这项工作得到了日本文部科学省（MEXT）的日本科学促进会（JSPS）KAKENHI（17J10044）的资助。制造工艺得到了日本文部科学省"纳米技术平台"（项目编号12024046）的支持。作者要感谢东京大学的K. Yamashita先生和平田S. Ms. Hirata女士在TEM观测方面的帮助。

1. 理论计算程序
<ol><li>计算TD的轨迹。在计算中，假设 SEG 掩码足够薄，可以忽略 ART 对 TDD 减少的影响。<ol><li>确定生长表面并用方程表示。例如，使用时间演化参数 n = i、SEG Ge 高度 （h i） 和 SEG Ge 半径 （r i） 表示 SEG Ge 层圆形横截面的时间演变，如补充视频 1a 和等式 （1） 所示: <img alt="Equation 4" src="/files/ftp_upload/58897/58897eq4.jpg" style="opacity: 0.9;"></li>
		<li>确定生长表面上任意位置的法线方向。对于圆形截面SEG Ge，将（x i，yi）处的法线描述为，如<img alt="Equation 7" src="/files/ftp_upload/58897/58897eq7v2.jpg" style="opacity: 0.9;">补充视频1b所示为红线。然后，通过求解以下联立方程组，从点（x i ， y i）获得TD（x i + 1，yi + 1）的边: <img alt="Equation 10" src="/files/ftp_upload/58897/58897eq10.jpg" style="opacity: 0.9;"></li>
		<li>根据TD生成的位置（x 0，0）计算一个TD的轨迹，如补充视频1c所示。换句话说，可以通过上述方法计算任意TD的轨迹。</li>
		<li>假设TD穿透底面并有助于TDD的减少（即，低于SEG Ge层聚结点的TD被半圆柱形空隙捕获并且永远不会出现在顶面）计算TDD。</li>
	</ol></li>
</ol>2. 实验验证程序
<ol><li>赛格面罩准备<ol><li>在制造 SEG 掩模之前，通过准备设计文件来定义 Ge 生长区域。在本工作中，使用商业软件（例如AutoCAD）准备与[110]方向对齐的线和空间图案以及宽度为4毫米的方形Si窗口区域。</li>
		<li>使用软件确定SEG掩模（特别是W窗口和W掩模）的设计。W 窗口是窗口宽度（Si 种子宽度），W 掩模是 SiO2 掩模宽度，使得 SEG Ge 层可以与其相邻层合并。通过单击打开的文件→结构→矩形或多段线来绘制矩形来确定 W窗口和 W蒙版。 注意: 矩形的宽度变为 W窗口，矩形的间隔变为 W掩码。在本工作中，W窗口 和W掩模 的最小值分别为0.5 μm和0.3 μm，这受到所采用的EB光刻系统中分辨率的限制。</li>
		<li>作为参考，绘制宽度为 D 的 4 mm 的方形 Si 窗口区域，视为毯子区域。单击" 打开文件"→结构→矩形或折线 以绘制方形 Si 窗口。使用 图1 所示的原理图准备线和空间图案以及4 mm方形毯区域。</li>
		<li>制备电阻率为1-100 Ω∙cm的B掺杂p-Si（001）衬底。在本工作中，使用4英寸Si基板。必要时用食人鱼溶液（20 mL 30% H 2 O 2 和 80 mL 96% H2SO4 的混合物）清洁基材表面。</li>
		<li>打开管式炉的盖子，使用玻璃棒将硅基板装入炉中。在本工作中，一次氧化10个Si基底。</li>
		<li>通过打开气阀开始将干燥的N2 气体吹入炉中。然后，通过控制阀门将气体流量设置为 0.5 L/m。</li>
		<li>通过更改程序设置退火温度。在本工作中，使用"图案步骤（模式2）"并将工艺温度设置为900°C。 然后，通过推送 函数运行→程序。</li>
		<li>当温度达到900°C时，关闭干燥的N2阀，打开干燥的O 2阀（O 2流量= 1L / m），并保持2小时。 注意:在黄色房间中执行步骤 2.1.9-2.1.16。</li>
		<li>使用旋涂机用表面活性剂（OAP）涂覆氧化的Si基底，然后在110°C下在加热板上烘烤90秒。</li>
		<li>表面活性剂涂覆后，使用旋涂机用光刻胶（例如ZEP520A）涂覆Si基底，然后在180°C下在加热板上烘烤5分钟。</li>
		<li>将表面活性剂和光刻胶装入Si基底到电子束（EB）刻录机中。</li>
		<li>在EB编写器中读取设计文件（在步骤2.1.2中准备）并制作操作文件（WEC文件）。在WEC文件中将剂量设置为120μC / cm2 。基板加载完成后，通过单击单个曝光按钮进行EB 曝光 。</li>
