This work was supported by the NSF (CMMI-1351370).

1. Máscaras de projeto para fabricação de substrato Donor <ol><li> Projete uma máscara com geometria desejada. Para fabricar 100 mm x 100 mm unidades individuais de silício quadrados, desenhe uma matriz de 100 mm x 100 mm quadrados. </li><li> Projetar uma segunda máscara com uma geometria idêntica, com cada lado que se estende um adicional de 15 mm. Para a matriz de 100 mm x 100 mm quadrados, desenhe uma matriz de 130 um x 130 mM quadrados que podem cobrir os quadrados no passo 1.1. </li><li> Projete a geometria âncora. Desenhar quatro 20 um x 40 um rectângulos, cada centrado ao longo de uma borda de um quadrado. Coloque as estruturas de modo que o primeiro 15 mM mM cobre o original de 100 x 100 mm quadrado no passo 1.1 e os restantes 25 mM estende para fora (como mostrado na Figura 2). NOTA: Qualquer forma e as dimensões podem ser utilizados, desde que os contactos de ancoragem, tanto o material de modelado e o substrato. Uma das extremidades desta âncora cobre a origemai geometria na etapa 1.1 e a outra extremidade deve prolongar para fora a geometria no passo 1.2. </li></ol> 2. Prepare Retrievable Substrato Donor <ol><li> Prepare um silício dopado tipo p em isolante (SOI) wafer com 3 mm de espessura de camada do dispositivo, com resistência de folha de 1-20 Ω • cm e espessura da camada de óxido de caixa de 1 mícron. NOTA: Para várias aplicações destes parâmetros podem ser alterados. </li><li> Giro casaco photoresist (AZ5214, 3.000 rpm por 30 segundos, 1,5 mm de espessura) e anexar a máscara projetada no passo 1.1. </li><li> Usando uma corrosão iônica reativa (RIE) instrumento padrão da camada de bolacha SOI dispositivo e remova a máscara de fotorresiste. Após esta etapa, a região gravado o RIE expôs a camada de óxido de caixa (Figura 2A). </li><li> Giro casaco photoresist (AZ5214, 3.000 rpm por 30 segundos, 1,5 mm de espessura) e padrão com máscara projetada no passo 1.2. </li><li> Aquece-se a bolacha em 125 ° C durante 90 segundos sobre uma placa quente. </li><li> Mergulhe a hóstia no49% HF por 50 segundos para gravar a camada de óxido de caixa exposto a partir do passo 2.3. Após secagem completa, remover o material fotosensitivo de mascaramento (Figura 2B). </li><li> Revestimento de rotação (AZ5214, 3000 rpm durante 30 segundos, de 1,5 mm de espessura) e padrão de concepção de ancoragem da etapa 1.3. </li><li> Aquece-se a bolacha em 125 ° C durante 90 segundos sobre uma placa quente. </li><li> Mergulhe em 49% HF por 50 min. Este passo grava a camada de óxido de quadro remanescente por debaixo da camada de silício dispositivo modelado restante, resultando em suspensão unidades individuais de silício sobre a foto-resistente (Figura 2C). </li></ol> 3. Máscaras de design para um selo MicroTip <ol><li> Projete uma máscara com um único 100 mm x 100 mm quadrado. </li><li> Projete uma máscara com múltiplas 12 um x 12 mM quadrados dentro de uma 100 mm x 100 área mM. </li></ol> 4. Fazer o molde para um selo MicroTip <ol><li> Limpe uma pastilha de silício com orientação cristalina de &lt;1-0-0&gt;, deposentar-se 100 nm de nitreto de silício usando Plasma aprimorado Chemical Vapor Deposition (PECVD) equipamentos. </li><li> Giro casaco photoresist (AZ5214, 3.000 rpm por 30 segundos, 1,5 mm de espessura) e padrão com máscara projetada no passo 3.2. </li><li> Padrão da camada de nitreto de silício usando 10:01 Buffered Oxide Etchant (BOE). </li><li> Dissolve-se 80 g de hidróxido de potássio (KOH) em 170 ml de água desionizada e 40 ml de álcool isopropílico (IPA) mistura numa proveta. </li><li> Aquecer o KOH, o IPA, e