这项工作得到了香港特别行政区研究资助委员会（第17246116号）综合研究基金，中国国家自然科学基金（61306123）青年学者计划，基础研究计划 - 深圳市科技创新委员会通用计划（JCYJ20140903112959959），浙江省科技厅重点研究发展计划（2017C01058）。作者感谢Y.-T.黄和SP峰对光学测量的帮助。

注意:请注意电子束的安全。请戴上正确的防护眼镜和衣服。另外，请仔细处理所有易燃溶剂和溶液。 1.基于光刻的EMTE制造<ol><li> 光刻用于制造网格图案。 <ol><li>使用棉签将液体洗涤剂清洁FTO玻璃基板（3厘米×3厘米）。用干净的棉签将去离子水（DI）水彻底冲洗干净。使用超声波（频率= 40 kHz，温度= 25°C）在异丙醇（IPA）中进行30秒清洗，然后用压缩空气干燥。 小心:小心处理压缩空气。 </li><li> Spincoat在清洁的FTO玻璃上100μL光刻胶，以4,000rpm旋转60秒（对于2cm半径的样品，约350×g），得到1.8μm厚均匀的膜。 </li><li>将光致抗蚀剂膜在电热板上烘烤50秒100°C。 </li><li>使用UV掩模对准器以20mJ / cm 2的剂量通过具有网格图案（3μm线宽，50μm间距）的光掩模曝光光致抗蚀剂膜。 </li><li>通过将样品浸入显影液中50秒来显影光致抗蚀剂。 </li><li>用去离子水冲洗样品并用压缩空气干燥。 小心:小心处理压缩空气。 </li></ol></li><li> 电沉积金属。 <ol><li>将100mL镀铜水溶液倒入250 mL烧杯中。 注意:其他含水电镀溶液（ 如银，金，镍和锌）可用于制造具有各自金属的EMTE。 注意:注意化学品安全。 </li><li>将光致抗蚀剂覆盖的FTO玻璃连接到双电极电沉积装置的负极端子，并将其浸入作为工作电极的电镀溶液中。 </li><li>连接铜金属棒到作为对电极的双电极电沉积装置的正极。 </li><li>使用电压/电流源和测量仪器（ 例如源计量仪表）提供恒定的5 mA电流（电流密度:〜3 mA / cm 2 ）15分钟，以将金属沉积到约1.5μm的厚度。 </li><li>用去离子水彻底冲洗光刻胶涂覆的FTO玻璃样品，并用压缩空气干燥。 小心:小心处理压缩空气。 </li><li>将光刻胶涂覆的FTO玻璃样品放入丙酮中5分钟以溶解光致抗蚀剂膜，裸露的金属网眼在FTO玻璃的顶部。 </li></ol></li><li> 将金属网的热压印转印到柔性基板上。 <ol><li>将金属网覆盖的FTO玻璃样品放在热打印机的电加热压板上，并在样品的顶部放置100μm厚的柔性环烯烃共聚物（COC）膜，面向金属网面。 </li><li>将加热压机的板加热至100°C。 </li><li>施加15MPa的压印压力并保持5分钟。 小心:使用加热按压时要注意安全。 注意:压印可以在更低的压力下进行;这里报道的压力值（15MPa）相对较高。使用这种高压来确保金属网完全嵌入COC膜中。 </li><li>将加热的压板冷却至40°C的脱模温度。 </li><li>释放印记压力。 </li><li>从FTO玻璃上剥离COC膜，金属网完全嵌入COC膜中。 </li></ol></li></ol>亚微米EMTE的制造<ol><li> 使用电子束光刻（EBL）制造亚微米EMTE。 <ol><li> Spincoat在清洁的FTO玻璃上100μL聚甲基丙烯酸甲酯（PMMA）溶液（15k MW，苯甲醚为4重量％），用于60 sat 2,500rpm（对于具有2cm半径的样品，约140×g），以获得150nm厚均匀的膜。 </li><li>在170℃下将PMMA薄膜烘烤30分钟。 </li><li>打开EBL系统，并使用图案发生器29设计网格图案（400nm线宽，5μm间距）。 </li><li>将样品置于连接到图案发生器的扫描电子显微镜中，并执行写入过程29 。 </li><li>在甲基异丙基酮和异丙醇的混合溶液中以1:3的比例将抗蚀剂显影60秒。 </li><li>用去离子水冲洗样品并用压缩空气干燥。 小心:小心处理压缩空气。 </li><li>将100毫升铜水溶液放在中型烧杯中。 注意:其他含水电镀溶液（ 如银，金，镍和镀锌溶液）应用于制造具有各自金属的EMTE。/ LI&gt; <li>将PMMA涂层的FTO玻璃连接到双电极电沉积装置的负极端子，将其浸入电镀液中作为工作电极，并将铜金属棒连接到正极端子以完成电路。 注意:其他金属棒（ 即银，金，镍和锌）应用于相应的金属电沉积。 </li><li>将对应于大约3mA / cm 2的电流密度的合适电流施加到网格图案区域2分钟以将金属沉积到约200nm的厚度（实际厚度必须通过SEM或AFM确定）。 </li><li>用去离子水仔细洗涤样品并置于丙酮中5分钟以溶解PMMA膜。 </li><li>将金属网覆盖的FTO玻璃样品放在热冲击器的电加热板上，并将COC膜（100μm厚）放置在样品的顶部。 </li><li>将板加热至100°C，应用15MPa压印压力，并保持5分钟。 </li><li>将加热的压板冷却至40°C的脱模温度，释放压印压力。 </li><li>从FTO玻璃上剥离COC膜，以及完全嵌入COC膜中的亚微米金属网。 </li></ol></li></ol> 3. EMTE的性能测量<ol><li> 薄片电阻测量。 <ol><li>在正方形样品的两个相对边缘上涂抹银浆，并等待干燥。 </li><li>按照设备说明，将电阻测量装置的四个探头小心地放在银垫上。 </li><li>切换到电源/测量仪器的电阻测量模式，并在显示屏上记录该值。 </li></ol></li><li> 光传输测量。 <ol><li>打开UV-Vis测量设置并校准光谱仪（ 即，将读数相关联ha标准样品检查仪器的准确性）。 </li><li>将EMTE样品放在光谱仪样品架上，并正确对准光学方向。 </li><li>调整光谱仪100％的透光率。 注意:此处提供的所有透射率值通过裸露的COC膜基材归一化为绝对透射率。 </li><li>测量样品的透射率。 </li><li>保存设置的测量和注销。 </li></ol></li></ol>

