Source: Logan G. Kiefer, Andrew R. Falkowski, and Taylor D. Sparks, Department of Materials Science and Engineering, The University of Utah, Salt Lake City, UT
Electroplating is a process that uses electric current to reduce dissolved metal cations so that they form a thin coating on an electrode. Other thin film deposition techniques include chemical vapor deposition (CVD), spin coating, dip coating, and sputter deposition among others. CVD uses a gas-phase precursor of the element to be deposited. Spin coating spreads the liquid precursor centrifugally. Dip coating is similar to spin coating, but rather than spinning the liquid precursor, the substrate is completely submerged in it. Sputtering uses plasma to remove the desired material from a target, which then plates the substrate. Techniques such as CVD or sputtering produce very high quality films but do so very slowly and at high cost since these techniques typically require a vacuum atmosphere and small sample size. Electrodeposition doesn't rely on a vacuum atmosphere which greatly reduces the cost and increases scalability. In addition, relatively high rates of deposition can be achieved with electrodeposition.
Qualitatively, the ITO coated in Prussian Blue, will become transparent when a negative potential is applied as shown in Figure 1 below. This change can be reversed by applying a positive voltage.
Figure 1: Prussian Blue in its colored and bleached states.
Electrodeposition, as demonstrated in this experiment, allows for the modification of a materials surface properties within minimal change in volume. In the process of electrodeposition, an electric current is passed through an electrolytic solution between an anode and a cathode. The positively charged cations in the electrolyte solution are attracted to and deposited onto the negatively charged cathode. Once deposited, the atoms in the layer gain electrons through the process of reduction.
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