mistura de água a 80 ° C sobre uma placa quente. </li><li> Verticalmente colocar a pastilha preparada no recipiente com a mistura de KOH para gravar o silício exposta na estrutura cristalina (taxa de condicionamento é de cerca de 1 mM / min). </li><li> Após o silício exposto está totalmente gravado, remover a bolacha de mistura de KOH, gravar fora do nitreto de silício, utilizando HF, e executar RCA 1 e 2 RCA limpeza (Figura 3A). </li><li> Gire casaco com SU-8 100 e padrão com a máscara preparada a partir do passo 3.1 com seguinte receita: 3000 rh durante 1 min, coza suave a 65 ° C durante 10 min e 95 ° C durante 30 min, expor com 550 mJ / cm 2, e pós estufa a 65 ° C durante 1 min e 95 ° C durante 10 minutos (Figura 3B ). </li><li> Após o SU-8 100 está totalmente curada, aplicar uma monocamada de (tridecafluoro-1 ,1,2,3-tetra-hidro octil)-1-triclorossilano, largando 3-5 gotas de (tridecafluoro-1, 1,2,3 - tetra octil)-1-triclorossilano em um frasco de vácuo e de colocação da bolacha no frasco e aplicação do vácuo. </li></ol> 5. Duplicar um Selo MicroTip Usando um molde <ol><li> Mistura de polidimetilsiloxano (PDMS) de base e agente de cura com a relação de 5:1. </li><li> Degas a mistura, colocando-o em um frasco de vácuo. </li><li> Despeje uma pequena porção da mistura de PDMS desgaseificado no molde e permitir que o refluxo de PDMS de alcançar uma superfície de topo plana (Figura 3C). </li><li> Coloque o molde com PDMS em estufa a 70 ° C durante 2 horas para curar totalmente o PDMS. </li><li> Retirar o molde daforno e descascar as PDMS off (Figura 3D). </li></ol> 6. Recuperar tinta a partir do substrato de Doadores e Imprimir na área alvo <ol><li> Coloque o substrato doador para estágios, y-tradução de rotação e x motorizados equipados com um microscópio. </li><li> Fixe o selo microtip a um estágio de translação vertical independente. </li><li> Sob o microscópio, alinhar o selo microponta com a tinta sobre o substrato de Si doador utilizando translação e rotação fases. Além disso, fazer o alinhamento de inclinação entre a superfície e a microponta tinta Si ajustando uma fase de inclinação. Em seguida, leve o selo microtip para baixo para fazer contato. </li><li> Lentamente traga o selo microtip ainda mais para baixo após o contato inicial, de modo que pequenas dicas são totalmente em colapso e toda a superfície está em contato com a tinta Si no substrato doador. </li><li> Elevar rapidamente o palco z, quebrando as âncoras devido à grande área de contato entre o selo ea tinta microtip Si, para rECOLHER a tinta Si do substrato doador e anexá-lo ao selo microtip. NOTA: Quando o selo microtip está livre de qualquer estresse, o microtip comprimido restaura à sua forma piramidal original, tornando o mínimo de contato com a tinta Si recuperado. </li><li> Colocar o substrato receptor para um x, fase y-tradução e alinhar a tinta Si recuperado sob o selo de microponta na posição desejada. </li><li> Desça do palco z até que a tinta Si recuperado mal faz contato com o substrato receptor. </li><li> Após a tomada de contacto, elevar-se lentamente a fase de z para libertar a tinta Si, imprimindo-o no local desejado. </li></ol> 7. Processo de colagem <ol><li> Programa de um forno de tratamento térmico rápido a partir de ciclo de RT-se a 950 ° C em 90 segundos, e continuam a 950 ° C durante 10 min e arrefecer à temperatura ambiente (removendo qualquer fonte de calor no forno). </li><li> Colocar o substrato receptor impresso no forno num ambiente de ar ambiente e de recozimento a 950 °C durante 10 min para Si-Si de ligação ou a 360 ° C durante 30 min para Si-Au colagem. </li></ol>