		<li>通过单击 晶圆进位 从EB写入器卸载基板→在曝光结束时卸载。</li>
		<li>在通风室中准备光刻胶显影剂（ZED）和冲洗剂（ZMD）。将暴露的Si基底在室温下浸入显影剂中60秒。</li>
		<li>从显影剂上去除Si基底，然后用N2 气体干燥基板。</li>
		<li>将显好的Si基板放在加热板上，在110°C下烘烤90秒。</li>
		<li>将Si基底浸入缓冲氢氟酸（BHF-63SE）中1分钟，以去除由于EB暴露和发育而暴露在空气中的部分SiO2 层。</li>
		<li>通过浸入有机光刻胶去除剂（例如Hakuri-104）中15分钟，从Si衬底上去除光刻胶。</li>
		<li>将Si衬底浸入0.5%稀释的氢氟酸中4分钟，以去除窗口区域中的稀天然氧化物，但保留SiO2 掩膜。然后加载到超高真空化学气相沉积（UHV-CVD）室中以生长Ge。 图2 显示了本工作中使用的UHV-CVD系统。</li>
	</ol></li>
	<li>外延锗生长<ol><li>将带有SEG掩模的Si衬底（如步骤2.1中制造）装入负载锁定室。</li>
		<li>在操作计算机上显示的 配方 选项卡中设置缓冲液/主生长温度。确定Ge主要生长的持续时间，以便SEG Ge层与相邻层合并。要确定主要增长的持续时间，请考虑 Ge 在{113}平面上的增长率，它决定了面内/横向方向的增长26。在本工作中，将650°C和700°C的主要生长持续时间分别设置为270分钟和150分钟。</li>
		<li>在主窗口中单击 开始 ，然后将Si衬底自动转移到生长室中。 注意:外延锗生长方案（步骤2.2.4-2.2.7）将自动处理。</li>
		<li>在低温（≈380°C）下在负载的Si衬底上生长Ge缓冲液。使用在Ar中稀释9%的GeH 4作为源气，并在缓冲液生长期间将GeH4的分压保持在0.5 Pa。</li>
		<li>在高温下生长Ge主层。在主要生长期间将GeH4 的分压保持在0.8 Pa。在本工作中，使用650和700 °C两种不同的温度作为主要生长温度，以便将SEG Ge与圆形截面和{113}面截面25进行比较。 注意:（001）平面上Ge的生长速率为11.7nm/min，与温度无关。</li>
		<li>为了可视化SEG Ge的演变及其聚结，通过在另一个Si衬底上定期插入10nm厚的Si 0.3 Ge0.7分界层来进行Ge生长。Si0.3 Ge 0.7层是使用Si2H6和GeH 4气体形成的。在Si 0.3 Ge 0.7层生长过程中，将Si2H6气体的分压设置为0.02 Pa，将GeH4气体的分压设置为0.8Pa。</li>
		<li>当Si衬底自动从生长室转移到负载锁定室时，请排放负载锁定室并手动卸载Si衬底。</li>
	</ol></li>
	<li>蚀刻坑密度 （EPD） 测量<ol><li>使用超声波清洗机将 32 mg I2 溶解在 67 mL 的 CH3COOH 中。</li>
		<li>混合I2溶解的CH 3 COOH，20 mL HNO3和10 mLHF。</li>
		<li>将锗生长的硅基底浸入CH 3 COOH/ HNO3/ HF/ I 2溶液中5-7秒，以形成蚀刻凹坑。</li>
		<li>用光学显微镜（通常为100倍）观察蚀刻的Ge表面，以确保蚀刻的凹坑成功形成。</li>
		<li>使用原子力显微镜（AFM）来计数蚀刻的凹坑。将蚀刻的Ge样品放在AFM载物台上，然后单击自动接近 接近探针。</li>
		<li>使用与AFM集成的光学显微镜确定观察区域，并扫描五个不同的10 μm x 10 μm区域。幅度阻尼因子是自动确定的。</li>
	</ol></li>
	<li>透射电镜观测<ol><li>使用聚焦的Ge离子束（FIB微采样方法）从聚结/毯状Ge层中拾取TEM样品27。</li>
		<li>使用氩离子在离子研磨系统中抛光TEM试样。在本工作中，用于横截面观测的TEM试样在[110]方向上为150-500 nm，在[001]方向上将平面视图观测的透视图样品减薄为200 nm。</li>
		<li>对于平面透射电镜试样，用非晶层保护Ge层的顶面，然后从Ge层的底部（基底）侧向下变薄。</li>
		<li>在 200 kV 的加速电压下进行 TEM 观察。执行横截面明场扫描透射电镜 （STEM） 观察，以观察厚 （500 nm） 透射电镜标本。</li>
		<li>对于具有Si0.3 Ge 0.7分界层的聚结Ge，在200 kV的加速电压下进行横截面高角度环形暗场（HAADF）STEM观测。</li>
	</ol></li>
</ol>

