와 절연 PSS 섬유 전극. <ol><li> 키보드와 같은 절연 시키 PEDOT 다음 PDMS를 사용하는 PSS 전극; 키보드 설계는도 2b &lt;에서 알 수있는/ strong&gt;을. 직물의 맨 위에 PDMS 제제를 분배하고, 스퀴지 초과를 제거합니다. </li><li> 10 분 동안 100 ° C의 오븐에서 직물을 놓는다. 흄 후드에서이 단계를 수행합니다. </li></ol></li></ol>

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The authors have nothing to disclose.

전도성 재료의 패터닝 기능성 전자 소자의 제조에 첫 단계이다. 제조 공정을 고려 이러한 물질의 화학적 및 물리적 특성을 취할 필요가 있으며, 프로세스 흐름은 제조 단계의 물질 상호 호환성을 고려할 필요가 이것은 도전이 될 수있다. 유기 전자 소자의 미세 가공에서, 이들 두 측면 의한 유기물의 높은 반응성 특성 훨씬 더 중요하다. 그러나 오늘날 유기 물질은 전기 탄성 14,</s...

착용 할 수있는 전자 분야는 세 번 현재의 시장을 2025 년에 50,000,000,000유로 가치가있을 것으로 예상 빠르게 성장하는 시장이다. 현재 착용 할 수있는 장치가 직면 한 주요 과제는 방해 고체 전자 첨부 파일이 착용 할 수있는 시스템의 구축 장치의 사용을 제한 할 것입니다. 이미 일상에 존재하는 섬유를 사용하면 이러한 제한을 피하기 위해 매우 매력적이고 간단한 방법이다. 그것의 탄성 기능에, 우리가 입는 옷의 일부가 피부에 밀착 자연적이다. 시장 오늘로 볼 수 있습니다 스마트 의류의 많은 예는 세련된 방법 1 인간과 전자 제품을 연결하는 얇은 플라스틱 디스플레이, 키보드 및 섬유에 포함 된 광원 장치를 기반으로합니다. 스포츠 실제로, 상태 모니터링은 일반적으로 접착제 전극과 금속 팔찌를 사용하기 편안한 대안을 제공 섬유 전극을 사용합니다. 여기서, 도전성 섬유는직접 피부 자극과 확장 착용하는 동안 다른 불편을 방지하기 위해 신축성 직물과 통합. 또한, 섬유는 땀 4에서 분석 물의 검출을 통해 바이오 센서를 통합 확실히 작용 로봇 액추에이터 (3)의 발전 전단 센서를 통합하고, 움직임이 캡처 곡률 센서를 통합하는 기회들을 제공한다. 현대 착용 할 수있는 기술은 고유 한 특성을 가진 전자 기기를 제공하는 탄소 기반의 반도체 재료에 의존한다. 유기물의 &quot;소프트&quot;특성은 전통적인 고체 전자에 비해, 인체와의 인터페이스를 위해 더 나은 기계적 특성을 제공한다. 기계적 유연성 기재와 짝이 기계적 호환성은, 예컨대 섬유와 같은 장치에서 비평 폼 팩터의 사용을 가능하게한다. 유기물의 사용은 그들의 혼합 ELE에도 생명 과학 관련ctronic 및 이온 전도도 5. 게다가, 유기 반도체 및 광전자 재료는 디스플레이, 트랜지스터 로직, 및 전력 기능 6, 7, 8, 9와 기능 소자의 큰 다양성을 강화할. 유기 소자의 제조에있어서 가장 큰 어려움은 직물의 비평 탄 표면에 기능성 물질의 증착을 제어한다. 종래의 미세 가공 기술은 주로 섬유 기질의 구조 차원으로 증착 프로세스의 호환성에 의해 제한된다. 여기에서는 구성 섬유에 전도성 중합체의 선택적인 증착을 가능하게하는 간단하고 확장 가능한 제조 프로토콜을 설명한다. 제시된 과정은 착용 및 등각 전자 장치의 제조를 가능하게한다. 이 접근법은 (C)의 패터닝에 기초ommercially 가능한 전도성 고분자, 폴리 (3,4- 에틸렌 디옥 시티 오펜) : 폴리 (스티렌 설포 네이트) (PEDOT : PSS) 및 섬유에 탄성 스텐실 재료 폴리 디메틸 실록산 (PDMS). 뿐만 아니라 섬유의 부드럽고 신축성 특성의 유지를 위해, PSS 솔루션 :이 조합은 효율적인 수성 PEDOT의 구속 수 있습니다. 이 간단하고 신뢰성있는 제조 방법은 직접 비용 효율적이며 공업 적으로 확장 가능한 방식으로 직물에 전자 제품의 다양한 제조 방법을위한 포장한다.

