Name: laser-induced forward transfer for flip-chip packaging of single dies
Uploaded: 2015-03-20T14:00:00
Description: Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

This work was carried out in the framework of the project &#8220;MIRAGE,&#8221; funded by the European Commission within the FP7 program.

1. LIFT-assisted Flip-chip Bonding
NOTE: There are three stages involved in realizing the LIFT-assisted flip-chip assemblies, namely-micro-bumping of the substrates using the LIFT technique, attaching the optoelectronic chips to the bumped substrates using thermo-compression flip-chip bonding method, and finally encapsulation of the bonded assemblies. Each of these stages is discussed in the following sections:
<ol>
	<li>Micro-bumping using LIFT:
	<ol>
		<li>For donor preparation, deposit a ...

<ol>
	<li>Davis, E., Harding, W., Schwartz, R., Coring, J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Solid+logic+technology:+versatile,+high+performance+microelectronics.">Solid logic technology: versatile, high performance microelectronics.</a> IBM J. Res. Develop. 8, 102-114 (1964).</li><li>Bigas, M., Cabruja, E., Lozano, M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Bonding+techniques+for+hybrid+active+pixel+sensors+(HAPS).">Bonding techniques for hybrid active pixel sensors (HAPS).</a> Nucl. Instrum. Methods Phys. Res. A. 574 (2), 392-400 (2007).</li><li>Bohandy, J., Kim, B. F., Adrian, F. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Metal+deposition+from+a+supported+metal+film+using+an+excimer+laser.">Metal deposition from a supported metal film using an excimer laser.</a> J. Appl. Phys. 60 (4), 1538-1539 (1986).</li><li>Kaur, K. S., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Shadowgraphic+studies+of+triazene+assisted+laser-induced+forward+transfer+of+ceramic+thin+films.">Shadowgraphic studies of triazene assisted laser-induced forward transfer of ceramic thin films.</a> J. Appl. Phys. 105 (11), 113119 (2009).</li><li>Boutopoulos, C., Pandis, C., Giannakopoulos, K., Pissis, P., Zergioti, I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Polymer/carbon+nanotube+composite+patterns+via+laser+induced+forward+transfer.">Polymer/carbon nanotube composite patterns via laser induced forward transfer.</a> Appl. Physc. Lett. 96, 041104 (2010).</li><li>Xu, J., Liu, J., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser-assisted+forward+transfer+of+multi-spectral+nanocrystal+quantum+dot+emitters.">Laser-assisted forward transfer of multi-spectral nanocrystal quantum dot emitters.</a> Nanotechnology. 18 (2), 025403 (2007).</li><li>Doraiswamy, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Excimer+laser+forward+transfer+of+mammalian+cells+using+a+novel+triazene+absorbing+layer.">Excimer laser forward transfer of mammalian cells using a novel triazene absorbing layer.</a> Appl. Surf. Sci. 252 (13), 4743-4747 (2006).</li><li>Papazoglou, S., Raptis, Y. S., Chatzandroulis, S., Zergioti, <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=I.A+study+on+the+pulsed+laser+printing+of+liquid+phase+exfoliated+graphene+for+organic+electronics.">I.A study on the pulsed laser printing of liquid phase exfoliated graphene for organic electronics.</a> Appl. Phys. A. , (2014).</li><li>Chatzipetrou, M., Tsekenis, G., Tsouti, V., Chatzandroulis, S., Zergioti, I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Biosensors+by+means+of+the+laser+induced+forward+transfer+technique.">Biosensors by means of the laser induced forward transfer technique.</a> Appl. Surf. Sci. 278, 250-254 (2013).</li><li>Stewart, J. S., Lippert, T., Nagel, M., Nuesch, F., Wokaun, A. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Red-green-blue+polymer+light-emitting+diode+pixels+printed+by+optimized+laser-induced+forward+transfer.">Red-green-blue polymer light-emitting diode pixels printed by optimized laser-induced forward transfer.</a> Appl. Phys. Lett. 100 (20), 203303 (2012).</li><li>Kaur, K., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Waveguide+mode+filters+fabricated+using+laser-induced+forward+transfer.">Waveguide mode filters fabricated using laser-induced forward transfer.</a> Opt. Express. 19 (10), 9814-9819 (2011).</li><li>Kuznetsov, A. I. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser+fabrication+of+large-scale+nanoparticle+arrays+for+sensing+applications.">Laser fabrication of large-scale nanoparticle arrays for sensing applications.</a> ACS Nano. 5 (6), 4843-4849 (2011).</li><li>Rapp, L., Diallo, A. K., Alloncle, A. P., Videlot-Ackermann, C., Fages, F., Delaporte, P. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Pulsed-laser+printing+of+organic+thin-film+transistors.">Pulsed-laser printing of organic thin-film transistors.</a> Appl. Phys. Lett. 95 (17), 171109 (2009).</li><li>Bosman, E., Kaur, K. S., Missinne, J., Van Hoe, B., Van Steenberge, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Assembly+of+optoelectronics+for+efficient+chip-to-waveguide+coupling.">Assembly of optoelectronics for efficient chip-to-waveguide coupling.</a> , 630-634 (2013).</li><li>Kaur, K. S., Missinne, J., Van Steenberge, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Flip-chip+bonding+of+vertical-cavity+surface-emitting+lasers+using+laser-induced+forward+transfer.">Flip-chip bonding of vertical-cavity surface-emitting lasers using laser-induced forward transfer.</a> Appl. Phys. Lett. 104 (6), 061102 (2014).</li><li>Kaur, K. S., al, e. t. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Laser-induced+forward+transfer+of+focussed+ion+beam+pre-machined+donors.">Laser-induced forward transfer of focussed ion beam pre-machined donors.</a> Appl. Surf. Sci. 257 (15), 6650-6653 (2011).</li></ol>