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R., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Resolution+Limits+of+Electron-Beam+Lithography+toward+the+Atomic+Scale.">Resolution Limits of Electron-Beam Lithography toward the Atomic Scale.</a> Nano Lett. 13 (4), 1555-1558 (2013).</li><li>Khan, A., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Solution-processed+Transparent+Nickel-mesh+Counter+Electrode+with+In-situ+Electrodeposited+Platinum+Nanoparticles+for+Full-Plastic+Bifacial+Dye-sensitized+Solar+Cells.">Solution-processed Transparent Nickel-mesh Counter Electrode with In-situ Electrodeposited Platinum Nanoparticles for Full-Plastic Bifacial Dye-sensitized Solar Cells.</a> ACS Appl Mater Interfaces. 9 (9), 8083-8091 (2017).</li><li>Lee, J., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=A+dual-scale+metal+nanowire+network+transparent+conductor+for+highly+efficient+and+flexible+organic+light+emitting+diodes.">A dual-scale metal nanowire network transparent conductor for highly efficient and flexible organic light emitting diodes.</a> Nanoscale. 9 (5), 1978-1985 (2017).</li><li>Khan, S., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Direct+patterning+and+electrospray+deposition+through+EHD+for+fabrication+of+printed+thin+film+transistors.">Direct patterning and electrospray deposition through EHD for fabrication of printed thin film transistors.</a> Current Appl Phys. 11 (1), S271-S279 (2011).</li></ol>

作者没有什么可以披露的。

我们的制造方法可以进一步修改，以允许样品的特征尺寸和面积的可扩展性以及各种材料的使用。使用EBL成功制造亚微米线宽（ 图3a-3c ）的铜质EMTE证明了LETE制造中的EMTE结构和关键步骤，包括电镀和压印传输，可以可靠地缩小到亚微米范围。类似地，也可以使用其他大面积光刻工艺，例如相移光刻30 ，纳米压印光刻31和带电粒子束光刻...