<table><tbody><tr><td>SYLGARD 184, Silicone elastomer kit (Base and Curing agent)</td><td>Dow Corning</td><td></td><td>PDMS elastomer</td></tr><tr><td colspan="4">&lt;strong&gt;The conducting polymer formulation&lt;/strong&gt;</td></tr><tr><td>CleviosTM PH 1000 PEDOT:PSS</td><td>Heraeus</td><td></td><td>Conductive polymer</td></tr><tr><td>Ethylene glycol</td><td>Sigma-Aldrich</td><td>03750-250ML</td><td>Solvent (EG), CAS: 107-21-1</td></tr><tr><td>3-methacryloxypropyltrimethoxysilane</td><td>Sigma-Aldrich</td><td>M6514</td><td>Cros linker (GOPs), CAS: 2530-85-0</td></tr><tr><td>4-dodecylbenzenesulfonic acid</td><td>Sigma-Aldrich</td><td>44198</td><td>DBSA; CAS: 121-65-3</td></tr><tr><td colspan="4">&lt;strong&gt;The ionic liquid gel&lt;/strong&gt;</td></tr><tr><td>UV lamp DFE 2340</td><td>C.I.F/ ATHELEC</td><td>DP134</td><td>UV-365 nm</td></tr><tr><td>1-Ethyl-3-methylimidazolium ethyl sulfate</td><td>Sigma-Aldrich</td><td>51682-100G-F</td><td>Ionic Liquid (IL), CAS: 342573-75-5</td></tr><tr><td>Poly(ethylene glycol) diacrylate</td><td>Sigma-Aldrich</td><td>455008-100ML</td><td>Mn 700, CAS: 26570-48-9</td></tr><tr><td>2-Hydroxy-2-methylpropiophenon</td><td>Sigma-Aldrich</td><td>405655-50ML</td><td>Phot Initiator (PI), CAS: 7473-98-5</td></tr><tr><td>The textile fabric</td><td>VWR</td><td>Spec-Wipe 7 Wipers</td><td>100% interlock knit polyester fabric</td></tr><tr><td>The polyimide film</td><td>DuPont</td><td>HN100</td><td>Polyimide film with 125 &amp;micro;m thickness</td></tr></tbody></table>

a simple and scalable fabrication method for organic electronic devices on textiles

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices cannot be worn under everyday conditions. Therefore, textiles are commonly considered the best substrate to accommodate electronic devices in wearable use. In this paper, we describe how to selectively pattern organic electroactive materials on textiles from a solution in an easy and scalable manner. This versatile deposition technique enables the fabrication of wearable organic electronic devices on clothes.

직물에 색 또는 패턴을 적용하기위한 전통적인 방법은 염료를 선택적으로 증착 할 수 있도록 이동식 마스킹 층에 의존한다. 직물에 PSS 전극도 1에서는 PEDOT의 패터닝에 이러한 방식의 적응을 나타낸다. PSS 솔루션 : 마스킹 층으로, 우리는 수성 PEDOT의 비 제어 확산을 억제 할 수 소수성 폴리 디메틸 실록산을 사용했다. 또한, 부드러움과 니트와 짠 직물의 신축?...

Watch this Scientific Journal Video about A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles at JoVE.com

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

본 논문에서는 선택적으로 웨어러블 유기 전자 장치의 직접 통합 할 수 섬유에 유기 물질을 증착하는 프로토콜을 제시한다. 제작 된 소자는 완전히 기계적 모양을 존중하고 감지 기능을 가능하게 직물에 통합 될 수있다.

섬유에 유기 전자 장치를위한 간편하고 확장 가능한 제조 방법

Today, wearable electronics devices combine a large variety of functional, stretchable, and flexible technologies. However, in many cases, these devices ...

a-simple-scalable-fabrication-method-for-organic-electronic-devices

Research

JoVE Journal

Bioengineering

10.4K 조회수.  Ecole Nationale Supérieure des Mines de Saint-Étienne, CMP-EMSE, MOC.  본 논문에서는 선택적으로 웨어러블 유기 전자 장치의 직접 통합 할 수 섬유에 유기 물질을 증착하는 프로토콜을 제시한다. 제작 된 소자는 완전히 기계적 모양을 존중하고 감지 기능을 가능하게 직물에 통합 될 수있다. 