In this paper, we have demonstrated thermo-compression flip-chip bonding of single VCSEL chips using a laser based direct-write technique called LIFT. The assembly fabrication steps involved printing of the micro-bumps of indium onto the substrate contact pads using the LIFT technique. This was followed by thermo-compression flip-chip bonding of VCSEL chips to the bumped substrates and finally their encapsulation.
Electrical, optical and mechanical reliability of the LIFT-assisted bonded chips...

Laser-induced Forward Transfer (LIFT) is a versatile direct-write additive manufacturing method for single-step pattern definition and material transfer with micron and sub-micron-resolution. In this paper, we report the use of LIFT as a bumping technique for flip-chip packaging of vertical-cavity surface-emitting lasers (VCSELs) on a chip-scale. Flip-chip is a key technology in system packaging and integration of electronic and optoelectronic (OE) components. In order to achieve dense integration of components fine pitch bonding is essential. Although fine pitch bonding has been demonstrated by some of the standard techniques but there is a void in terms of combining together the other important features such as flexibility, cost-effectiveness, speed, accuracy and low processing temperature. In order to meet these requirements we demonstrate LIFT-assisted thermo-compression bonding method for fine pitch bonding of OE components.
In LIFT, a thin film of the material to be printed (referred to as the donor) is deposited onto one face of a laser-transparent support substrate (referred to as the carrier). Figure 1 depicts the basic principle of this technique. An incident laser pulse of sufficient intensity is then focused at the carrier-donor interface that provides the propelling force required to forward transfer the donor pixel from the irradiated zone onto another substrate (referred to as the receiver) placed in close proximity.
LIFT was first reported in 1986 by Bohandy as a technique to print micron-sized copper lines for repairing damaged photo-masks3. Since its first demonstration this technique has gained significant interest as a micro-nano fabrication technology for controlled patterning and printing of a wide range of materials such as ceramics4, CNTs5, QDs6, living cells7, graphene8, for diverse applications such as bio-sensors9, OLEDs10, optoelectronic components 11, plasmonic sensors12, organic-electronics13 and flip-chip bonding14,15.
LIFT offers several advantages over the existing flip-chip bumping and bonding techniques such as simplicity, speed, flexibility, cost-effectiveness, high-resolution and accuracy for flip-chip packaging of OE components.

<table border="0" cellpadding="0" cellspacing="0" width="663">
	<tbody>
		<tr height="42">
			<td height="42" style="height:42px;width:216px;">Name of Material/ Equipment</td>
			<td style="width:161px;">Company</td>
			<td style="width:119px;">Catalog Number</td>
			<td style="width:167px;">Comments/Description</td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Laser source</td>
			<td style="width:161px;">3D MicroMac (3DMM)</td>
			<td style="width:119px;">2912-295</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Photodetector</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">818 series</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Source measurement unit</td>
			<td style="width:161px;">Keithley&#160;</td>
			<td style="width:119px;">2401</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Power meter</td>
			<td style="width:161px;">Newport&#160;</td>
			<td style="width:119px;">1930</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Underfill</td>
			<td style="width:161px;">Norlands</td>
			<td style="width:119px;">NOA 86</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">UV lamp</td>
			<td style="width:161px;">Omnicure</td>
			<td style="width:119px;">Series 1000 UV</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Probe station</td>
			<td style="width:161px;">Cascade Microtech</td>
			<td style="width:119px;">model 42</td>
			<td></td>
		</tr>
		<tr height="21">
			<td height="21" style="height:21px;width:216px;">Flip-chip bonder</td>
			<td style="width:161px;">Dr. Tresky</td>
			<td style="width:119px;">T-320 X</td>
			<td></td>
		</tr>
	</tbody>
</table>