在全球范围内，正在进行研究以寻找刚性透明导电氧化物（TCO）的替代物，例如氧化铟锡和氟掺杂氧化锡（FTO）膜，以便制造柔性/可拉伸的TE用于将来的柔性/可伸缩光电器件1 。这需要新的材料与新的制造方法。 已经研究了诸如石墨烯2 ，导电聚合物3,4 ，碳纳米管5和随机金属纳米线网络6,7,8,9,10,11等纳米材料，并已经证明了它们在柔性TE中的能力，解决了现有的基于TCO的TE，包括薄弱12 ，低红外透射13 ，低丰度14 。即使有这种潜力，在连续弯曲下也不会发生恶化，仍然难以获得高的电和光电导率。 在这种框架下，正常金属网15,16,17,18,19,20正在发展成为有望的候选者，并且已经实现了非常高的光学透明度和低的薄层电阻，这是可以根据需要调整的。然而，由于众多挑战，广泛使用金属网状TE已经受到阻碍。首先，制造通常涉及昂贵的真空沉积金属16,17 ， </sup&gt; 18，21 。第二，薄膜有机光电器件的厚度可能容易导致电气短路22,23,24,25 。第三，与基材表面的弱粘合导致柔性差26,27 。上述限制已经引起了对基于金属网的新型结构和其制造的可扩展方法的需求。 在本研究中，我们报告了一种新颖的柔性TE结构，其中包含完全嵌入聚合物膜的金属网。我们还描述了一种创新的，基于解决方案的低成本制造方法，其结合光刻，电沉积和印迹转印。样品EMTE已经实现了高达15k的FoM值。由于嵌入式的性质观察到EMTE显着的化学，机械和环境稳定性。此外，在这项工作中建立的解决方案处理的制造技术可以潜在地用于所提出的EMTE的低成本和高产量生产。这种制造技术可扩展到更精细的金属网线宽度，更大面积和一系列金属。

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			<td height="21" style="height:21px;width:241px;">Acetone</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">W332615</td>
			<td style="width:528px;">Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Isopropanol</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">190764</td>
			<td>Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">FTO Glass Substrates</td>
			<td style="width:251px;">South China Xiang S&#38;T, China</td>
			<td style="width:119px;"></td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Photoresist&#160;</td>
			<td style="width:251px;">Clariant, Switzerland</td>
			<td style="width:119px;">54611L11</td>
			<td>AZ 1500 Positive tone resist (20cP)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">UV Mask Aligner&#160;</td>
			<td style="width:251px;">Chinese Academy of Sciences, China</td>
			<td>URE-2000/35</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Photoresist Developer&#160;</td>
			<td style="width:251px;">Clariant, Switzerland</td>
			<td style="width:119px;">184411</td>
			<td>AZ 300 MIF Developer</td>
		</tr>
		<tr height="42">
			<td height="42" style="height:42px;width:241px;">Cu, Ag, Au, Ni, and Zn Electroplating solutions</td>
			<td style="width:251px;">Caswell, USA</td>
			<td style="width:119px;"></td>
			<td>Ready to use solutions (PLUG N&#39; PLATE)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Keithley 2400 SourceMeter</td>
			<td style="width:251px;">Keithley, USA</td>
			<td style="width:119px;">41J2103</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">COC Plastic Films</td>
			<td style="width:251px;">TOPAS, Germany</td>
			<td style="width:119px;">F13-19-1</td>
			<td>Grade 8007 (Glass transition temperature: 78 &#176;C)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Hydraulic Press&#160;</td>
			<td style="width:251px;">Specac Ltd., UK</td>
			<td style="width:119px;">GS15011</td>
			<td>With low tonnage kit ( 0-1 ton guage)</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Temperature Controller&#160;</td>
			<td style="width:251px;">Specac Ltd., UK</td>
			<td style="width:119px;">GS15515</td>
			<td>Water cooled heated platens and controller</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Chiller&#160;</td>
			<td style="width:251px;">Grant Instruments, UK</td>
			<td style="width:119px;">T100-ST5</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Polymethyl Methacrylate (PMMA)</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">200336</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Anisole</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">96109</td>
			<td>Highly flammable</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">EBL Setup</td>
			<td style="width:251px;">Philips, Netherlands</td>
			<td style="width:119px;">FEI XL30</td>
			<td>Scanning electron microscope equipped with a JC Nabity pattern generator&#160;&#160;</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Isopropyl Ketone&#160;</td>
			<td style="width:251px;">Sigma-Aldrich</td>
			<td style="width:119px;">108-10-1</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">Silver Paste</td>
			<td style="width:251px;">Ted Pella, Inc, USA</td>
			<td style="width:119px;">16031</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:241px;">UV&#8211;Vis Spectrometer&#160;</td>
			<td style="width:251px;">Perkin Elmer, USA</td>
			<td style="width:119px;">L950</td>
			<td></td>
		</tr>
	</tbody>
</table>

scalable solution-processed fabrication strategy for high-performance, flexible, transparent electrodes with embedded metal mesh