<ol>
	<li>Stix, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Toward+&#8220;Point+one.">Toward &#8220;Point one.</a> Sci Am. Feb. , 90-95 (1995).</li><li>Appenzeler, T. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=The+Man+Who+Dared+to+Think+Small.">The Man Who Dared to Think Small.</a> Science. 254, 1300-1301 (1991).</li><li>Madou, M. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fundamentals+of+Microfabrications+The+Science+of+Miniaturization.">Fundamentals of Microfabrications The Science of Miniaturization.</a> , (2002).</li><li>Xia, Y., Whitesides, G. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Soft+Lithography.">Soft Lithography.</a> Angew Chem Int Ed. 38, 551-575 (1998).</li><li>Judy, J. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Microelectromechanical+systems+(MEMS)+fabrication,+design+and+applications.">Microelectromechanical systems (MEMS) fabrication, design and applications.</a> Smart Mater Struct. 10, 1134-1154 (2001).</li><li>Jain, V. K. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=.">.</a> Micromanufacturing Process. , (2012).</li><li>Keum, H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+micro-masonry+using+elastomeric+stamps+for+three-dimensional+microfabrication.">Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication.</a> J Micromech Microeng. 22, 55018 (2012).</li><li>Keum, H., Chung, H., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrical+Contact+at+The+Interface+between+Silicon+and+Transfer-Printed+Gold+Films+by+Eutectic+Joining.">Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining.</a> ACS Appl Mater Interfaces. 5, 6061 (2013).</li><li>Keum, H., Seong, M., Sinha, S., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrostatically+Driven+Collapsible+Au+Thin+Films+Assembled+Using+Transfer+Printing+for+Thermal+Switching.">Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching.</a> Appl Phys Lett. 100, 211904 (2012).</li><li>Klaassen, E. H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+and+deep+reactive+ion+etching:+a+new+technology+for+microstructures.">Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures.</a> Sens Actuators A. 52, 132-139 (1996).</li><li>Barth, P. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+for+fabrication+of+sensors+actuators+and+microstructures.">Silicon fusion bonding for fabrication of sensors actuators and microstructures.</a> Sens Actuators. A21 - A23, 919-926 (1990).</li></ol>

The authors have nothing to disclose.

Micro-alvenaria, apresentado na Figura 4, envolve a ligação de fusão de silício em um passo de ligação de material. Ligação de fusão de silício é obtido por colocação da amostra num forno de recozimento térmico rápido (forno RTA) e aquecer a amostra a 950 ° C durante 10 min. Esta condição de recozimento é tanto adotáveis ​​entre Si - Si e Si - SiO2 ligação 10,11. Alternativamente, o Au ligado com uma tira de Si, como visto na Figura 5C ado...

Sistemas microeletromecânicos (MEMS), como a miniaturização das máquinas 3D comuns em grande escala, são indispensáveis ​​para o avanço de tecnologias modernas, proporcionando melhorias de desempenho e redução de 1,2 custo de fabricação. No entanto, o ritmo atual de avanço tecnológico em MEMS não pode ser mantida sem inovações contínuas das tecnologias de fabrico 3-6. Microfabricação monolítico comum baseia-se principalmente em processos de camada-a-camada desenvolvidas para a fabricação de circuitos integrados (CI). Este método tem sido bastante bem sucedido a permitir a produção em massa de dispositivos MEMS de alto desempenho. No entanto, devido à sua complexa camada por camada e natureza eletroquimicamente subtrativo, fabricação de forma de diversamente estruturas e dispositivos de MEMS em 3D, enquanto fácil no mundo macro, é muito difícil de conseguir usar este microfabricação monolítico. Para habilitar mais flexível microfabricação 3D com menos complexidade do processo, que desenvolvido uma estratégia micromanufactura aditivo 3D (chamado de &quot;micro / nano-alvenaria&quot;), que envolve um conjunto baseado em impressão de transferência de materiais micro / nanoescala em conjunto com técnicas de colagem de material compatível com o tratamento térmico rápidos. De impressão por transferência é um método para transferir material em microescala sólidos (isto é, «tintas sólidas &#39;) a partir de um substrato, onde elas são geradas ou crescido para um substrato diferente, utilizando adesão seca controlada de carimbos elastoméricos. O procedimento típico de micro-alvenaria começa com a impressão de transferência. Tintas sólidas pré-fabricadas são transferência impresso usando um selo microtip que é uma forma avançada de carimbos elastoméricos e as estruturas impressas são posteriormente recozido com tratamento térmico rápido (RTA) para melhorar a tinta de tinta e aderência da tinta-substrato. Esta abordagem permite a produção da construção de estruturas em microescala incomuns e dispositivos que não podem ser acomodados utilizando outro metodo existenteds 7. Micro-alvenaria proporciona várias características atraentes que não estão presentes em outros métodos: (a) a capacidade de integrar tintas sólidas funcionais e estruturais de materiais diferentes para montar os sensores MEMS e atuadores todos integrados dentro da estrutura 3D; (B) as interfaces de tintas sólidas montados pode funcionar como contatos elétricos e térmicos 9,10; (C) a resolução espacial de montagem pode ser alto (~ 1 mm), utilizando processos litográficos altamente escaláveis ​​e bem compreendidas para a geração de tintas sólidas e estágios mecânicos altamente precisos para a transferência de impressão 7; e (d) as tintas sólidas funcionais e estruturais podem ser integrados em ambos os substratos rígidos e flexíveis no plano ou geometrias curvilíneas.