作者没有什么可透露的。

在本工作中，实验显示了4 x 107 / cm2 的TDD。为了进一步降低TDD，协议中主要有2个关键步骤:SEG掩膜制备和外延Ge生长。
图4所示的模型表明，当APR，W窗口/（W窗口+ W掩模）小至0.1时，TDD可以降低到107 / cm2在聚结Ge中。为了进一步降低TDD，应准备具有较小APR的SEG口罩。如步骤2.1.2所述，W窗口和W...

Si上的外延锗作为有源光子器件平台引起了广泛兴趣，因为Ge可以检测/发射光通信范围（1.3-1.6μm）内的光，并且与Si CMOS（互补金属氧化物半导体）加工技术兼容。然而，由于Ge和Si之间的晶格失配高达4.2%，因此在Si上的Ge外延层中以~109 / cm2的密度形成螺纹位错（TDs）。由于TD在Ge光电探测器（PD）和调制器（MOD）中充当载流子生成中心，在激光二极管（LDs）中充当载流子复合中心，因此锗光子器件的性能会因TD而恶化。反过来，它们会增加PD和MOD1，2，3中的反向泄漏电流（J泄漏）和LDs4，5，6中的阈值电流（J th）。
据报道，已经有各种尝试来降低Si上Ge中的TD密度（TDD）（补充图1）。热退火刺激TD的运动，导致TDD降低，通常为2 x 107 / cm2。缺点是Si和Ge可能混合，并且掺杂剂在Ge中扩散，例如磷7，8，9（补充图1a）。SiGe分级缓冲层10，11，12增加了临界厚度并抑制了TD的产生，导致TDD降低，通常为2 x 106/cm2。这里的缺点是厚缓冲器会降低Ge器件和下方Si波导之间的光耦合效率（补充图1b）。纵横比捕获 （ART）13，14，15 是一种选择性外延生长 （SEG） 方法，通过将 TD 捕获在厚 SiO 2 沟槽的侧壁上来降低 TD，通常为 <1 x 10 6/cm 2。ART方法使用较厚的SiO 2掩模来降低Ge中的TDD，而不是SiO 2掩模，SiO2掩模远高于Si，并且具有相同的缺点（补充图1b，1c）。Si柱晶种上的Ge生长和退火16，17，18与ART方法相似，通过高纵横比Ge生长使TD捕获达到<1 x 105/cm2。然而，用于Ge聚结的高温退火在补充图1a-c（补充图1d）中具有相同的缺点。
为了在硅上实现低TDD的Ge外延生长，而不受上述方法的缺点，我们根据迄今为止在SEG Ge生长7，15，21，22，23中报告的以下两个关键观察结果，提出了聚结诱导的TDD还原19，20:1）TD弯曲成垂直于生长表面（通过横截面透射电子显微镜（TEM）观察），2）SEG Ge层的聚结导致在SiO2掩模上形成半圆柱形空隙。
我们假设TD由于生长表面的成像力而弯曲。在Si上的Ge的情况下，像像力分别在距离自由表面1 nm处产生1.38 GPa和1.86 GPa的螺杆位错和边缘位错的剪切应力19。计算出的剪切应力明显大于Ge24中报告的60°位错的Peierls应力0.5 GPa。该计算预测了Ge SEG层的TDD减少，并且与SEG Ge增长19非常吻合。对TD进行TEM观察以了解Si20上所呈现的SEG Ge生长中的TD行为。镜像力诱导的TDD还原没有任何热退火或厚缓冲层，因此更适合光子器件应用。
本文介绍了TDD还原方法的理论计算和实验验证的具体方法。

<table border="0" cellpadding="0" cellspacing="0" style="width:655px;" width="656">
	<tbody>
		<tr height="21">
			<td height="21" style="height:21px;width:222px;">AFM</td>
			<td style="width:140px;">SII NanoTechnology</td>
			<td style="width:123px;">SPI-3800N</td>
			<td style="width:171px;"></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">BHF</td>
			<td>DAIKIN</td>
			<td>BHF-63U</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">CAD design</td>
			<td>AUTODESK</td>
			<td>AutoCAD 2013</td>
			<td>Software</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">CH3COOH</td>
			<td>Kanto-Kagaku</td>
			<td>Acetic Acid</td>
			<td>for Electronics</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">CVD</td>
			<td>Canon ANELVA</td>
			<td>I-2100 SRE</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Developer</td>
			<td>ZEON</td>
			<td>ZED</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Developer rinse</td>
			<td>ZEON</td>
			<td style="width:123px;">ZMD</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">EB writer</td>
			<td>ADVANTEST</td>
			<td>F5112+VD01</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Furnace</td>
			<td>Koyo Thermo System</td>
			<td>KTF-050N-PA</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">HF, 0.5 %</td>
			<td>Kanto-Kagaku</td>
			<td>0.5 % HF</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">HF, 50 %</td>
			<td>Kanto-Kagaku</td>
			<td>50 % HF</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">HNO3, 61 %</td>
			<td>Kanto-Kagaku</td>
			<td>HNO3 1.38</td>
			<td>for Electronics</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">I2</td>
			<td>Kanto-Kagaku</td>
			<td>Iodine 100g</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Photoresist</td>
			<td>ZEON</td>
			<td>ZEP520A</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Photoresist remover</td>
			<td>Tokyo Ohka</td>
			<td>Hakuri-104</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">Surfactant</td>
			<td>Tokyo Ohka</td>
			<td>OAP</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;">TEM</td>
			<td>JEOL</td>
			<td>JEM-2010HC</td>
			<td></td>
		</tr>
	</tbody>
</table>

theoretical calculation and experimental verification for dislocation reduction in germanium epitaxial layers with semicylindrical voids on silicon