在这里，作者报道了嵌入式金属网状透明电极（EMTE），一种新的透明电极（TE），其中金属网完全嵌入聚合物膜中。本文还为这种新型TE提出了一种低成本，无真空制造方法;该方法结合光刻，电镀和压印传输（LEIT）处理。 EMTE的嵌入性提供了许多优点，如高表面平滑度，这对于有机电子器件生产至关重要;弯曲时机械稳定性好;耐化学品和耐湿性良好;并与塑料薄膜粘附力强。 LEIT制造具有无电镀金属沉积的电镀工艺，有利于工业批量生产。此外，LEIT允许制造具有高纵横比（ 即，厚度至线宽）的金属网，显着增强其导电性而不会不利地丢失光学transmittance。我们展示了几种灵活的EMTE原型，薄片电阻低于1Ω/ sq，透光率大于90％，导致非常高的品质因数（FoM） - 高达1.5 x 10 4 - 这是最佳值出版文献

图1显示了EMTE样品的原理图和制造流程图。 如图1a所示 ，EMTE由完全嵌入聚合物膜中的金属网组成。网格的上表面与基底处于同一水平面上，显示出一般平滑的平台，用于随后的装置生产。制造技术在图1b - e中示意性地解释。在FTO玻璃基板上涂覆光致抗蚀剂膜之后，使用光刻技术通过UV曝光和?...

Watch this Scientific Journal Video about Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh at JoVE.com

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

该协议描述了一种基于解决方案的制造策略，用于高性能，灵活，透明的电极，具有完全嵌入的厚金属网。通过该方法制造的柔性透明电极表现出最高的报告性能，包括超低薄层电阻，高光透射率，弯曲下的机械稳定性，强的基板粘附性，表面光滑度和环境稳定性。

具有嵌入式金属网的高性能，灵活，透明电极的可扩展解决方案处理制造策略

Here, the authors report the embedded metal-mesh transparent electrode (EMTE), a new transparent electrode (TE) with a metal mesh completely embedded in a ...

scalable-solution-processed-fabrication-strategy-for-high-performance

Research

Education

JoVE Core

JoVE Journal

Physics

Engineering

Unit 1

Gauss's Law

SCIENTISTS IN ACTION

10.1K 次观看.  University of Hong Kong. 该协议描述了一种基于解决方案的制造策略，用于高性能，灵活，透明的电极，具有完全嵌入的厚金属网。通过该方法制造的柔性透明电极表现出最高的报告性能，包括超低薄层电阻，高光透射率，弯曲下的机械稳定性，强的基板粘附性，表面光滑度和环境稳定性。 

视频: Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Fabrication of Nano-engineered Transparent Conducting Oxides by Pulsed Laser Deposition

Nanosecond Pulsed Laser Deposition (PLD) in the presence of a background gas allows the deposition of metal oxides with tunable morphology, structure, density and stoichiometry by a proper control of the plasma plume expansion dynamics. Such versatility can be exploited to produce nanostructured films from compact and dense to nanoporous characterized by a hierarchical assembly of nano-sized clusters. In particular we describe the detailed methodology to fabricate two types of Al-doped ZnO (AZO) films as transparent electrodes in photovoltaic devices: 1) at low O2 pressure, compact films with electrical conductivity and optical transparency close to the state of the art transparent conducting oxides (TCO) can be deposited at room temperature, to be compatible with thermally sensitive materials such as polymers used in organic photovoltaics (OPVs); 2) highly light scattering hierarchical structures resembling a forest of nano-trees are produced at higher pressures. Such structures show high Haze factor (&gt;80%) and may be exploited to enhance the light trapping capability. The method here described for AZO films can be applied to other metal oxides relevant for technological applications such as TiO2, Al2O3, WO3 and Ag4O4.

We describe the experimental method to deposit nanostructured oxide thin films by nanosecond Pulsed Laser Deposition (PLD) in the presence of a background gas. By using this method Al-doped ZnO (AZO) films, from compact to hierarchically structured as nano-tree forests, can be deposited.