<table border="0" cellpadding="0" cellspacing="0" width="758">
	<tbody>
		<tr height="20">
			<td height="20" style="height:20px;width:217px;">Name of Material / Equipment</td>
			<td style="width:97px;">Company</td>
			<td style="width:97px;"></td>
			<td style="width:347px;">Comments / Description</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Az 5214</td>
			<td>Clariant</td>
			<td></td>
			<td>1.5 mm thick photoresist</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Su8-100</td>
			<td>Microchem</td>
			<td></td>
			<td>100 mm Photoresist used in mold</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Sylgard 184</td>
			<td>Dow Corning</td>
			<td></td>
			<td>PDMS mixed to fabricate stamp</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Hydrofluoric Acid</td>
			<td>Honeywell</td>
			<td></td>
			<td>Acid to etch silicon oxide layer</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Silicon on insulator</td>
			<td>Ultrasil</td>
			<td></td>
			<td>Donor substrate was fabricated</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">trichlorosilane</td>
			<td>Sigma-Aldrich</td>
			<td></td>
			<td>Chemical used to help pealing of PDMS from mold</td>
		</tr>
	</tbody>
</table>

micro-masonry for 3d additive micromanufacturing

De impressão por transferência é um método para transferir materiais micro / nanoescala sólidos (aqui chamado &quot;tintas&quot;) a partir de um substrato, onde elas são geradas para um substrato diferente, utilizando carimbos elastoméricos. Impressão de transferência permite a integração de materiais heterogêneos para o fabrico de estruturas ou sistemas funcionais sem exemplo, que são encontrados nos últimos dispositivos avançados, tais como células solares flexíveis e elásticos e matrizes de LED. Durante a impressão de transferência apresenta características únicas na capacidade de montagem de materiais, a utilização de camadas adesivas ou a modificação da superfície, tais como a deposição de auto-montagem em monocamada (SAM) em substratos para melhorar os processos de impressão dificulta a sua adaptação em larga micromontagem do sistema microeletromecânico (MEMS) estruturas e dispositivos. Para superar esta lacuna, foi desenvolvido um modo avançado de impressão de transferência que deterministically reúne objetos em microescala individuais unicamente através controlar a área de contato da superfície, sem qualquer alteração na superfície. A ausência de uma camada adesiva ou outra modificação e os processos de ligação de material subseqüentes garantir não só a fixação mecânica, mas também conexão térmica e elétrica entre os materiais reunidos, o que abre mais diversas aplicações em adaptação na construção de dispositivos MEMS incomuns.