降低硅（Si）上外延锗（Ge）的螺纹位错密度（TDD）是实现单片集成光子电路的最重要挑战之一。本文介绍了一种降低TDD的新模型的理论计算和实验验证方法。理论计算方法描述了基于TDs与选择性外延生长（SEG）的非平面生长表面在位错成像力方面的相互作用的螺纹位错（TDs）的弯曲。计算表明，SiO2 掩模上空隙的存在有助于降低TDD。采用超高真空化学气相沉积法和TD观察生长的锗（Ge）SEG通过蚀刻和横截面透射电子显微镜（TEM）对生长的Ge进行实验验证。强烈建议TDD降低是由于SiO2 SEG掩模和生长温度上存在半圆柱形空隙。为了进行实验验证，由于Ge层的SEG及其聚结作用，形成了具有半圆柱形空隙的外延Ge层。实验得到的TDDs基于理论模型再现了计算出的TDD。横断面透射电镜观察表明，TD的终止和生成都发生在半圆柱形空隙处。平面透射电镜观测揭示了具有半圆柱形空隙的Ge中TD的独特行为（即TD弯曲以平行于SEG掩模和Si衬底）。

理论计算
图3显示了6种聚结Ge层中TD的计算轨迹:在这里，我们将孔径比（APR）定义为W窗口/（W窗口+ W掩模）。图3a显示了APR = 0.8的圆形SEG原点聚结Ge。在这里，2/6 TD 被困住。图3b显示了APR = 0.8的{113}面SEG原点聚结Ge。在这里，...

Watch this Scientific Journal Video about Theoretical Calculation and Experimental Verification for Dislocation Reduction in Germanium Epitaxial Layers with Semicylindrical Voids on Silicon at JoVE.co

Theoretical Calculation and Experimental Verification for Dislocation Reduction in Germanium Epitaxial Layers with Semicylindrical Voids on Silicon

提出了降低硅上半圆柱空隙的锗外延层螺纹位错（TD）密度的理论计算和实验验证。给出了基于TD与表面相互作用的计算方法，通过像力、TD测量和透射电子显微镜对TD的观测。

硅上半圆柱空隙锗外延层位错还原的理论计算和实验验证

Reduction of threading dislocation density (TDD) in epitaxial germanium (Ge) on silicon (Si) has been one of the most important challenges for the ...

theoretical-calculation-experimental-verification-for-dislocation

Research

JoVE Journal

Engineering

2.1K 次观看.  The University of Tokyo. 提出了降低硅上半圆柱空隙的锗外延层螺纹位错（TD）密度的理论计算和实验验证。给出了基于TD与表面相互作用的计算方法，通过像力、TD测量和透射电子显微镜对TD的观测。 

视频: Theoretical Calculation and Experimental Verification for Dislocation Reduction in Germanium Epitaxial Layers with Semicylindrical Voids on Silicon

Polycrystalline Silicon Thin-film Solar cells with Plasmonic-enhanced Light-trapping