制备纳米设计的脉冲激光沉积透明导电氧化物

Nanosecond Pulsed  Laser Deposition (PLD) in the presence of a background gas allows the deposition  of metal oxides with tunable morphology, structure, ...

科研

工程学

Picoinjection of Microfluidic Drops Without Metal Electrodes

Existing methods for picoinjecting reagents into microfluidic drops require metal electrodes integrated into the microfluidic chip. The integration of these electrodes adds cumbersome and error-prone steps to the device fabrication process. We have developed a technique that obviates the needs for metal electrodes during picoinjection. Instead, it uses the injection fluid itself as an electrode, since most biological reagents contain dissolved electrolytes and are conductive. By eliminating the electrodes, we reduce device fabrication time and complexity, and make the devices more robust. In addition, with our approach, the injection volume depends on the voltage applied to the picoinjection solution; this allows us to rapidly adjust the volume injected by modulating the applied voltage. We demonstrate that our technique is compatible with reagents incorporating common biological compounds, including buffers, enzymes, and nucleic acids.

We have developed a technique for picoinjecting microfluidic drops that does not require metal electrodes. As such, devices incorporating our technique are simpler to fabricate and to use.

微流控的Picoinjection滴无金属电极

Existing methods for picoinjecting reagents into microfluidic drops require metal electrodes integrated into the microfluidic chip. The integration of ...

Research and Development of High-performance Explosives

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance tests to verify theoretical calculations. For newly developed formulations, the process begins with small-scale mixes, thermal testing, and impact and friction sensitivity. Only then do subsequent larger scale formulations proceed to detonation testing, which will be covered in this paper. Recent advances in characterization techniques have led to unparalleled precision in the characterization of early-time evolution of detonations. The new technique of Photonic Doppler Velocimetry (PDV) for the measurement of detonation pressure will be shared and compared with traditional fiber-optic detonation velocity and plate-dent calculation of detonation pressure. In particular, the role of aluminum in explosive formulations will be discussed. Recent developments led to the development of explosive formulations that result in reaction of aluminum very early in the detonation product expansion. This enhanced reaction leads to changes in the detonation velocity and pressure due to reaction of the aluminum with oxygen in the expanding gas products.

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance tests to verify theoretical calculations. This paper will share typical development tests associated with the measurement of detonation velocity and detonation pressure.

高性能炸药的研究与发展

Developmental testing of high explosives for military applications involves small-scale formulation, safety testing, and finally detonation performance ...

Fabrication of Fully Solution Processed Inorganic Nanocrystal Photovoltaic Devices

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal inks. For the photoactive absorber layer, colloidal CdTe and CdSe nanocrystals (3-5 nm) are synthesized using an inert hot injection technique and cleaned with precipitations to remove excess starting reagents. Similarly, gold nanocrystals (3-5 nm) are synthesized under ambient conditions and dissolved in organic solvents. In addition, precursor solutions for transparent conductive indium tin oxide (ITO) films are prepared from solutions of indium and tin salts paired with a reactive oxidizer. Layer-by-layer, these solutions are deposited onto a glass substrate following annealing (200-400 &#176;C) to build the nanocrystal solar cell (glass/ITO/CdSe/CdTe/Au). Pre-annealing ligand exchange is required for CdSe and CdTe nanocrystals where films are dipped in NH4Cl:methanol to replace long-chain native ligands with small inorganic Cl- anions. NH4Cl(s) was found to act as a catalyst for the sintering reaction (as a non-toxic alternative to the conventional CdCl2(s) treatment) leading to grain growth (136&#177;39 nm) during heating. The thickness and roughness of the prepared films are characterized with SEM and optical profilometry. FTIR is used to determine the degree of ligand exchange prior to sintering, and XRD is used to verify the crystallinity and phase of each material. UV/Vis spectra show high visible light transmission through the ITO layer and a red shift in the absorbance of the cadmium chalcogenide nanocrystals after thermal annealing. Current-voltage curves of completed devices are measured under simulated one sun illumination. Small differences in deposition techniques and reagents employed during ligand exchange have been shown to have a profound influence on the device properties. Here, we examine the effects of chemical (sintering and ligand exchange agents) and physical treatments (solution concentration, spray-pressure, annealing time and annealing temperature) on photovoltaic device performance.