laser-induced forward transfer for flip-chip packaging of single dies

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics industry. In this technique the chip and/or the substrate is bumped and the two are bonded via these conductive bumps. Many bumping techniques have been developed and intensively investigated since the introduction of the FC technology in 19601 such as stencil printing, stud bumping, evaporation and electroless/electroplating2. Despite the progress that these methods have made they all suffer from one or more than one drawbacks that need to be addressed such as cost, complex processing steps, high processing temperatures, manufacturing time and most importantly the lack of flexibility. In this paper, we demonstrate a simple and cost-effective laser-based bump forming technique known as Laser-induced Forward Transfer (LIFT)3. Using the LIFT technique a wide range of bump materials can be printed in a single-step with great flexibility, high speed and accuracy at RT. In addition, LIFT enables the bumping and bonding down to chip-scale, which is critical for fabricating ultra-miniature circuitry.

Figure 7 shows a typical LIV curve that was recorded from one of the many flip-chip bonded VCSEL chips. A good match between the measured optical power to the supplier quoted values indicated successful functioning of the bonded devices post-bonding. The curves were also recorded prior- and post-encapsulation and upon comparison it was verified that the encapsulant had no affect on the chip functionality (as shown in Figure 7). Also, a comparison between the I-V curves recorded for the f...

Watch this Scientific Journal Video about Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies at JoVE.com

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

We demonstrate the use of the Laser-induced Forward Transfer (LIFT) technique for flip-chip assembly of optoelectronic components. This approach provides a simple, cost-effective, low-temperature, fast and flexible solution for fine-pitch bumping and bonding on chip-scale for achieving high-density circuits for optoelectronic applications.

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics ...

Research

JoVE Journal

Engineering

Compact Quantum Dots for Single-molecule Imaging

Single-molecule imaging is an important tool for  understanding the mechanisms of biomolecular function and for visualizing the  spatial and temporal ...

Analysis of Contact Interfaces for Single GaN Nanowire Devices

Single GaN nanowire (NW) devices fabricated on SiO2 can exhibit  a strong degradation after annealing due to the  occurrence of void formation at the ...

Measurement and Analysis of Atomic Hydrogen and Diatomic Molecular AlO, C2, CN, and TiO Spectra Following Laser-induced Optical Breakdown

Measurement and Analysis of Atomic Hydrogen and Diatomic Molecular AlO, C2, CN, and TiO Spectra Following Laser-induced Optical Breakdown

In this work, we present time-resolved measurements of atomic and diatomic spectra following laser-induced optical breakdown. A typical LIBS arrangement ...

Laser-induced Breakdown Spectroscopy: A New Approach for Nanoparticle's Mapping and Quantification in Organ Tissue

Emission spectroscopy of laser-induced plasma was applied to elemental analysis of biological samples. Laser-induced breakdown spectroscopy (LIBS) ...

Silicon Metal-oxide-semiconductor Quantum Dots for Single-electron Pumping

As mass-produced silicon transistors have reached the nano-scale, their behavior and performances are increasingly affected, and often deteriorated, by ...

Integration of Light Trapping Silver Nanostructures in Hydrogenated Microcrystalline Silicon Solar Cells by Transfer Printing

One of the potential applications of metal nanostructures is light trapping in solar cells, where unique optical properties of nanosized metals, commonly ...

Laser-induced Forward Transfer of Ag Nanopaste

Over the past decade, there has been much development of non-lithographic methods1-3 for printing metallic inks or other functional materials. Many of ...

Fabrication of 1-D Photonic Crystal Cavity on a Nanofiber Using Femtosecond Laser-induced Ablation

We present a protocol for fabricating 1-D Photonic Crystal (PhC) cavities on subwavelength-diameter tapered optical fibers, optical nanofibers, using ...

Scanning Light Scattering Profiler (SLPS) Based Methodology to Quantitatively Evaluate Forward and Backward Light Scattering from Intraocular Lenses

Scanning Light Scattering Profiler SLPS Based Methodology to Quantitatively Evaluate Forward and Backward Light Scattering from Intraocular Lenses

The scanning light scattering profiler (SLSP) methodology has been developed for the full-angle quantitative evaluation of forward and backward light ...

All-electronic Nanosecond-resolved Scanning Tunneling Microscopy: Facilitating the Investigation of Single Dopant Charge Dynamics

The miniaturization of semiconductor devices to scales where small numbers of dopants can control device properties requires the development of new ...