비디오: A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a stable interface that permits efficient electron transport and protects underlying substrates from oxidative degradation. Group IV semiconductors can be effectively protected with highly-ordered self-assembled monolayers (SAMs) composed of simple alkyl chains that act as impervious barriers to both organic and aqueous solutions. Simple alkyl SAMs, however, are inert and not amenable to traditional patterning techniques. The motivation for immobilizing organic molecular systems on semiconductors is to impart new functionality to the surface that can provide optical, electronic, and mechanical function, as well as chemical and biological activity. 
Microcontact printing (&mu;CP) is a soft-lithographic technique for patterning SAMs on myriad surfaces.1-9 Despite its simplicity and versatility, the approach has been largely limited to noble metal surfaces and has not been well developed for pattern transfer to technologically important substrates such as oxide-free silicon and germanium. Furthermore, because this technique relies on the ink diffusion to transfer pattern from the elastomer to substrate, the resolution of such traditional printing is essentially limited to near 1 &mu;m.10-16
In contrast to traditional printing, inkless &mu;CP patterning relies on a specific reaction between a surface-immobilized substrate and a stamp-bound catalyst. Because the technique does not rely on diffusive SAM formation, it significantly expands the diversity of patternable surfaces. In addition, the inkless technique obviates the feature size limitations imposed by molecular diffusion, facilitating replication of very small (&lt;200 nm) features.17-23 However, up till now, inkless &mu;CP has been mainly used for patterning relatively disordered molecular systems, which do not protect underlying surfaces from degradation.
Here, we report a simple, reliable high-throughput method for patterning passivated silicon and germanium with reactive organic monolayers and demonstrate selective functionalization of the patterned substrates with both small molecules and proteins. The technique utilizes a preformed NHS-reactive bilayered system on oxide-free silicon and germanium. The NHS moiety is hydrolyzed in a pattern-specific manner with a sulfonic acid-modified acrylate stamp to produce chemically distinct patterns of NHS-activated and free carboxylic acids. A significant limitation to the resolution of many &mu;CP techniques is the use of PDMS material which lacks the mechanical rigidity necessary for high fidelity transfer. To alleviate this limitation we utilized a polyurethane acrylate polymer, a relatively rigid material that can be easily functionalized with different organic moieties. Our patterning approach completely protects both silicon and germanium from chemical oxidation, provides precise control over the shape and size of the patterned features, and gives ready access to chemically discriminated patterns that can be further functionalized with both organic and biological molecules. The approach is general and applicable to other technologically-relevant surfaces.

Here we describe a simple method for patterning oxide-free silicon and germanium with reactive organic monolayers and demonstrate functionalization of the patterned substrates with small molecules and proteins. The approach completely protects surfaces from chemical oxidation, provides precise control over feature morphology, and provides ready access to chemically discriminated patterns.

소프트 리소그래피 작용화 및 Patterning 산화물없는 실리콘과 게르마늄

The development of hybrid electronic devices relies in large part on the integration of (bio)organic materials and inorganic semiconductors through a ...

연구

생체공학

Fabrication of Large-area Free-standing Ultrathin Polymer Films

This procedure describes a method for the fabrication of large-area and ultrathin free-standing polymer films. Typically, ultrathin films are prepared using either sacrificial layers, which may damage the film or affect its mechanical properties, or they are made on freshly cleaved mica, a substrate that is difficult to scale. Further, the size of ultrathin film is typically limited to a few square millimeters. In this method, we modify a surface with a polyelectrolyte that alters the strength of adhesion between polymer and deposition substrate. The polyelectrolyte can be shown to remain on the wafer using spectroscopy, and a treated wafer can be used to produce multiple films, indicating that at best minimal amounts of the polyelectrolyte are added to the film. The process has thus far been shown to be limited in scalability only by the size of the coating equipment, and is expected to be readily scalable to industrial processes. In this study, the protocol for making the solutions, preparing the deposition surface, and producing the films is described.

We describe a method for the fabrication of large-area (up to 13 cm diameter) and ultrathin (as thin as 8 nm) polymer films. Instead of using a sacrificial interlayer to delaminate the film from its substrate, we use a self-limiting surface treatment suitable for arbitrarily large areas.

대 면적의 제작은 초박막 고분자 필름을 무료 서

This procedure describes a method for the fabrication of large-area and ultrathin free-standing polymer films.  Typically, ultrathin films are prepared ...

