This work was supported by the NSF (CMMI-1351370).

1. Diseño Máscaras para la fabricación de sustrato donador <ol><li> Diseñar una máscara con la geometría deseada. Para fabricar 100 micras x 100 micras unidades individuales de silicio cuadrados, dibuja una serie de 100 m x 100 m cuadrados. </li><li> Diseñar una segunda máscara con una geometría idéntica, con cada lado que se extiende hacia fuera una suma adicional de 15 micras. Para la gama de 100 micras x 100 m cuadrados, dibuja una serie de 130 micras x 130 m cuadrados que pueden cubrir las plazas en el paso 1.1. </li><li> Diseño de la geometría de anclaje. Dibuja cuatro 20 micras x 40 micras rectángulos, cada uno centrado a lo largo de un borde de un cuadrado. Coloque las estructuras de manera que la primera 15 micras cubre el 100 micras original X 100 m cuadrado en el paso 1.1 y el restante 25 micras se extiende hacia fuera (como se muestra en la Figura 2). NOTA: Cualquier forma y dimensiones pueden ser utilizados siempre que los contactos de anclaje tanto en el material modelado y el sustrato. Un extremo de este anclaje cubre el origenAl geometría en el paso 1.1 y el otro extremo debe extenderse a cabo la geometría en el paso 1.2. </li></ol> 2. Preparar sustrato donador recuperable <ol><li> Preparar un silicio dopado tipo p sobre aislante (SOI) oblea con 3 m de espesor de capa de dispositivo, con resistencia de la lámina de 1-20 Ω • cm y espesor de la capa de óxido de caja de 1 m. NOTA: Para las diversas aplicaciones de estos parámetros pueden ser alterados. </li><li> Girar escudo fotoprotector (AZ5214, 3000 rpm durante 30 segundos, 1,5 m de espesor) y fije la máscara diseñada en el paso 1.1. </li><li> El uso de un ataque por iones reactivos (RIE) instrumento, patrón de la capa de dispositivo de la oblea SOI y quitar la máscara fotoprotector. Después de este paso, la región grabado RIE ha dejado al descubierto la capa de óxido de caja (Figura 2A). </li><li> Girar escudo fotoprotector (AZ5214, 3000 rpm durante 30 segundos, 1,5 m de espesor) y el patrón con la máscara diseñada en el paso 1.2. </li><li> Calentar la oblea a 125 º C durante 90 segundos en un plato caliente. </li><li> Sumerja la oblea en49% de HF en 50 segundos para grabar la capa de óxido cuadro expuesto en el paso 2.3. Después de secarse por completo, retire el fotoprotector enmascaramiento (Figura 2B). </li><li> Escudo de centrifugado (AZ5214, 3000 rpm durante 30 segundos, 1,5 m de espesor) y el patrón del diseño de anclaje desde el paso 1.3. </li><li> Calentar la oblea a 125 º C durante 90 segundos en un plato caliente. </li><li> Sumerja en 49% de HF durante 50 min. Este paso ataca la capa de óxido de caja que queda por debajo de la capa de silicio dispositivo con dibujos restantes, resultando en unidades individuales de silicio en suspensión sobre la fotoprotección (Figura 2C). </li></ol> 3. Máscaras de diseño para un sello MicroTip <ol><li> Diseñar una máscara con un solo 100 m x 100 m cuadrados. </li><li> Diseñar una máscara con múltiples 12 micras x 12 micras cuadrados dentro de una zona x 100 micras 100 micras. </li></ol> 4. Hacer el molde para un sello MicroTip <ol><li> Limpie una oblea de silicio con orientación cristalina de &lt;1-0-0&gt;, deposentarse 100 nm de nitruro de silicio usando Plasma Enhanced Chemical Vapor Deposition equipo (PECVD). </li><li> Girar escudo fotoprotector (AZ5214, 3000 rpm durante 30 segundos, 1,5 m de espesor) y el patrón con la máscara diseñada en el paso 3.2. </li><li> Patrón de la capa de nitruro de silicio utilizando 10:01 Buffered Óxido Etchant (BOE). </li><li> Disolver 80 g de hidróxido de potasio (KOH) en 170 ml de agua desionizada y 40 ml de alcohol isopropílico (IPA) mezcla de un vaso de precipitados. </li><li> Calentar el IPA, y la mezcla de agua de KOH a 80 ° C en una placa