Laser-induced Forward Transfer for Flip-chip Packaging of Single DiesKamal S. Kaur 1, Geert Van Steenberge 1
1Center for Microsystems Technology (CMST), Ghent University-imec
We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.