This protocol describes the synthesis and solution deposition of inorganic nanocrystals layer by layer to produce thin film electronics on non-conductive surfaces. Solvent-stabilized inks can produce complete photovoltaic devices on glass substrates via spin and spray coating following post-deposition ligand exchange and sintering.

全面解决方案处理的无机纳米晶体光伏器件的制造

We demonstrate a method for the preparation of fully solution processed inorganic solar cells from a spin and spray coating deposition of nanocrystal ...

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

This paper reports an array-designed C84-embedded Si substrate fabricated using a controlled self-assembly method in an ultra-high vacuum chamber. The characteristics of the C84-embedded Si surface, such as atomic resolution topography, local electronic density of states, band gap energy, field emission properties, nanomechanical stiffness, and surface magnetism, were examined using a variety of surface analysis techniques under ultra, high vacuum (UHV) conditions as well as in an atmospheric system. Experimental results demonstrate the high uniformity of the C84-embedded Si surface fabricated using a controlled self-assembly nanotechnology mechanism, represents an important development in the application of field emission display (FED), optoelectronic device fabrication, MEMS cutting tools, and in efforts to find a suitable replacement for carbide semiconductors. Molecular dynamics (MD) method with semi-empirical potential can be used to study the nanoindentation of C84-embedded Si substrate. A detailed description for performing MD simulation is presented here. Details for a comprehensive study on mechanical analysis of MD simulation such as indentation force, Young&#39;s modulus, surface stiffness, atomic stress, and atomic strain are included. The atomic stress and von-Mises strain distributions of the indentation model can be calculated to monitor deformation mechanism with time evaluation in atomistic level.

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics

This paper reports the nanomaterial fabrication of a fullerene Si substrate inspected and verified by nanomeasurements and molecular dynamic simulation.

探测ç<sub&gt; 84</sub&gt; - 嵌入式硅衬底利用扫描探针显微镜和分子动力学

This paper reports an array-designed C84-embedded Si substrate fabricated using a controlled self-assembly method in an ultra-high vacuum chamber. The ...

A High Performance Impedance-based Platform for Evaporation Rate Detection

This paper describes the method of a novel impedance-based platform for the detection of the evaporation rate. The model compound hyaluronic acid was employed here for demonstration purposes. Multiple evaporation tests on the model compound as a humectant with various concentrations in solutions were conducted for comparison purposes. A conventional weight loss approach is known as the most straightforward, but time-consuming, measurement technique for evaporation rate detection. Yet, a clear disadvantage is that a large volume of sample is required and multiple sample tests cannot be conducted at the same time. For the first time in literature, an electrical impedance sensing chip is successfully applied to a real-time evaporation investigation in a time sharing, continuous and automatic manner. Moreover, as little as 0.5 ml of test samples is required in this impedance-based apparatus, and a large impedance variation is demonstrated among various dilute solutions. The proposed high-sensitivity and fast-response impedance sensing system is found to outperform a conventional weight loss approach in terms of evaporation rate detection.

This paper presents an impedance-based apparatus for evaporation rate detection of solutions. It offers clear advantages over a conventional weight loss approach: a fast response, high-sensitivity detection, a small sample requirement, multiple sample measurements, and easy disassembly for cleaning and reuse purposes.

蒸发速率检测一种基于阻抗高性能平台

This paper describes the method of a novel impedance-based platform for the detection of the evaporation rate. The model compound hyaluronic acid was ...

Detecting the Water-soluble Chloride Distribution of Cement Paste in a High-precision Way

To improve the accuracy of the chloride distribution along the depth of cement paste under cyclic wet-dry conditions, a new method is proposed to obtain a high-precision chloride profile. Firstly, paste specimens are molded, cured, and exposed to cyclic wet-dry conditions. Then, powder samples at different specimen depths are grinded when the exposure age is reached. Finally, the water-soluble chloride content is detected using a silver nitrate titration method, and chloride profiles are plotted. The key to improving the accuracy of the chloride distribution along the depth is to exclude the error in the powderization, which is the most critical step for testing the distribution of chloride. Based on the above concept, the grinding method in this protocol can be used to grind powder samples automatically layer by layer from the surface inward, and it should be noted that a very thin grinding thickness (less than 0.5 mm) with a minimum error less than 0.04 mm can be obtained. The chloride profile obtained by this method better reflects the chloride distribution in specimens, which helps researchers to capture the distribution features that are often overlooked. Furthermore, this method can be applied to studies in the field of cement-based materials, which require high chloride distribution accuracy.