caliente. </li><li> Verticalmente colocar la oblea preparada en el vaso de precipitados con la mezcla de KOH para grabar el silicio expuesto en la estructura cristalina (tasa de ataque químico es de alrededor de 1 m / min). </li><li> Después de que el silicio expuesto está completamente grabado al agua fuerte, eliminar la oblea de mezcla de KOH, grabar la distancia de nitruro de silicio utilizando HF, y realizar RCA 1 y RCA 2 limpieza (Figura 3A). </li><li> Haga girar el abrigo con SU-8 100 y el patrón con la máscara preparado desde el paso 3.1 con receta siguiente: 3000 rPM durante 1 min, hornear suave a 65 ° C durante 10 min y 95 ° C durante 30 min, a exponer con 550 mJ / cm 2, y después de hornear a 65 ° C durante 1 min y 95 ° C durante 10 min (Figura 3B ). </li><li> Después de la SU-8 100 esté completamente curado, aplicar una monocapa de (tridecafluoro-1 1,2,3-tetrahidro octil)-1-triclorosilano dejando caer 3-5 gotas de (tridecafluoro-1, 1,2,3 - tetrahidro octil)-1-triclorosilano en un frasco de vacío y la colocación de la oblea en el frasco y aplicar el vacío. </li></ol> 5. Duplicar un sello MicroTip usando un molde <ol><li> Mezclar polidimetilsiloxano (PDMS) de base y agente de curado con la proporción de 5:01. </li><li> Desgasificar la mezcla mediante la colocación en un frasco de vacío. </li><li> Vierta una pequeña porción de la mezcla desgasificada de PDMS en el molde y dejar que el reflujo de PDMS para lograr una superficie superior plana (Figura 3C). </li><li> Coloque el molde con PDMS en el horno a 70 º C durante 2 horas para curar completamente el PDMS. </li><li> Retire el molde delhorno y pelar las PDMS off (Figura 3D). </li></ol> 6. Recuperar tinta del sustrato donador e imprimir en el área objetivo <ol><li> Coloque el sustrato donante en etapas motorizadas de rotación y X, Y-traducción equipados con un microscopio. </li><li> Coloque el sello micropunta a una etapa de traslación vertical de independiente. </li><li> Bajo el microscopio, alinear el sello micropunta con la tinta de Si sobre el sustrato donante utilizando de traslación y de rotación etapas. Por otra parte, hacer la alineación inclinación entre la superficie micropunta y la tinta de Si mediante el ajuste de una etapa de inclinación. Después, llevar el sello micropunta abajo para hacer contacto. </li><li> Poco a poco llevar el sello micropunta bajar aún más después del contacto inicial, por lo que las pequeñas puntas están totalmente colapsados ​​y toda la superficie está en contacto con la tinta Si el sustrato donante. </li><li> Elevar rápidamente la etapa Z, rompiendo los anclajes debido a la gran área de contacto entre el sello y la tinta micropunta de Si, a retrieve Si la tinta del sustrato donante y adjuntarlo a la marca de micropunta. NOTA: Cuando el sello micropunta es libre de cualquier estrés, la micropunta comprimido restaura a su forma original piramidal, lo que hace un mínimo contacto con la tinta Si recuperado. </li><li> Coloque el sustrato receptor en una etapa y-X de translación y alinear la tinta de Si recuperado bajo el sello de micropunta en la ubicación deseada. </li><li> Descender la etapa Z hasta que la tinta de Si recuperado apenas hace contacto con el sustrato receptor. </li><li> Después de hacer contacto, aumentar lentamente la etapa Z para liberar la tinta de Si, la impresión de que en la ubicación deseada. </li></ol> 7. Proceso de unión <ol><li> Programa de un horno de recocido térmico rápido a ciclo de RT hasta 950 ° C en 90 segundos, se mantienen a 950 ° C durante 10 min y enfriar a RT (mediante la eliminación de cualquier suministro de calor en el horno). </li><li> Coloque el sustrato receptor impreso en el horno en un ambiente con aire ambiente y recocido a 950 °C durante 10 min para Si-Si de unión o a 360 ° C durante 30 min para el Si-Au unión. </li></ol>