One of major approaches to cheaper solar cells is reducing the amount of semiconductor material used for their fabrication and making cells thinner. To compensate for lower light absorption such physically thin devices have to incorporate light-trapping which increases their optical thickness. Light scattering by textured surfaces is a common technique but it cannot be universally applied to all solar cell technologies. Some cells, for example those made of evaporated silicon, are planar as produced and they require an alternative light-trapping means suitable for planar devices. Metal nanoparticles formed on planar silicon cell surface and capable of light scattering due to surface plasmon resonance is an effective approach.
The paper presents a fabrication procedure of evaporated polycrystalline silicon solar cells with plasmonic light-trapping and demonstrates how the cell quantum efficiency improves due to presence of metal nanoparticles.
To fabricate the cells a film consisting of alternative boron and phosphorous doped silicon layers is deposited on glass substrate by electron beam evaporation. An Initially amorphous film is crystallised and electronic defects are mitigated by annealing and hydrogen passivation. Metal grid contacts are applied to the layers of opposite polarity to extract electricity generated by the cell. Typically, such a ~2 &mu;m thick cell has a short-circuit current density (Jsc) of 14-16 mA/cm2, which can be increased up to 17-18 mA/cm2 (~25% higher) after application of a simple diffuse back reflector made of a white paint.
To implement plasmonic light-trapping a silver nanoparticle array is formed on the metallised cell silicon surface. A precursor silver film is deposited on the cell by thermal evaporation and annealed at 23&deg;C to form silver nanoparticles. Nanoparticle size and coverage, which affect plasmonic light-scattering, can be tuned for enhanced cell performance by varying the precursor film thickness and its annealing conditions. An optimised nanoparticle array alone results in cell Jsc enhancement of about 28%, similar to the effect of the diffuse reflector. The photocurrent can be further increased by coating the nanoparticles by a low refractive index dielectric, like MgF2, and applying the diffused reflector. The complete plasmonic cell structure comprises the polycrystalline silicon film, a silver nanoparticle array, a layer of MgF2, and a diffuse reflector. The Jsc for such cell is 21-23 mA/cm2, up to 45% higher than Jsc of the original cell without light-trapping or ~25% higher than Jsc for the cell with the diffuse reflector only.
Introduction
Light-trapping in silicon solar cells is commonly achieved via light scattering at textured interfaces. Scattered light travels through a cell at oblique angles for a longer distance and when such angles exceed the critical angle at the cell interfaces the light is permanently trapped in the cell by total internal reflection (Animation 1: Light-trapping). Although this scheme works well for most solar cells, there are developing technologies where ultra-thin Si layers are produced planar (e.g. layer-transfer technologies and epitaxial c-Si layers) 1 and or when such layers are not compatible with textures substrates (e.g. evaporated silicon) 2. For such originally planar Si layer alternative light trapping approaches, such as diffuse white paint reflector 3, silicon plasma texturing 4 or high refractive index nanoparticle reflector 5 have been suggested.
Metal nanoparticles can effectively scatter incident light into a higher refractive index material, like silicon, due to the surface plasmon resonance effect 6. They also can be easily formed on the planar silicon cell surface thus offering a light-trapping approach alternative to texturing. For a nanoparticle located at the air-silicon interface the scattered light fraction coupled into silicon exceeds 95% and a large faction of that light is scattered at angles above critical providing nearly ideal light-trapping condition (Animation 2: Plasmons on NP). The resonance can be tuned to the wavelength region, which is most important for a particular cell material and design, by varying the nanoparticle average size, surface coverage and local dielectric environment 6,7. Theoretical design principles of plasmonic nanoparticle solar cells have been suggested 8. In practice, Ag nanoparticle array is an ideal light-trapping partner for poly-Si thin-film solar cells because most of these design principle are naturally met. The simplest way of forming nanoparticles by thermal annealing of a thin precursor Ag film results in a random array with a relatively wide size and shape distribution, which is particularly suitable for light-trapping because such an array has a wide resonance peak, covering the wavelength range of 700-900 nm, important for poly-Si solar cell performance. The nanoparticle array can only be located on the rear poly-Si cell surface thus avoiding destructive interference between incident and scattered light which occurs for front-located nanoparticles 9. Moreover, poly-Si thin-film cells do not requires a passivating layer and the flat base-shaped nanoparticles (that naturally result from thermal annealing of a metal film) can be directly placed on silicon further increases plasmonic scattering efficiency due to surface plasmon-polariton resonance 10.
The cell with the plasmonic nanoparticle array as described above can have a photocurrent about 28% higher than the original cell. However, the array still transmits a significant amount of light which escapes through the rear of the cell and does not contribute into the current. This loss can be mitigated by adding a rear reflector to allow catching transmitted light and re-directing it back to the cell. Providing sufficient distance between the reflector and the nanoparticles (a few hundred nanometers) the reflected light will then experience one more plasmonic scattering event while passing through the nanoparticle array on re-entering the cell and the reflector itself can be made diffuse - both effects further facilitating light scattering and hence light-trapping. Importantly, the Ag nanoparticles have to be encapsulated with an inert and low refractive index dielectric, like MgF2 or SiO2, from the rear reflector to avoid mechanical and chemical damage 7. Low refractive index for this cladding layer is required to maintain a high coupling fraction into silicon and larger scattering angles, which are ensured by the high optical contrast between the media on both sides of the nanoparticle, silicon and dielectric 6. The photocurrent of the plasmonic cell with the diffuse rear reflector can be up to 45% higher than the current of the original cell or up to 25% higher than the current of an equivalent cell with the diffuse reflector only.

Polycrystalline silicon thin-film solar cells on glass are fabricated by deposition of boron and phosphorous doped silicon layers followed by crystallisation, defect passivation and metallisation. Plasmonic light-trapping is introduced by forming Ag nanoparticles on the silicon cell surface capped with a diffused reflector resulting in ~45% photocurrent enhancement.

多晶硅薄膜太阳能电池电浆增强光捕获

One of major approaches to cheaper solar cells is reducing the amount of semiconductor material used for their fabrication and making cells thinner. To ...

科研

工程学

Monolayer Contact Doping of Silicon Surfaces and Nanowires Using Organophosphorus Compounds

Monolayer Contact Doping (MLCD) is a simple method for doping of surfaces and nanostructures1. MLCD results in the formation of highly controlled, ultra shallow and sharp doping profiles at the nanometer scale. In MLCD process the dopant source is a monolayer containing dopant atoms.
In this article a detailed procedure for surface doping of silicon substrate as well as silicon nanowires is demonstrated. Phosphorus dopant source was formed using tetraethyl methylenediphosphonate monolayer on a silicon substrate. This monolayer containing substrate was brought to contact with a pristine intrinsic silicon target substrate and annealed while in contact. Sheet resistance of the target substrate was measured using 4 point probe. Intrinsic silicon nanowires were synthesized by chemical vapor deposition (CVD) process using a vapor-liquid-solid (VLS) mechanism; gold nanoparticles were used as catalyst for nanowire growth. The nanowires were suspended in ethanol by mild sonication. This suspension was used to dropcast the nanowires on silicon substrate with a silicon nitride dielectric top layer. These nanowires were doped with phosphorus in similar manner as used for the intrinsic silicon wafer. Standard photolithography process was used to fabricate metal electrodes for the formation of nanowire based field effect transistor (NW-FET). The electrical properties of a representative nanowire device were measured by a semiconductor device analyzer and a probe station.