A protocol for obtaining a water-soluble chloride profile by using a high precision milling method is presented.

高精度水泥浆水溶氯分布的检测

To improve the accuracy of the chloride distribution along the depth of cement paste under cyclic wet-dry conditions, a new method is proposed to obtain a ...

Flow-assisted Dielectrophoresis: A Low Cost Method for the Fabrication of High Performance Solution-processable Nanowire Devices

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of nanowires. DEP is used for nanowire analysis, characterization, and for solution-based fabrication of semiconducting devices. The method works by applying an alternating electric field between metallic electrodes. The nanowire formulation is then dropped onto the electrodes which are on an inclined surface to create a flow of the formulation using gravity. The nanowires then align along the gradient of the electric field and in the direction of the liquid flow. The frequency of the field can be adjusted to select nanowires with superior conductivity and lower trap density. 
In this work, flow-assisted DEP is used to create nanowire field effect transistors. Flow-assisted DEP has several advantages: it allows selection of nanowire electrical properties; control of nanowire length; placement of nanowires in specific areas; control of orientation of nanowires; and control of nanowire density in the device. 
The technique can be expanded to many other applications such as gas sensors and microwave switches. The technique is efficient, quick, reproducible, and it uses a minimal amount of dilute solution making it ideal for the testing of novel nanomaterials. Wafer scale assembly of nanowire devices can also be achieved using this technique, allowing large numbers of samples for testing and large-area electronic applications.

In this paper, flow assisted dielectrophoresis is demonstrated for the self-assembly of nanowire devices. The fabrication of a silicon nanowire field effect transistor is shown as an example.

流动辅助介: 一种低成本的制备高性能溶液可纳米线器件的方法

Flow-assisted dielectrophoresis (DEP) is an efficient self-assembly method for the controllable and reproducible positioning, alignment, and selection of ...

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, but several challenging points remain, such as a low absorption efficiency due to a thin active layer and low flexibility. We present an advanced method to fabricate a flexible phototransistor array with an improved electrical performance. The outstanding electrical performance is driven by a low dark current owing to deep impurity doping. Stretchable and flexible metal interconnectors simultaneously offer electrical and mechanical stabilities in a highly deformed state. The protocol explicitly describes the fabrication process of the phototransistor using a thin silicon membrane. By measuring I-V characteristics of the completed device in deformed states, we demonstrate that this approach improves the mechanical and electrical stabilities of the phototransistor array. We expect that this approach to a flexible phototransistor can be widely used for the applications of not only next-generation imaging systems/optoelectronics but also wearable devices such as tactile/pressure/temperature sensors and health monitors.

We present a detailed method to fabricate a deformable lateral NIPIN phototransistor array for curved image sensors. The phototransistor array with an open mesh form, which is composed of thin silicon islands and stretchable metal interconnectors, provides flexibility and stretchability. The parameter analyzer characterizes the electrical property of the fabricated phototransistor.

基于侧向 NIPIN Phototransistors 的柔性图像传感器的研制

Flexible photodetectors have been intensely studied for the use of curved image sensors, which are a crucial component in bio-inspired imaging systems, ...

Fabrication of Superhydrophobic Metal Surfaces for Anti-Icing Applications

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in industry. The wettability of the produced surface was analyzed by bouncing drop experiments and the topography was analyzed by confocal microscopy. In addition, we show various methodologies to measure its durability and anti-icing properties. Superhydrophobic surfaces hold a special texture that must be preserved to keep their water-repellency. To fabricate durable surfaces, we followed two strategies to incorporate a resistant texture. The first strategy is a direct incorporation of roughness to the metal substrate by acid etching. After this surface texturization, the surface energy was decreased by silanization or fluoropolymer deposition. The second strategy is the growth of a ceria layer (after surface texturization) that should enhance the surface hardness and corrosion resistance. The surface energy was decreased with a stearic acid film.
The durability of the superhydrophobic surfaces was examined by a particle impact test, mechanical wear by lateral abrasion, and UV-ozone resistance. The anti-icing properties were explored by studying the ability to repeal subcooled water, freezing delay, and ice adhesion.

We illustrate several methodologies to produce superhydrophobic metal surfaces and to explore their durability and anti-icing properties.

防结冰用超疏水性金属表面的制备

Several ways to produce superhydrophobic metal surfaces are presented in this work. Aluminum was chosen as the metal substrate due to its wide use in ...