<ol>
	<li>Stix, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Toward+&#8220;Point+one.">Toward &#8220;Point one.</a> Sci Am. Feb. , 90-95 (1995).</li><li>Appenzeler, T. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=The+Man+Who+Dared+to+Think+Small.">The Man Who Dared to Think Small.</a> Science. 254, 1300-1301 (1991).</li><li>Madou, M. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fundamentals+of+Microfabrications+The+Science+of+Miniaturization.">Fundamentals of Microfabrications The Science of Miniaturization.</a> , (2002).</li><li>Xia, Y., Whitesides, G. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Soft+Lithography.">Soft Lithography.</a> Angew Chem Int Ed. 38, 551-575 (1998).</li><li>Judy, J. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Microelectromechanical+systems+(MEMS)+fabrication,+design+and+applications.">Microelectromechanical systems (MEMS) fabrication, design and applications.</a> Smart Mater Struct. 10, 1134-1154 (2001).</li><li>Jain, V. K. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=.">.</a> Micromanufacturing Process. , (2012).</li><li>Keum, H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+micro-masonry+using+elastomeric+stamps+for+three-dimensional+microfabrication.">Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication.</a> J Micromech Microeng. 22, 55018 (2012).</li><li>Keum, H., Chung, H., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrical+Contact+at+The+Interface+between+Silicon+and+Transfer-Printed+Gold+Films+by+Eutectic+Joining.">Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining.</a> ACS Appl Mater Interfaces. 5, 6061 (2013).</li><li>Keum, H., Seong, M., Sinha, S., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrostatically+Driven+Collapsible+Au+Thin+Films+Assembled+Using+Transfer+Printing+for+Thermal+Switching.">Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching.</a> Appl Phys Lett. 100, 211904 (2012).</li><li>Klaassen, E. H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+and+deep+reactive+ion+etching:+a+new+technology+for+microstructures.">Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures.</a> Sens Actuators A. 52, 132-139 (1996).</li><li>Barth, P. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+for+fabrication+of+sensors+actuators+and+microstructures.">Silicon fusion bonding for fabrication of sensors actuators and microstructures.</a> Sens Actuators. A21 - A23, 919-926 (1990).</li></ol>

The authors have nothing to disclose.

Micro-mampostería, presentado en la Figura 4, implica la unión por fusión de silicio en una etapa de unión de material. Unión por fusión de silicio se consigue colocando la muestra en un horno de recocido térmico rápido (RTA horno) y calentando la muestra a 950 ° C durante 10 min. Esta condición de recocido es tanto adoptables entre Si - Si y Si - SiO2 10,11 unión. Alternativamente, el Au unida con una tira de Si como se encuentra en la Figura 5C adopta ...