A detailed procedure for surface doping of Silicon interfaces is provided. The ultra-shallow surface doping is demonstrated by using phosphorus containing monolayers and rapid annealing process. The method can be used for doping of macroscopic area surfaces as well as nanostructures.

Monolayer Contact Doping (MLCD) is a simple method for doping of surfaces and nanostructures1. MLCD results in the formation of highly controlled, ultra ...

Selective Area Modification of Silicon Surface Wettability by Pulsed UV Laser Irradiation in Liquid Environment

The wettability of silicon (Si) is one of the important parameters in the technology of surface functionalization of this material and fabrication of biosensing devices. We report on a protocol of using KrF and ArF lasers irradiating Si (001) samples immersed in a liquid environment with low number of pulses and operating at moderately low pulse fluences to induce Si wettability modification. Wafers immersed for up to 4 hr in a 0.01% H2O2/H2O solution did not show measurable change in their initial contact angle (CA) ~75&#176;. However, the 500-pulse KrF and ArF lasers irradiation of such wafers in a microchamber filled with 0.01% H2O2/H2O solution at 250 and 65 mJ/cm2, respectively, has decreased the CA to near 15&#176;, indicating the formation of a superhydrophilic surface. The formation of OH-terminated Si (001), with no measurable change of the wafer&#8217;s surface morphology, has been confirmed by X-ray photoelectron spectroscopy and atomic force microscopy measurements. The selective area irradiated samples were then immersed in a biotin-conjugated fluorescein-stained nanospheres solution for 2 hr, resulting in a successful immobilization of the nanospheres in the non-irradiated area. This illustrates the potential of&#160;the method for selective area biofunctionalization and fabrication of advanced Si-based biosensing architectures. We also describe a similar protocol of irradiation of wafers immersed in methanol (CH3OH) using ArF laser operating at pulse fluence of 65 mJ/cm2 and in situ formation of a strongly hydrophobic surface of Si (001) with the CA of 103&#176;. The XPS results indicate ArF laser induced formation of Si&#8211;(OCH3)x compounds responsible for the observed hydrophobicity. However, no such compounds were found by XPS on the Si surface irradiated by KrF laser in methanol, demonstrating the inability of the KrF laser to photodissociate methanol and create -OCH3 radicals.

We report on a process of in situ alteration of HF treated Si (001) surface into a hydrophilic or hydrophobic state by irradiating samples in microfluidic chambers filled with&#160;H2O2/H2O solution (0.01%-0.5%) or methanol solutions using pulsed UV laser of a relative low pulse fluence.

硅表面润湿性的选择区域改性脉冲紫外激光照射在液体环境

The wettability of silicon (Si) is one of the important parameters in the technology of surface functionalization of this material and fabrication of ...

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly known as plasmonic effects, play an important role. Research in this field has, however, been impeded owing to the difficulty of fabricating devices containing the desired functional metal nanostructures. In order to provide a viable strategy to this issue, we herein show a transfer printing-based approach that allows the quick and low-cost integration of designed metal nanostructures with a variety of device architectures, including solar cells. Nanopillar poly(dimethylsiloxane) (PDMS) stamps were fabricated from a commercially available nanohole plastic film as a master mold. On this nanopatterned PDMS stamps, Ag films were deposited, which were then transfer-printed onto block copolymer (binding layer)-coated hydrogenated microcrystalline Si (&#181;c-Si:H) surface to afford ordered Ag nanodisk structures. It was confirmed that the resulting Ag nanodisk-incorporated &#181;c-Si:H solar cells show higher performances compared to a cell without the transfer-printed Ag nanodisks, thanks to plasmonic light trapping effect derived from the Ag nanodisks. Because of the simplicity and versatility, further device application would also be feasible thorough this approach.

A viable transfer printing-based methodology to introduce plasmonic metal nanostructures in solar cells is described. Using nanopillar poly(dimethylsiloxane) stamps, an Ag-based ordered nanodisk array was integrated with standard hydrogenated microcrystalline Si solar cells, which led to improved device performances due to plasmonic light trapping.

灯光诱杀银纳米结构通过转移印花在氢化微晶硅太阳能电池集成

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly ...