Micro-alvenaria permite a integração material heterogêneo para gerar estruturas MEMS que são muito desafiador ou impossível de alcançar por meio de processos de microfabricação monolíticas. De modo a demonstrar a sua capacidade de, uma estrutura (chamado um &quot;micro bule &#39;) é fabricada exclusivamente por meio de micro-alvenaria. Figura 4A é uma imagem de microscópio óptico de tintas fabricadas de Si sobre um substrato de dador. As tintas são projetadas discos com diferentes dimensõ...

Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

Micro-masonry for 3D Additive Micromanufacturing

Este artigo apresenta uma estratégia micromanufactura aditivo 3D (chamado de &quot;micro-alvenaria &#39;) para a fabricação flexível de sistema microeletromecânicos (MEMS) estruturas e dispositivos. Esta abordagem envolve a montagem de base de impressão por transferência de materiais micro / nanoescala em conjunção com as técnicas de ligação de material compatível com o tratamento térmico rápido.

Micro-alvenaria para Aditivo 3D Microfabricação

Transfer printing is a method to transfer solid micro/nanoscale materials (herein called &#8216;inks&#8217;) from a substrate where they are generated to ...

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10.3K visualizações.  University of Illinois at Urbana-Champaign.  Este artigo apresenta uma estratégia micromanufactura aditivo 3D (chamado de "micro-alvenaria ') para a fabricação flexível de sistema microeletromecânicos (MEMS) estruturas e dispositivos. Esta abordagem envolve a montagem de base de impressão por transferência de materiais micro / nanoescala em conjunção com as técnicas de ligação de material compatível com o tratamento térmico rápido. 

Vídeo: Micro-masonry for 3D Additive Micromanufacturing

High-resolution, High-speed, Three-dimensional Video Imaging with Digital Fringe Projection Techniques

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses triangulation between matching points in two views of the same scene at different angles to compute depth.&#160;However, unlike a stereo-based method, DFP uses a digital video projector to replace one of the cameras1. The projector rapidly projects a known sinusoidal pattern onto the subject, and the surface of the subject distorts these patterns in the camera&#8217;s field of view. Three distorted patterns (fringe images) from the camera can be used to compute the depth using triangulation.
Unlike other 3D measurement methods, DFP techniques lead to systems that tend to be faster, lower in equipment cost, more flexible, and easier to develop.&#160;DFP systems can also achieve the same measurement resolution as the camera.&#160;For this reason, DFP and other digital structured light techniques have recently been the focus of intense research (as summarized in1-5). Taking advantage of DFP, the graphics processing unit, and optimized algorithms, we have developed a system capable of 30&#160;Hz 3D video data acquisition, reconstruction, and display for over 300,000 measurement points per frame6,7.&#160;Binary defocusing DFP methods can achieve even greater speeds8.
Diverse applications can benefit from DFP techniques. Our collaborators have used our systems for facial function analysis9, facial animation10, cardiac mechanics studies11, and fluid surface measurements, but many other potential applications exist.&#160;This video will teach the fundamentals of DFP techniques and illustrate the design and operation of a binary defocusing DFP system.

This video describes the fundamentals of digital fringe projection techniques, which provide dense 3D measurements of dynamically changing surfaces.&#160;It also demonstrates the design and operation of a high-speed binary defocusing system based on these techniques.

De alta resolução, de alta velocidade, de imagens de vídeo tridimensional com Franja Digital Técnicas de Projeção

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses ...

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Scalable Nanohelices for Predictive Studies and Enhanced 3D Visualization

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing applications.&#160; For predictive simulations, it has become increasingly important to be able to model the structure of nanohelices accurately.&#160; To study the effect of local structure on the properties of these complex geometries one must develop realistic models.&#160; To date, software packages are rather limited in creating atomistic helical models.&#160; This work focuses on producing atomistic models of silica glass (SiO2) nanoribbons and nanosprings for molecular dynamics (MD) simulations. Using an MD model of &#8220;bulk&#8221; silica glass, two computational procedures to precisely create the shape of nanoribbons and nanosprings are presented.&#160; The first method employs the AWK programming language and open-source software to effectively carve various shapes of silica nanoribbons from the initial bulk model, using desired dimensions and parametric equations to define a helix.&#160; With this method, accurate atomistic silica nanoribbons can be generated for a range of pitch values and dimensions.&#160; The second method involves a more robust code which allows flexibility in modeling nanohelical structures.&#160; This approach utilizes a C++ code particularly written to implement pre-screening methods as well as the mathematical equations for a helix, resulting in greater precision and efficiency when creating nanospring models.&#160; Using these codes, well-defined and scalable nanoribbons and nanosprings suited for atomistic simulations can be effectively created.&#160; An added value in both open-source codes is that they can be adapted to reproduce different helical structures, independent of material.&#160; In addition, a MATLAB graphical user interface (GUI) is used to enhance learning through visualization and interaction for a general user with the atomistic helical structures.&#160; One application of these methods is the recent study of nanohelices via MD simulations for mechanical energy harvesting purposes.