Sistemas microelectromecánicos (MEMS), tales como la miniaturización de las máquinas ordinarias 3D a gran escala, son indispensables para el avance de las tecnologías modernas, proporcionando mejoras en el rendimiento y la reducción de 1,2 coste de fabricación. Sin embargo, al ritmo actual de avance tecnológico en MEMS no se puede mantener sin continuas innovaciones en las tecnologías de fabricación de 3-6. Microfabricación monolítica Común se basa principalmente en los procesos capa por capa desarrollados para la fabricación de circuitos integrados (IC). Este método ha tenido bastante éxito a permitir la producción en masa de dispositivos MEMS de alto rendimiento. Sin embargo, debido a su compleja capa por capa y la naturaleza electroquímica sustractivo, la fabricación de estructuras y dispositivos 3D MEMS en forma de manera diversa, mientras que es fácil en el macromundo, es muy difícil de lograr con este microfabricación monolítica. Para activar la microfabricación 3D más flexible con menor complejidad proceso, DEVEllado una estrategia microfabricación aditivo 3D (llamado &#39;micro / nano-albañilería&#39;), que consiste en un montaje basado en la impresión por transferencia de materiales micro / nanoescala en conjunción con técnicas de material de unión de recocido térmico rápido habilitado. Impresión por transferencia es un método para transferir los materiales a microescala sólidos (es decir, &#39;tintas sólidas&#39;) a partir de un sustrato en el que se generan o se cultivan a un sustrato diferente mediante el uso de adherencia en seco controlada de sellos elastoméricos. El procedimiento típico de micro-mampostería se inicia con la impresión de transferencia. Tintas sólidas son prefabricadas de transferencia impresa utilizando un sello micropunta que es una forma avanzada de sellos elastoméricos y las estructuras impresas son recocidos posteriormente utilizando recocido térmico rápido (RTA) para mejorar de tinta de tinta y la adherencia-sustrato de tinta. Este enfoque de fabricación permite la construcción de estructuras de microescala inusuales y dispositivos que no pueden ser acomodados usando otra meto existenteDS 7. Micro-mampostería proporciona varias características atractivas que no están presentes en otras formas: (a) la capacidad de integrar las tintas sólidas funcionales y estructurales de materiales diferentes para montar los sensores MEMS y actuadores todo ello integrado dentro de la estructura 3D; (B) las interfaces de tintas sólidas ensamblados pueden funcionar como contactos eléctricos y térmicos 9,10; (C) la resolución espacial de montaje puede ser alta (~ 1 m) mediante la utilización altamente escalables y bien entendidos procesos litográficos para la generación de tintas sólidas y etapas mecánicas altamente precisas para la transferencia de la impresión 7; y (d) las tintas sólidas funcionales y estructurales se pueden integrar en ambos sustratos rígidos y flexibles en plano o geometrías curvilíneas.

<table border="0" cellpadding="0" cellspacing="0" width="758">
	<tbody>
		<tr height="20">
			<td height="20" style="height:20px;width:217px;">Name of Material / Equipment</td>
			<td style="width:97px;">Company</td>
			<td style="width:97px;"></td>
			<td style="width:347px;">Comments / Description</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Az 5214</td>
			<td>Clariant</td>
			<td></td>
			<td>1.5 mm thick photoresist</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Su8-100</td>
			<td>Microchem</td>
			<td></td>
			<td>100 mm Photoresist used in mold</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Sylgard 184</td>
			<td>Dow Corning</td>
			<td></td>
			<td>PDMS mixed to fabricate stamp</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Hydrofluoric Acid</td>
			<td>Honeywell</td>
			<td></td>
			<td>Acid to etch silicon oxide layer</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Silicon on insulator</td>
			<td>Ultrasil</td>
			<td></td>
			<td>Donor substrate was fabricated</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">trichlorosilane</td>
			<td>Sigma-Aldrich</td>
			<td></td>
			<td>Chemical used to help pealing of PDMS from mold</td>
		</tr>
	</tbody>
</table>

micro-masonry for 3d additive micromanufacturing

Impresión por transferencia es un método para transferir materiales micro / nanoescala sólidos (en el presente documento denominados &#39;tintas&#39;) a partir de un sustrato en el que se generan a un sustrato diferente mediante la utilización de sellos elastoméricos. Impresión de transferencia permite la integración de materiales heterogéneos para fabricar estructuras o sistemas sin ejemplo funcionales que se encuentran en dispositivos avanzados recientes tales como las células solares flexibles y estirables y matrices de LED. Mientras que la impresión por transferencia presenta características únicas en la capacidad de montaje de material, el uso de capas de adhesivo o la modificación de la superficie tales como la deposición de auto-ensamblado monocapa (SAM) sobre sustratos para la mejora de procesos de impresión dificulta su amplia adaptación en micromontaje de sistema microelectromecánicos (MEMS) estructuras y dispositivos. Para superar este inconveniente, hemos desarrollado un modo avanzado de la impresión de la transferencia que reúne de manera determinista objetos microescala individuales únicamente a través de control de área de contacto superficialsin ninguna alteración de la superficie. La ausencia de una capa de adhesivo u otra modificación y los procesos de material de unión posteriores garantizar no sólo la unión mecánica, pero la conexión también térmica y eléctrica entre materiales ensamblados, que abre aún más diversas aplicaciones en la adaptación en la construcción de dispositivos de MEMS inusuales.