화학

Microfabrication of Chip-sized Scaffolds for Three-dimensional Cell cultivation

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell cultivation. These technologies offer a wide spectrum of advantages not only for manufacturing but also for different applications. The size and shape of formed cell clusters can be influenced by the exact and reproducible architecture of the microfabricated scaffold and, therefore, the diffusion path length of nutrients and gases can be controlled.1 This is unquestionably a useful tool to prevent apoptosis and necrosis of cells due to an insufficient nutrient and gas supply or removal of cellular metabolites.
Our polymer chip, called CellChip, has the outer dimensions of 2 x 2 cm with a central microstructured area. This area is subdivided into an array of up to 1156 microcontainers with a typical dimension of 300 m edge length for the cubic design (cp- or cf-chip) or of 300 m diameter and depth for the round design (r-chip).2
So far, hot embossing or micro injection moulding (in combination with subsequent laborious machining of the parts) was used for the fabrication of the microstructured chips. Basically, micro injection moulding is one of the only polymer based replication techniques that, up to now, is capable for mass production of polymer microstructures.3 However, both techniques have certain unwanted limitations due to the processing of a viscous polymer melt with the generation of very thin walls or integrated through holes. In case of the CellChip, thin bottom layers are necessary to perforate the polymer and provide small pores of defined size to supply cells with culture medium e.g. by microfluidic perfusion of the containers.
In order to overcome these limitations and to reduce the manufacturing costs we have developed a new microtechnical approach on the basis of a down-scaled thermoforming process. For the manufacturing of highly porous and thin walled polymer chips, we use a combination of heavy ion irradiation, microthermoforming and track etching. In this so called "SMART" process (Substrate Modification And Replication by Thermoforming) thin polymer films are irradiated with energetic heavy projectiles of several hundred MeV introducing so-called "latent tracks" Subsequently, the film in a rubber elastic state is formed into three dimensional parts without modifying or annealing the tracks. After the forming process, selective chemical etching finally converts the tracks into cylindrical pores of adjustable diameter.

We present two processes for the microfabrication of porous polymer chips for three-dimensional cell cultivation. The first one is hot embossing combined with a solvent vapour welding process. The second one uses a recently developed microthermoforming process combined with ion track technology leading to a significant simplification of manufacture.

입체 세포 배양을위한 칩 크기의 공사장 공중 발판의 Microfabrication

Using microfabrication technologies is a prerequisite to create scaffolds of reproducible geometry and constant quality for three-dimensional cell ...

생물학

Printing Fabrication of Bulk Heterojunction Solar Cells and In Situ Morphology Characterization

Polymer-based materials hold promise as low-cost, flexible efficient photovoltaic devices. Most laboratory efforts to achieve high performance devices have used devices prepared by spin coating, a process that is not amenable to large-scale fabrication. This mismatch in device fabrication makes it difficult to translate quantitative results obtained in the laboratory to the commercial level, making optimization difficult. Using a mini-slot die coater, this mismatch can be resolved by translating the commercial process to the laboratory and characterizing the structure formation in the active layer of the device in real time and in situ as films are coated onto a substrate. The evolution of the morphology was characterized under different conditions, allowing us to propose a mechanism by which the structures form and grow. This mini-slot die coater offers a simple, convenient, material efficient route by which the morphology in the active layer can be optimized under industrially relevant conditions. The goal of this protocol is to show experimental details of how a solar cell device is fabricated using a mini-slot die coater and technical details of running in situ structure characterization using the mini-slot die coater.

Printing Fabrication of Bulk Heterojunction Solar Cells and In Situ Morphology Characterization

Here, we present a protocol to fabricate organic thin film solar cells using a mini-slot die coater and related in-line structure characterizations using synchrotron scattering techniques.

벌크 이종 접합 태양 전지의 인쇄 제작 및<em&gt; 현장에서</em&gt; 형태학 특성

Polymer-based materials hold promise as low-cost, flexible efficient photovoltaic devices. Most laboratory efforts to achieve high performance devices ...