Accurate modeling of nanohelical structures is important for predictive simulation studies leading to novel nanotechnology applications.&#160; Currently, software packages and codes are limited in creating atomistic helical models.&#160; We present two procedures designed to create atomistic nanohelical models for simulations, and a graphical interface to enhance research through visualization.

Nanoespirais escaláveis ​​para estudos de previsão e melhor visualização 3D

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing ...

Novel 3D/VR Interactive Environment for MD Simulations, Visualization and Analysis

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials science, biology, chemistry and physics among many others. A new computational system for the accurate and fast simulation and 3D/VR visualization of nanostructures is presented here, using the open-source molecular dynamics (MD) computer program LAMMPS. This alternative computational method uses modern graphics processors, NVIDIA CUDA technology and specialized scientific codes to overcome processing speed barriers common to traditional computing methods. In conjunction with a virtual reality system used to model materials, this enhancement allows the addition of accelerated MD simulation capability. The motivation is to provide a novel research environment which simultaneously allows visualization, simulation, modeling and analysis. The research goal is to investigate the structure and properties of inorganic nanostructures (e.g., silica glass nanosprings) under different conditions using this innovative computational system. The work presented outlines a description of the 3D/VR Visualization System and basic components, an overview of important considerations such as the physical environment, details on the setup and use of the novel system, a general procedure for the accelerated MD enhancement, technical information, and relevant remarks. The impact of this work is the creation of a unique computational system combining nanoscale materials simulation, visualization and interactivity in a virtual environment, which is both a research and teaching instrument at UC Merced.

A new computational system featuring GPU-accelerated molecular dynamics simulation and 3D/VR visualization, analysis and manipulation of nanostructures has been implemented, representing a novel approach to advance materials research and promote innovative investigation and alternative methods to learn about material structures with dimensions invisible to the human eye.

Novel 3D / VR ambiente interativo para MD Simulações, visualização e análise

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials ...

Development of a 3D Graphene Electrode Dielectrophoretic Device

The design and fabrication of a novel 3D electrode microdevice using 50 &#181;m thick graphene paper and 100 &#181;m double sided tape is described. The protocol details the procedures to construct a versatile, reusable, multiple layer, laminated dielectrophoresis chamber. Specifically, six layers of 50 &#181;m x&#160;0.7 cm x&#160;2 cm graphene paper and five layers of double sided tape were alternately stacked together, then clamped to a glass slide. Then a 700 &#956;m diameter micro-well was drilled through the laminated structure using a computer-controlled micro drilling machine. Insulating properties of the tape layer between adjacent graphene layers were assured by resistance tests. Silver conductive epoxy connected alternate layers of graphene paper and formed stable connections between the graphene paper and external copper wire electrodes. The finished device was then clamped and sealed to a glass slide. The electric field gradient was modeled within the multi-layer device. Dielectrophoretic behaviors of 6 &#956;m polystyrene beads were demonstrated in the 1 mm deep micro-well, with medium conductivities ranging from 0.0001 S/m to 1.3 S/m, and applied signal frequencies from 100 Hz to 10 MHz. Negative dielectrophoretic responses were observed in three dimensions over most of the conductivity-frequency space and cross-over frequency values are consistent with previously reported literature values. The device did not prevent AC electroosmosis and electrothermal flows, which occurred in the low and high frequency regions, respectively. The graphene paper utilized in this device is versatile and could subsequently function as a biosensor after dielectrophoretic characterizations are complete.