Micro-mampostería permite la integración material heterogéneo para generar estructuras de MEMS que son muy difíciles o imposibles de alcanzar por los procesos de microfabricación monolíticos. Con el fin de demostrar su capacidad, una estructura (llamado un &quot;tetera de micro &#39;) se fabrica únicamente a través de micro-mampostería. Figura 4A es una imagen de microscopio óptico de las tintas de Si fabrica sobre un sustrato donante. Las tintas diseñadas son discos con diferentes dimensione...

Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

Micro-masonry for 3D Additive Micromanufacturing

Este documento presenta una estrategia 3D microfabricación aditivo (denominado «micro-albañilería &#39;) para la fabricación flexible del sistema microelectromecánicos (MEMS) estructuras y dispositivos. Este enfoque implica el montaje basado en la impresión de transferencia de materiales micro / nanoescala en conjunción con técnicas de material de unión de recocido térmico rápido habilitado.

Micro-mampostería para 3D Aditivo Microfabricación

Transfer printing is a method to transfer solid micro/nanoscale materials (herein called &#8216;inks&#8217;) from a substrate where they are generated to ...

micro-masonry-for-3d-additive-micromanufacturing

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Civil Engineering

Engineering

Unit 1

Masonry

SCIENTISTS IN ACTION

10.3K vistas.  University of Illinois at Urbana-Champaign.  Este documento presenta una estrategia 3D microfabricación aditivo (denominado «micro-albañilería ') para la fabricación flexible del sistema microelectromecánicos (MEMS) estructuras y dispositivos. Este enfoque implica el montaje basado en la impresión de transferencia de materiales micro / nanoescala en conjunción con técnicas de material de unión de recocido térmico rápido habilitado. 

Video: Micro-masonry for 3D Additive Micromanufacturing

High-resolution, High-speed, Three-dimensional Video Imaging with Digital Fringe Projection Techniques

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses triangulation between matching points in two views of the same scene at different angles to compute depth.&#160;However, unlike a stereo-based method, DFP uses a digital video projector to replace one of the cameras1. The projector rapidly projects a known sinusoidal pattern onto the subject, and the surface of the subject distorts these patterns in the camera&#8217;s field of view. Three distorted patterns (fringe images) from the camera can be used to compute the depth using triangulation.
Unlike other 3D measurement methods, DFP techniques lead to systems that tend to be faster, lower in equipment cost, more flexible, and easier to develop.&#160;DFP systems can also achieve the same measurement resolution as the camera.&#160;For this reason, DFP and other digital structured light techniques have recently been the focus of intense research (as summarized in1-5). Taking advantage of DFP, the graphics processing unit, and optimized algorithms, we have developed a system capable of 30&#160;Hz 3D video data acquisition, reconstruction, and display for over 300,000 measurement points per frame6,7.&#160;Binary defocusing DFP methods can achieve even greater speeds8.
Diverse applications can benefit from DFP techniques. Our collaborators have used our systems for facial function analysis9, facial animation10, cardiac mechanics studies11, and fluid surface measurements, but many other potential applications exist.&#160;This video will teach the fundamentals of DFP techniques and illustrate the design and operation of a binary defocusing DFP system.

This video describes the fundamentals of digital fringe projection techniques, which provide dense 3D measurements of dynamically changing surfaces.&#160;It also demonstrates the design and operation of a high-speed binary defocusing system based on these techniques.

De alta resolución, de alta velocidad, tridimensional de imágenes de vídeo con técnicas de proyección digital de Fringe

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses ...