Quantification of Hydrogen Concentrations in Surface and Interface Layers and Bulk Materials through Depth Profiling with Nuclear Reaction Analysis

Nuclear reaction analysis (NRA) via the resonant 1H(15N,&#945;&#947;)12C reaction is a highly effective method of depth profiling that quantitatively and non-destructively reveals the hydrogen density distribution at surfaces, at interfaces, and in the volume of solid materials with high depth resolution. The technique applies a 15N ion beam of 6.385 MeV provided by an electrostatic accelerator and specifically detects the 1H isotope in depths up to about 2 &#956;m from the target surface. Surface H coverages are measured with a sensitivity in the order of ~1013 cm-2 (~1% of a typical atomic monolayer density) and H volume concentrations with a detection limit of ~1018 cm-3 (~100 at. ppm). The near-surface depth resolution is 2-5 nm for surface-normal 15N ion incidence onto the target and can be enhanced to values below 1 nm for very flat targets by adopting a surface-grazing incidence geometry. The method is versatile and readily applied to any high vacuum compatible homogeneous material with a smooth surface (no pores). Electrically conductive targets usually tolerate the ion beam irradiation with negligible degradation. Hydrogen quantitation and correct depth analysis require knowledge of the elementary composition (besides hydrogen) and mass density of the target material. Especially in combination with ultra-high vacuum methods for in-situ target preparation and characterization, 1H(15N,&#945;&#947;)12C NRA is ideally suited for hydrogen analysis at atomically controlled surfaces and nanostructured interfaces. We exemplarily demonstrate here the application of 15N NRA at the MALT Tandem accelerator facility of the University of Tokyo to (1) quantitatively measure the surface coverage and the bulk concentration of hydrogen in the near-surface region of a H2 exposed Pd(110) single crystal, and (2) to determine the depth location and layer density of hydrogen near the interfaces of thin SiO2 films on Si(100).

We illustrate the application of 1H(15N,&#945;&#947;)12C resonant nuclear reaction analysis (NRA) to quantitatively evaluate the density of hydrogen atoms on the surface, in the volume, and at an interfacial layer of solid materials. The near-surface hydrogen depth profiling of a Pd(110) single crystal and of SiO2/Si(100) stacks is described.

通过与核反应分析深度剖面的表面和界面层和颗粒材料氢含量的定量

Nuclear reaction analysis (NRA) via the resonant 1H(15N,&#945;&#947;)12C reaction is a highly effective method of depth profiling that quantitatively and ...

SSVEP-based Experimental Procedure for Brain-Robot Interaction with Humanoid Robots

Brain-Robot Interaction (BRI), which provides an innovative communication pathway between human and a robotic device via brain signals, is prospective in helping the disabled in their daily lives. The overall goal of our method is to establish an SSVEP-based experimental procedure by integrating multiple software programs, such as OpenViBE, Choregraph, and Central software as well as user developed programs written in C++ and MATLAB, to enable the study of brain-robot interaction with humanoid robots.
This is achieved by first placing EEG electrodes on a human subject to measure the brain responses through an EEG data acquisition system. A user interface is used to elicit SSVEP responses and to display video feedback in the closed-loop control experiments. The second step is to record the EEG signals of first-time subjects, to analyze their SSVEP features offline, and to train the classifier for each subject. Next, the Online Signal Processor and the Robot Controller are configured for the online control of a humanoid robot. As the final step, the subject completes three specific closed-loop control experiments within different environments to evaluate the brain-robot interaction performance.
The advantage of this approach is its reliability and flexibility because it is developed by integrating multiple software programs. The results show that using this approach, the subject is capable of interacting with the humanoid robot via brain signals. This allows the mind-controlled humanoid robot to perform typical tasks that are popular in robotic research and are helpful in assisting the disabled.

The overall goal of this method is to establish an SSVEP-based experimental procedure by integrating multiple software programs to enable the study of brain-robot interaction with humanoid robots, which is prospective in assisting the sick and elderly as well as performing unsanitary or dangerous jobs.

SSVEP基础实验步骤与人形机器人脑机器人互动

Brain-Robot Interaction (BRI), which provides an innovative communication pathway between human and a robotic device via brain signals, is prospective in ...

Experimental Methods for Spin- and Angle-Resolved Photoemission Spectroscopy Combined with Polarization-Variable Laser

The goal of this protocol is to present how to perform spin- and angle-resolved photoemission spectroscopy combined with polarization-variable 7-eV laser (laser-SARPES), and demonstrate a power of this technique for studying solid state physics. Laser-SARPES achieves two great capabilities. Firstly, by examining orbital selection rule of linearly polarized lasers, orbital selective excitation can be carried out in SAPRES experiment. Secondly, the technique can show full information of a variation of the spin quantum axis as a function of the light polarization. To demonstrate the power of the collaboration of these capabilities in laser-SARPES, we apply this technique for the investigations of spin-orbit coupled surface states of Bi2Se3. This technique affords to decompose spin and orbital components from the spin-orbit coupled wavefunctions. Moreover, as a representative advantage of using the direct spin detection collaborated with the polarization-variable laser, the technique unambiguously visualizes the light polarization dependence of the spin quantum axis in three-dimension. Laser-SARPES dramatically increases a capability of photoemission technique.

Here, we combine polarization-variable 7-eV laser with spin- and angle-resolved photoemission technique to visualize the spin-orbital coupling effect in solid states.

