Deepak Goyal

Assembly Test and Technology Development Failure Analysis Labs

Intel Corporation

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Intel Corporation

JOVE ARTICLES

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

Holly D. Carlton¹,

John W. Elmer¹,

Yan Li²,

Mario Pacheco²,

Deepak Goyal²,

Dilworth Y. Parkinson³,

Alastair A. MacDowell³

¹Materials Engineering Division, Lawrence Livermore National Laboratory,

²Assembly Test and Technology Development Failure Analysis Labs, Intel Corporation,

³Advanced Light Source, Lawrence Berkeley National Laboratory

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