Investigación

Ingeniería

Scalable Nanohelices for Predictive Studies and Enhanced 3D Visualization

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing applications.&#160; For predictive simulations, it has become increasingly important to be able to model the structure of nanohelices accurately.&#160; To study the effect of local structure on the properties of these complex geometries one must develop realistic models.&#160; To date, software packages are rather limited in creating atomistic helical models.&#160; This work focuses on producing atomistic models of silica glass (SiO2) nanoribbons and nanosprings for molecular dynamics (MD) simulations. Using an MD model of &#8220;bulk&#8221; silica glass, two computational procedures to precisely create the shape of nanoribbons and nanosprings are presented.&#160; The first method employs the AWK programming language and open-source software to effectively carve various shapes of silica nanoribbons from the initial bulk model, using desired dimensions and parametric equations to define a helix.&#160; With this method, accurate atomistic silica nanoribbons can be generated for a range of pitch values and dimensions.&#160; The second method involves a more robust code which allows flexibility in modeling nanohelical structures.&#160; This approach utilizes a C++ code particularly written to implement pre-screening methods as well as the mathematical equations for a helix, resulting in greater precision and efficiency when creating nanospring models.&#160; Using these codes, well-defined and scalable nanoribbons and nanosprings suited for atomistic simulations can be effectively created.&#160; An added value in both open-source codes is that they can be adapted to reproduce different helical structures, independent of material.&#160; In addition, a MATLAB graphical user interface (GUI) is used to enhance learning through visualization and interaction for a general user with the atomistic helical structures.&#160; One application of these methods is the recent study of nanohelices via MD simulations for mechanical energy harvesting purposes.

Accurate modeling of nanohelical structures is important for predictive simulation studies leading to novel nanotechnology applications.&#160; Currently, software packages and codes are limited in creating atomistic helical models.&#160; We present two procedures designed to create atomistic nanohelical models for simulations, and a graphical interface to enhance research through visualization.

Nanohelices escalables para estudios predictivos y mejorada visualización 3D

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing ...

Novel 3D/VR Interactive Environment for MD Simulations, Visualization and Analysis

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials science, biology, chemistry and physics among many others. A new computational system for the accurate and fast simulation and 3D/VR visualization of nanostructures is presented here, using the open-source molecular dynamics (MD) computer program LAMMPS. This alternative computational method uses modern graphics processors, NVIDIA CUDA technology and specialized scientific codes to overcome processing speed barriers common to traditional computing methods. In conjunction with a virtual reality system used to model materials, this enhancement allows the addition of accelerated MD simulation capability. The motivation is to provide a novel research environment which simultaneously allows visualization, simulation, modeling and analysis. The research goal is to investigate the structure and properties of inorganic nanostructures (e.g., silica glass nanosprings) under different conditions using this innovative computational system. The work presented outlines a description of the 3D/VR Visualization System and basic components, an overview of important considerations such as the physical environment, details on the setup and use of the novel system, a general procedure for the accelerated MD enhancement, technical information, and relevant remarks. The impact of this work is the creation of a unique computational system combining nanoscale materials simulation, visualization and interactivity in a virtual environment, which is both a research and teaching instrument at UC Merced.

A new computational system featuring GPU-accelerated molecular dynamics simulation and 3D/VR visualization, analysis and manipulation of nanostructures has been implemented, representing a novel approach to advance materials research and promote innovative investigation and alternative methods to learn about material structures with dimensions invisible to the human eye.

Novela 3D / VR Interactivo Medio Ambiente para MD simulaciones, visualización y análisis

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials ...

Energy Dispersive X-ray Tomography for 3D Elemental Mapping of Individual Nanoparticles

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial resolution, and is even capable of providing atomically resolved elemental maps. In this technique, a highly focused electron beam is incident upon a thin sample and the energy of emitted X-rays is measured in order to determine the atomic species of material within the beam path. This elementally sensitive spectroscopy technique can be extended to three dimensional tomographic imaging by acquiring multiple spectrum images with the sample tilted along an axis perpendicular to the electron beam direction.
Elemental distributions within single nanoparticles are often important for determining their optical, catalytic and magnetic properties. Techniques such as X-ray tomography and slice and view energy dispersive X-ray mapping in the scanning electron microscope provide elementally sensitive three dimensional imaging but are typically limited to spatial resolutions of &gt; 20 nm. Atom probe tomography provides near atomic resolution but preparing nanoparticle samples for atom probe analysis is often challenging. Thus, elementally sensitive techniques applied within the scanning transmission electron microscope are uniquely placed to study elemental distributions within nanoparticles of dimensions 10-100 nm.
Here, energy dispersive X-ray (EDX) spectroscopy within the STEM is applied to investigate the distribution of elements in single AgAu nanoparticles. The surface segregation of both Ag and Au, at different nanoparticle compositions, has been observed.