A microdevice with high throughput potential is used to demonstrate three-dimensional (3D) dielectrophoresis (DEP) with novel materials. Graphene nanoplatelet paper and double sided tape were alternately stacked; a 700 &#956;m micro-well was drilled transverse to the layers. DEP behavior of polystyrene beads was demonstrated in the micro-well.

Desenvolvimento de um dispositivo 3D Grafeno Eletrodo dieletroforética

The design and fabrication of a novel 3D electrode microdevice using 50 &#181;m thick graphene paper and 100 &#181;m double sided tape is described. The ...

Energy Dispersive X-ray Tomography for 3D Elemental Mapping of Individual Nanoparticles

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial resolution, and is even capable of providing atomically resolved elemental maps. In this technique, a highly focused electron beam is incident upon a thin sample and the energy of emitted X-rays is measured in order to determine the atomic species of material within the beam path. This elementally sensitive spectroscopy technique can be extended to three dimensional tomographic imaging by acquiring multiple spectrum images with the sample tilted along an axis perpendicular to the electron beam direction.
Elemental distributions within single nanoparticles are often important for determining their optical, catalytic and magnetic properties. Techniques such as X-ray tomography and slice and view energy dispersive X-ray mapping in the scanning electron microscope provide elementally sensitive three dimensional imaging but are typically limited to spatial resolutions of &gt; 20 nm. Atom probe tomography provides near atomic resolution but preparing nanoparticle samples for atom probe analysis is often challenging. Thus, elementally sensitive techniques applied within the scanning transmission electron microscope are uniquely placed to study elemental distributions within nanoparticles of dimensions 10-100 nm.
Here, energy dispersive X-ray (EDX) spectroscopy within the STEM is applied to investigate the distribution of elements in single AgAu nanoparticles. The surface segregation of both Ag and Au, at different nanoparticle compositions, has been observed.

The use of energy dispersive X-ray tomography in the scanning transmission electron microscope to characterize elemental distributions within single nanoparticles in three dimensions is described.

Tomografia de raios-X de energia dispersiva para 3D Elemental Mapeamento de nanopartículas individuais

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial ...

Methods for Measuring the Orientation and Rotation Rate of 3D-printed Particles in Turbulence

Experimental methods are presented for measuring the rotational and translational motion of anisotropic particles in turbulent fluid flows. 3D printing technology is used to fabricate particles with slender arms connected at a common center. Shapes explored are crosses (two perpendicular rods), jacks (three perpendicular rods), triads (three rods in triangular planar symmetry), and tetrads (four arms in tetrahedral symmetry). Methods for producing on the order of 10,000 fluorescently dyed particles are described. Time-resolved measurements of their orientation and solid-body rotation rate are obtained from four synchronized videos of their motion in a turbulent flow between oscillating grids with R&#955; = 91. In this relatively low-Reynolds number flow, the advected particles are small enough that they approximate ellipsoidal tracer particles. We present results of time-resolved 3D trajectories of position and orientation of the particles as well as measurements of their rotation rates.

We use 3D printing to fabricate anisotropic particles in the shapes of jacks, crosses, tetrads, and triads, whose alignments and rotations in turbulent fluid flow can be measured from multiple simultaneous video images.

Métodos para medir a orientação e rotação Taxa de partículas em Turbulência 3D-impressos

Experimental methods are presented for measuring the rotational and translational motion of anisotropic particles in turbulent fluid flows. 3D printing ...

3D Printing of Biomolecular Models for Research and Pedagogy

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D structures are most often perceived using the two-dimensional and exclusively visual medium of the computer screen. Converting digital 3D molecular data into real objects enables information to be perceived through an expanded range of human senses, including direct stereoscopic vision, touch, and interaction. Such tangible models facilitate new insights, enable hypothesis testing, and serve as psychological or sensory anchors for conceptual information about the functions of biomolecules. Recent advances in consumer 3D printing technology enable, for the first time, the cost-effective fabrication of high-quality and scientifically accurate models of biomolecules in a variety of molecular representations. However, the optimization of the virtual model and its printing parameters is difficult and time consuming without detailed guidance. Here, we provide a guide on the digital design and physical fabrication of biomolecule models for research and pedagogy using open source or low-cost software and low-cost 3D printers that use fused filament fabrication technology.