自旋角分辨光电子光谱与偏振变激光相结合的实验方法

The goal of this protocol is to present how to perform spin- and angle-resolved photoemission spectroscopy combined with polarization-variable 7-eV laser ...

Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses

We demonstrate the use of two nuclear-based analytical methods that can follow the modifications of microstructural arrangement of iron-based metallic glasses (MGs). Despite their amorphous nature, the identification of hyperfine interactions unveils faint structural modifications. For this purpose, we have employed two techniques that utilize nuclear resonance among nuclear levels of a stable 57Fe isotope, namely M&#246;ssbauer spectrometry and nuclear forward scattering (NFS) of synchrotron radiation. The effects of heat treatment upon (Fe2.85Co1)77Mo8Cu1B14 MG are discussed using the results of ex situ and in situ experiments, respectively. As both methods are sensitive to hyperfine interactions, information on structural arrangement as well as on magnetic microstructure is readily available. M&#246;ssbauer spectrometry performed ex situ describes how the structural arrangement and magnetic microstructure appears at room temperature after the annealing under certain conditions (temperature, time), and thus this technique inspects steady states. On the other hand, NFS data are recorded in situ during dynamically changing temperature and NFS examines transient states. The use of both techniques provides complementary information. In general, they can be applied to any suitable system in which it is important to know its steady state but also transient states.

Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses

Here, we present a protocol to describe ex situ and in situ investigations of structural transformations in metallic glasses. We employed nuclear-based analytical methods which inspect hyperfine interactions. We demonstrate the applicability of M&#246;ssbauer spectrometry and nuclear forward scattering of synchrotron radiation during temperature-driven experiments.

结构转换的原位和原位研究方法: 金属玻璃结晶的实例

We demonstrate the use of two nuclear-based analytical methods that can follow the modifications of microstructural arrangement of iron-based metallic ...

Fabrication of Magnetic Nanostructures on Silicon Nitride Membranes for Magnetic Vortex Studies Using Transmission Microscopy Techniques

Electron and x-ray magnetic microscopies allow for high-resolution magnetic imaging down to tens of nanometers. However, the samples need to be prepared on transparent membranes which are very fragile and difficult to manipulate. We present processes for the fabrication of samples with magnetic micro- and nanostructures with spin configurations forming magnetic vortices suitable for Lorentz transmission electron microscopy and magnetic transmission x-ray microscopy studies. The samples are prepared on silicon nitride membranes and the fabrication consists of a spin coating, UV and electron-beam lithography, the chemical development of the resist, and the evaporation of the magnetic material followed by a lift-off process forming the final magnetic structures. The samples for the Lorentz transmission electron microscopy consist of magnetic nanodiscs prepared in a single lithography step. The samples for the magnetic x-ray transmission microscopy are used for time-resolved magnetization dynamic experiments, and magnetic nanodiscs are placed on a waveguide which is used for the generation of repeatable magnetic field pulses by passing an electric current through the waveguide. The waveguide is created in an extra lithography step.

A protocol for the fabrication of magnetic micro- and nanostructures with spin configurations forming magnetic vortices suitable for transmission electron microscopy (TEM) and magnetic transmission x-ray microscopy (MTXM) studies is presented.

用透射显微技术制备氮化硅薄膜磁性纳米结构的研究

Electron and x-ray magnetic microscopies allow for high-resolution magnetic imaging down to tens of nanometers. However, the samples need to be prepared ...

A Silicon-tipped Fiber-optic Sensing Platform with High Resolution and Fast Response

In this article, we introduce an innovative and practically promising fiber-optic sensing platform (FOSP) that we proposed and demonstrated recently. This FOSP relies on a silicon Fabry-Perot interferometer (FPI) attached to the fiber end, referred to as Si-FOSP in this work. The Si-FOSP generates an interferogram determined by the optical path length (OPL) of the silicon cavity. Measurand alters the OPL and thus shifts the interferogram. Due to the unique optical and thermal properties of the silicon material, this Si-FOSP exhibits an advantageous performance in terms of sensitivity and speed. Furthermore, the mature silicon fabrication industry endows the Si-FOSP with excellent reproducibility and low cost toward practical applications. Depending on the specific applications, either a low-finesse or high-finesse version will be utilized, and two different data demodulation methods will be adopted accordingly. Detailed protocols for fabricating both versions of the Si-FOSP will be provided. Three representative applications and their according results will be shown. The first one is a prototype underwater thermometer for profiling the ocean thermoclines, the second one is a flow meter to measure flow speed in the ocean, and the last one is a bolometer used for monitoring exhaust radiation from magnetically confined high-temperature plasma.

This work reports an innovative silicon-tipped fiber-optic sensing platform (Si-FOSP) for high-resolution and fast-response measurement of a variety of physical parameters, such as temperature, flow, and radiation. Applications of this Si-FOSP span from oceanographic research, mechanical industry, to fusion energy research.

一种高分辨率、快速响应的硅尖光纤传感平台

In this article, we introduce an innovative and practically promising fiber-optic sensing platform (FOSP) that we proposed and demonstrated recently. This ...