The use of energy dispersive X-ray tomography in the scanning transmission electron microscope to characterize elemental distributions within single nanoparticles in three dimensions is described.

La tomografía de rayos X de energía dispersiva de 3D Mapping elemental de nanopartículas individuales

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial ...

3D Printing of Biomolecular Models for Research and Pedagogy

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D structures are most often perceived using the two-dimensional and exclusively visual medium of the computer screen. Converting digital 3D molecular data into real objects enables information to be perceived through an expanded range of human senses, including direct stereoscopic vision, touch, and interaction. Such tangible models facilitate new insights, enable hypothesis testing, and serve as psychological or sensory anchors for conceptual information about the functions of biomolecules. Recent advances in consumer 3D printing technology enable, for the first time, the cost-effective fabrication of high-quality and scientifically accurate models of biomolecules in a variety of molecular representations. However, the optimization of the virtual model and its printing parameters is difficult and time consuming without detailed guidance. Here, we provide a guide on the digital design and physical fabrication of biomolecule models for research and pedagogy using open source or low-cost software and low-cost 3D printers that use fused filament fabrication technology.

Physical models of biomolecules can facilitate an understanding of their structure-function for the researcher, aid in communication between researchers, and serve as an educational tool in pedagogical endeavors. Here, we provide detailed guidance for the 3D printing of accurate models of biomolecules using fused filament fabrication desktop 3D printers.

La impresión 3D de Modelos de Investigación Biomolecular y Pedagogía

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D ...

A 3D-printed Chamber for Organic Optoelectronic Device Degradation Testing

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, using 3D-printing. As these types of devices are sensitive to moisture and oxygen, such a chamber can aid researchers in characterizing the electronic and stability properties. The chamber is intended to be used as a temporary, reusable, and stable environment with controlled properties (including humidity, gas introduction, and temperature). It can be used to protect air-sensitive materials or to expose them to contaminants in a controlled way for degradation studies. To characterize the properties of the chamber, we outline a simple procedure to determine the water vapor transmission rate (WVTR) using relative humidity as measured by a standard humidity sensor. This standard operating procedure, using a 50% infill density of polylactic acid (PLA), results in a chamber that can be used for weeks without any significant loss of device properties. The versatility and ease of use of the chamber allows it to be adapted to any characterization condition that requires a compact-controlled atmosphere.

Here, we present a protocol for the design, manufacture, and use of a simple, versatile 3D-printed and controlled atmospheric chamber for the optical and electrical characterization of air-sensitive organic optoelectronic devices.

Una cámara 3D impreso para dispositivos optoelectrónicos orgánicos degradación pruebas

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, ...

Multi-material Ceramic-Based Components &#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three dimensions for the geometry and one degree of freedom concerning the material properties at each position) the Thermoplastic 3D-Printing (CerAM -&#160;T3DP) was developed. It is a direct AM technology which allows the AM of multi-material components. To demonstrate the advantages of this technology black-and-white zirconia components were additively manufactured and co-sintered defect-free.
Two different pairs of black and white zirconia powders were used to prepare different thermoplastic suspensions. Appropriate dispensing parameters were investigated to manufacture single-material test components and adjusted for the additive manufacturing of multi-color zirconia components.

Multi-material Ceramic-Based Components &amp;#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

Here we describe a protocol for additively manufacturing black-and-white zirconia components by Thermoplastic 3D-Printing (CerAM -&#160;T3DP) and co-sintering defect-free.

Componentes múltiples materiales de cerámica – aditivos de fabricación de componentes de Zirconia en blanco y negro por impresión 3D termoplástica (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three ...

