Comparative Study of Simulation of Temperature Rise in Ring Main UnitXiang Wang 1, Qianxi Sun 1, Chengji Lu 2, Minkai Zhang 2, Jiangcheng Jin 2, Linsen Mu 3, Enlin Li 3, Anxin Wang 3, Mingge Wu 1,2,3,4
1College of Mechanical and Electrical Engineering, Wenzhou University, 2Institute of Laser and Optoelectronic Intelligent Manufacturing, Wenzhou University, 3Wecome Intelligent Manufacturing Co., Ltd., 4College of Mechanical Engineering, Nanjing University of Aeronautics and Astronautics
This paper addresses the temperature rise problem of the ring main unit by establishing a simplified model and conducting a comparative analysis in two temperature field-solving modules.