Physical models of biomolecules can facilitate an understanding of their structure-function for the researcher, aid in communication between researchers, and serve as an educational tool in pedagogical endeavors. Here, we provide detailed guidance for the 3D printing of accurate models of biomolecules using fused filament fabrication desktop 3D printers.

Impressão 3D de biomoleculares Modelos de Investigação e Pedagogia

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D ...

A 3D-printed Chamber for Organic Optoelectronic Device Degradation Testing

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, using 3D-printing. As these types of devices are sensitive to moisture and oxygen, such a chamber can aid researchers in characterizing the electronic and stability properties. The chamber is intended to be used as a temporary, reusable, and stable environment with controlled properties (including humidity, gas introduction, and temperature). It can be used to protect air-sensitive materials or to expose them to contaminants in a controlled way for degradation studies. To characterize the properties of the chamber, we outline a simple procedure to determine the water vapor transmission rate (WVTR) using relative humidity as measured by a standard humidity sensor. This standard operating procedure, using a 50% infill density of polylactic acid (PLA), results in a chamber that can be used for weeks without any significant loss of device properties. The versatility and ease of use of the chamber allows it to be adapted to any characterization condition that requires a compact-controlled atmosphere.

Here, we present a protocol for the design, manufacture, and use of a simple, versatile 3D-printed and controlled atmospheric chamber for the optical and electrical characterization of air-sensitive organic optoelectronic devices.

Uma câmara 3D-impresso para orgânicos dispositivo optoeletrônico testes de degradação

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, ...

A Soft Tooling Process Chain for Injection Molding of a 3D Component with Micro Pillars

The purpose of this paper is to present the method of a soft tooling process chain employing Additive Manufacturing (AM) for fabrication of injection molding inserts with micro surface features. The Soft Tooling inserts are manufactured by Digital Light Processing (vat photo polymerization) using a photopolymer that can withstand relatively high temperaturea. The part manufactured here has four tines with an angle of 60&#176;. Micro pillars (&#216;200 &#181;m, aspect ratio of 1) are arranged on the surfaces by two rows. Polyethylene (PE) injection molding with the soft tooling inserts is used to fabricate the final parts. This method demonstrates that it is feasible to obtain injection-molded parts with microstructures on complex geometry by additive manufactured inserts. The machining time and cost is reduced significantly compared to conventional tooling processes based on computer numerical control (CNC) machining. The dimensions of the micro features are influenced by the applied additive manufacturing process. The lifetime of the inserts determines that this process is more suitable for pilot production. The precision of the inserts production is limited by the additive manufacturing process as well.

A protocol for fabricating injection molding inserts for complex geometry with micro features on surfaces employing Additive Manufacturing (AM) is presented.

Uma cadeia de processo de ferramental macio para moldagem por injeção de um componente 3D com Micro pilares

The purpose of this paper is to present the method of a soft tooling process chain employing Additive Manufacturing (AM) for fabrication of injection ...

Multi-material Ceramic-Based Components &#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three dimensions for the geometry and one degree of freedom concerning the material properties at each position) the Thermoplastic 3D-Printing (CerAM -&#160;T3DP) was developed. It is a direct AM technology which allows the AM of multi-material components. To demonstrate the advantages of this technology black-and-white zirconia components were additively manufactured and co-sintered defect-free.
Two different pairs of black and white zirconia powders were used to prepare different thermoplastic suspensions. Appropriate dispensing parameters were investigated to manufacture single-material test components and adjusted for the additive manufacturing of multi-color zirconia components.

Here we describe a protocol for additively manufacturing black-and-white zirconia components by Thermoplastic 3D-Printing (CerAM -&#160;T3DP) and co-sintering defect-free.

Componentes baseados em cerâmica multi materiais – aditivo de fabricação de componentes de zircônia em preto e branco por impressão 3D termoplástica (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three ...