Additive Manufacturing of Functionally Graded Ceramic Materials by Stereolithography

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light processing/stereolithography, is developed within the scope of the CerAMfacturing European research project. A three-dimensional (3-D) hemi-maxillary bone-like structure is 3-D printed using custom aluminum oxide polymeric mixtures. The powders and mixtures are fully analyzed in terms of rheological behavior in order to ensure proper material handling during the printing process. The possibility to print functionally graded materials using the Admaflex technology is explained in this document. Field-emission scanning electron microscopy (FESEM) show that the sintered aluminum oxide ceramic part has a porosity lower than 1% and no remainder of the original layered structure is found after analysis.

This manuscript describes the processing of single multifunctional ceramic components (e.g., combinations of dense-porous structures) additively manufactured by stereolithography.

Fabricación aditiva de materiales cerámicos funcionalmente calificados por estereolitografía

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light ...

Manufacturing, Control, and Performance Evaluation of a Gecko-Inspired Soft Robot

This protocol presents a method for manufacturing, control, and evaluation of the performance of a soft robot that can climb inclined flat surfaces with slopes of up to 84&#176;. The manufacturing method is valid for the fast pneunet bending actuators in general and might, therefore, be interesting for newcomers to the field of actuator manufacturing. The control of the robot is achieved by means of a pneumatic control box that can provide arbitrary pressures and can be built by only using purchased components, a laser cutter, and a soldering iron. For the walking performance of the robot, the pressure-angle calibration plays a crucial role. Therefore, a semi-automated method for the pressure-angle calibration is presented. At high inclines (&#62; 70&#176;), the robot can no longer reliably fix itself to the walking plane. Therefore, the gait pattern is modified to ensure that the feet can be fixed on the walking plane.

This protocol provides a detailed list of steps to be performed for the manufacturing, control and evaluation of the climbing performance of a gecko-inspired soft robot.

Evaluación de fabricación, control y rendimiento de un robot blando inspirado en Gecko

This protocol presents a method for manufacturing, control, and evaluation of the performance of a soft robot that can climb inclined flat surfaces with ...

3D Printing - Evaluating Particle Emissions of a 3D Printing Pen

Three-dimensional (3D) printing as a type of additive manufacturing shows continuing increase in application and consumer popularity. The fused filament fabrication (FFF) is an inexpensive method used most frequently by consumers. Studies with 3D printers have shown that during the printing process particulate and volatile substances are released. Handheld 3D printing pens also use the FFF method but the consumer&#8217;s proximity to the 3D pens gives reason to higher exposure compared to a 3D printer. At the same time, 3D printing pens are often marketed for children who could be more sensitive to the printing emission. The aim of this study was to implement a low cost method to analyze the emissions of 3D printing pens. Polylactide (PLA) and acrylonitrile butadiene styrene (ABS) filaments of different colors were tested. In addition, filaments containing metal and carbon nanotubes (CNTs) were analyzed. An 18.5 L chamber and sampling close to the emission source was used to characterize emissions and concentrations near the breathing zone of the user.
Particle emissions and particle size distributions were measured and the potential release of metal particles and CNTs investigated. Particle number concentrations were found in a range of 105 - 106 particles/cm3, which is comparable to previous reports from 3D printers. Transmission electron microscopy (TEM) analysis showed nanoparticles of the different thermoplastic materials as well as of metal particles and CNTs. High contents of metal were observed by inductively coupled plasma mass spectrometry (ICP-MS).
These results call for a cautious use of 3D pens due to potential risk to the consumers.

This protocol presents a method to analyze the emission of 3D printing pens. Particle concentration and particle size distribution of the released particle is measured. Released particles are further analyzed with transmission electron microscopy (TEM). Metal content in filaments is quantified by inductively coupled plasma mass spectrometry (ICP-MS).

Impresión 3D - Evaluación de las emisiones de partículas de una pluma de impresión 3D

Three-dimensional (3D) printing as a type of additive manufacturing shows continuing increase in application and consumer popularity. The fused filament ...