공학

Fabrication of Fully Solution Processed Inorganic Nanocrystal Photovoltaic Devices

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal inks. For the photoactive absorber layer, colloidal CdTe and CdSe nanocrystals (3-5 nm) are synthesized using an inert hot injection technique and cleaned with precipitations to remove excess starting reagents. Similarly, gold nanocrystals (3-5 nm) are synthesized under ambient conditions and dissolved in organic solvents. In addition, precursor solutions for transparent conductive indium tin oxide (ITO) films are prepared from solutions of indium and tin salts paired with a reactive oxidizer. Layer-by-layer, these solutions are deposited onto a glass substrate following annealing (200-400 &#176;C) to build the nanocrystal solar cell (glass/ITO/CdSe/CdTe/Au). Pre-annealing ligand exchange is required for CdSe and CdTe nanocrystals where films are dipped in NH4Cl:methanol to replace long-chain native ligands with small inorganic Cl- anions. NH4Cl(s) was found to act as a catalyst for the sintering reaction (as a non-toxic alternative to the conventional CdCl2(s) treatment) leading to grain growth (136&#177;39 nm) during heating. The thickness and roughness of the prepared films are characterized with SEM and optical profilometry. FTIR is used to determine the degree of ligand exchange prior to sintering, and XRD is used to verify the crystallinity and phase of each material. UV/Vis spectra show high visible light transmission through the ITO layer and a red shift in the absorbance of the cadmium chalcogenide nanocrystals after thermal annealing. Current-voltage curves of completed devices are measured under simulated one sun illumination. Small differences in deposition techniques and reagents employed during ligand exchange have been shown to have a profound influence on the device properties. Here, we examine the effects of chemical (sintering and ligand exchange agents) and physical treatments (solution concentration, spray-pressure, annealing time and annealing temperature) on photovoltaic device performance.

This protocol describes the synthesis and solution deposition of inorganic nanocrystals layer by layer to produce thin film electronics on non-conductive surfaces. Solvent-stabilized inks can produce complete photovoltaic devices on glass substrates via spin and spray coating following post-deposition ligand exchange and sintering.

완전 해결 가공 된 무기 나노 결정 태양 광 발전 장치의 제작

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal ...

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a polymer film. This paper also presents a low-cost, vacuum-free fabrication method for this novel TE; the approach combines lithography, electroplating, and imprint transfer (LEIT) processing. The embedded nature of the EMTEs offers many advantages, such as high surface smoothness, which is essential for organic electronic device production; superior mechanical stability during bending; favorable resistance to chemicals and moisture; and strong adhesion with plastic film. LEIT fabrication features an electroplating process for vacuum-free metal deposition and is favorable for industrial mass production. Furthermore, LEIT allows for the fabrication of metal mesh with a high aspect ratio (i.e., thickness to linewidth), significantly enhancing its electrical conductance without adversely losing optical transmittance. We demonstrate several prototypes of flexible EMTEs, with sheet resistances lower than 1 &#937;/sq and transmittances greater than 90%, resulting in very high figures of merit (FoM) &#8211; up to 1.5 x 104 &#8211; which are amongst the best values in the published literature.

This protocol describes a solution-based fabrication strategy for high-performance, flexible, transparent electrodes with fully-embedded, thick metal mesh. Flexible transparent electrodes fabricated by this process demonstrate among the highest reported performances, including ultra-low sheet resistance, high optical transmittance, mechanical stability under bending, strong substrate adhesion, surface smoothness, and environmental stability.

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a ...

Reactive Vapor Deposition of Conjugated Polymer Films on Arbitrary Substrates

We demonstrate a method of conformally coating conjugated polymers on arbitrary substrates using a custom-designed, low-pressure reaction chamber. Conductive polymers, poly(3,4-ethylenedioxythiophene) (PEDOT) and poly(3,4-propylenedioxythiophene) (PProDOT), and a semiconducting polymer, poly(thieno[3,2-b]thiophene) (PTT), were deposited on unconventional highly-disordered and textured substrates with high surface areas, such as paper, towels and fabrics. This reported deposition chamber is an improvement of previous vapor reactors because our system can accommodate both volatile and nonvolatile monomers, such as 3,4-propylenedioxythiophene and thieno[3,2-b]thiophene. Utilization of both solid and liquid oxidants are also demonstrated. One limitation of this method is that it lacks sophisticated in situ thickness monitors. Polymer coatings made by the commonly used solution-based coating methods, such as spin-coating and surface grafting, are often not uniform or susceptible to mechanical degradation. This reported vapor phase deposition method overcomes those drawbacks and is a strong alternative to common solution-based coating methods. Notably, polymer films coated by the reported method are uniform and conformal on rough surfaces, even at a micrometer scale. This feature allows for future application of vapor deposited polymers in electronics devices on flexible and highly textured substrates.

This paper presents a protocol for reactive vapor deposition of poly(3,4-ethylenedioxythiophene), poly(3,4-propylenedioxythiophene), and poly(thieno[3,2-b]thiophene) films on glass slides and rough substrates, such as textiles and paper.

임의 기판에 활용 된 고분자 필름의 반응성 증 착

We demonstrate a method of conformally coating conjugated polymers on arbitrary substrates using a custom-designed, low-pressure reaction chamber. ...

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, but several challenging points remain, such as a low absorption efficiency due to a thin active layer and low flexibility. We present an advanced method to fabricate a flexible phototransistor array with an improved electrical performance. The outstanding electrical performance is driven by a low dark current owing to deep impurity doping. Stretchable and flexible metal interconnectors simultaneously offer electrical and mechanical stabilities in a highly deformed state. The protocol explicitly describes the fabrication process of the phototransistor using a thin silicon membrane. By measuring I-V characteristics of the completed device in deformed states, we demonstrate that this approach improves the mechanical and electrical stabilities of the phototransistor array. We expect that this approach to a flexible phototransistor can be widely used for the applications of not only next-generation imaging systems/optoelectronics but also wearable devices such as tactile/pressure/temperature sensors and health monitors.

We present a detailed method to fabricate a deformable lateral NIPIN phototransistor array for curved image sensors. The phototransistor array with an open mesh form, which is composed of thin silicon islands and stretchable metal interconnectors, provides flexibility and stretchability. The parameter analyzer characterizes the electrical property of the fabricated phototransistor.

측면 NIPIN 포토 트랜지스터에 따라 유연한 이미지 센서의 제조

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, ...

Hybrid Printing for the Fabrication of Smart Sensors

A method to combine additively manufactured substrates or foils and multilayer inkjet printing for the fabrication of sensor devices is presented. First, three substrates (acrylate, ceramics, and copper) are prepared. To determine the resulting material properties of these substrates, profilometer, contact angle, scanning electron microscope (SEM), and focused ion beam (FIB) measurements are done. The achievable printing resolution and suitable drop volume for each substrate are, then, found through the drop size tests. Then, layers of insulating and conductive ink are inkjet printed alternately to fabricate the target sensor structures. After each printing step, the respective layers are individually treated by photonic curing. The parameters used for the curing of each layer are adapted depending on the printed ink, as well as on the surface properties of the respective substrate. To confirm the resulting conductivity and to determine the quality of the printed surface, four-point probe and profilometer measurements are done. Finally, a measurement set-up and results achieved by such an all-printed sensor system are shown to demonstrate the achievable quality.

Here we present a protocol for the fabrication of inkjet-printed multilayer sensor structures on additively manufactured substrates and foil.

스마트 센서의 제조에 인쇄 하는 하이브리드

A method to combine additively manufactured substrates or foils and multilayer inkjet printing for the fabrication of sensor devices is presented. First, ...

Scalable Fabrication of Stretchable, Dual Channel, Microfluidic Organ Chips

A significant number of lead compounds fail in the pharmaceutical pipeline because animal studies often fail to predict clinical responses in human patients. Human Organ-on-a-Chip (Organ Chip) microfluidic cell culture devices, which provide an experimental in vitro platform to assess efficacy, toxicity, and pharmacokinetic (PK) profiles in humans, may be better predictors of therapeutic efficacy and safety in the clinic compared to animal studies. These devices may be used to model the function of virtually any organ type and can be fluidically linked through common endothelium-lined microchannels to perform in vitro studies on human organ-level and whole body-level physiology without having to conduct experiments on people. These Organ Chips consist of two perfused microfluidic channels separated by a permeable elastomeric membrane with organ-specific parenchymal cells on one side and microvascular endothelium on the other, which can be cyclically stretched to provide organ-specific mechanical cues (e.g., breathing motions in lung). This protocol details the fabrication of flexible, dual channel, Organ Chips through casting of parts using 3D printed molds, enabling combination of multiple casting and post-processing steps. Porous poly (dimethyl siloxane) (PDMS) membranes are cast with micrometer sized through-holes using silicon pillar arrays under compression. Fabrication and assembly of Organ Chips involves equipment and steps that can be implemented outside of a traditional cleanroom. This protocol provides researchers with access to Organ Chip technology for in vitro organ- and body-level studies in drug discovery, safety and efficacy testing, as well as mechanistic studies of fundamental biological processes.

Here, we present a protocol that describes the fabrication of stretchable, dual channel, organ chip microfluidic cell culture devices for recapitulating organ-level functionality in vitro.

Stretchable, 듀얼 채널, 미세 기관 칩의 확장 가능한 제작

A significant number of lead compounds fail in the pharmaceutical pipeline because animal studies often fail to predict clinical responses in human ...