This work was supported by the NSF (CMMI-1351370).

1. Maschere di progettazione per la fabbricazione di donatori substrato <ol><li> Progettare una maschera con geometria desiderata. Per fabbricare 100 micron x 100 micron unità individuali silicio quadri, disegnare una matrice di 100 micron x 100 micron quadrati. </li><li> Progettare una seconda maschera con una geometria identica, con ogni lato che si estende su un ulteriore 15 micron. Per la serie di 100 micron x 100 micron quadrati, disegnare un array di 130 micron x 130 micron quadrati in grado di coprire le piazze nella fase 1.1. </li><li> Progettare la geometria di ancoraggio. Disegna quattro 20 micron x 40 micron rettangoli, ognuno incentrato lungo un bordo di un quadrato. Posizionare le strutture in modo che il primo 15 micron copre l&#39;originale 100 micron x 100 micron quadrato nel passo 1.1 e il restante 25 micron si estende verso l&#39;esterno (come mostrato in Figura 2). NOTA: Qualsiasi forma e le dimensioni possono essere usati fino a quando i contatti di ancoraggio sia il materiale modellato e il substrato. Un&#39;estremità di questa ancora copre l&#39;origineAl geometria nel passaggio 1.1 e l&#39;altra estremità deve estendere la geometria nel passaggio 1.2. </li></ol> 2. Preparare Retrievable donatori substrato <ol><li> Preparare un silicio drogato di tipo p su isolante (SOI) wafer con 3 dispositivo micron spessore, con resistenza dello strato di 1-20 Ω • cm e scatola spessore dello strato di ossido di 1 micron. NOTA: Per le varie applicazioni di questi parametri possono essere modificati. </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) e fissare la maschera progettata nella fase 1.1. </li><li> Utilizzando una incisione a ioni reattivi (RIE) strumento, modello strato periferica del wafer SOI e rimuovere la maschera di fotoresist. Dopo questo passo, la regione inciso RIE ha esposto lo strato di ossido di dialogo (Figura 2A). </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) ed il modello con la mascherina disegnata nel passaggio 1.2. </li><li> Riscaldare il wafer a 125 ° C per 90 secondi su una piastra calda. </li><li> Immergere il wafer in49% HF per 50 sec per incidere lo strato di ossido casella esposto dal punto 2.3. Dopo completa essiccazione, rimuovere il photoresist mascheratura (Figura 2B). </li><li> Cappotto Spin (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) e il modello il disegno di ancoraggio dal punto 1.3. </li><li> Riscaldare il wafer a 125 ° C per 90 secondi su una piastra calda. </li><li> Immergetevi nel 49% HF per 50 min. Questo passaggio incide lo strato di ossido casella restante sotto il restante silicio strato modellato dispositivo, con conseguente sospensione silicio unità individuali sul photoresist (Figura 2C). </li></ol> 3. Maschere di design per uno Stamp microtip <ol><li> Progettare una maschera con un solo 100 micron x 100 micron quadrati. </li><li> Progettare una maschera con più 12 micron x 12 micron quadrati all&#39;interno di un 100 micron x 100 micron zona. </li></ol> 4. Fare la muffa per uno Stamp microtip <ol><li> Pulire un wafer di silicio con orientazione cristallina &lt;1-0-0&gt;, deposit 100 nm di nitruro di silicio utilizzando Plasma avanzata Chemical Vapor Deposition (PECVD) attrezzature. </li><li> Spin cappotto photoresist (AZ5214, 3.000 rpm per 30 sec, 1,5 micron di spessore) ed il modello con la mascherina disegnata nel passaggio 3.2. </li><li> Motivo dello strato di nitruro di silicio utilizzando 10:01 Buffered Oxide Etchant (BOE). </li><li> Sciogliere 80 g di idrossido di potassio (KOH) in 170 ml di acqua deionizzata e 40 ml di alcool isopropilico (IPA) miscela un becher. </li><li> Riscaldare la, IPA, e miscela acqua KOH al 80 ° C su una piastra calda. </li><li> Posizionare verticalmente il wafer preparati nel beker con miscela KOH per incidere il silicio esposto a struttura cristallina (velocità di attacco è di circa 1 micron / min). </li><li> Dopo il silicio esposto è completamente inciso, rimuovere il wafer da miscela di KOH, etch via il nitruro di silicio con HF ed eseguire RCA 1 e 2 RCA pulizia (Figura 3A). </li><li> Spin cappotto con SU-8 100 e modello con la maschera preparata dal punto 3.1 con il seguente ricetta: 3.000 rpm per 1 min, cuocere morbido a 65 ° C per 10 min e 95 ° C per 30 min, esporre con 550 mJ / cm 2, e post cuocere in forno a 65 ° C per 1 minuto e 95 ° C per 10 min (Figura 3B ). </li><li> Dopo il SU-8 100 è completamente guarito, applicare un monostrato di (tridecafluoro-1 ,1,2,3-tetraidro ottil)-1-triclorosilano facendo cadere 3-5 gocce di (tridecafluoro-1, 1,2,3 - tetraidro ottil)-1-triclorosilano in un vaso vuoto e mettendo il wafer nel vaso e applicando il vuoto. </li></ol> 5. Duplicare uno Stamp microtip utilizzando uno stampo <ol><li> Mescolare polidimetilsilossano (PDMS) base e il catalizzatore con il rapporto di 5:1. </li><li> Degassarla miscela ponendolo in un vaso vuoto. </li><li> Versare una piccola porzione della miscela degasato PDMS sullo stampo e lasciare che il riflusso PDMS per ottenere una superficie superiore piana (Figura 3C). </li><li> Collocare lo stampo con PDMS nel forno a 70 ° C per 2 ore per curare completamente il PDMS. </li><li> Rimuovere lo stampo dallaforno e sbucciare le PDMS off (Figura 3D). </li></ol> 6. Recuperare inchiostro dal supporto dei donatori e stampa sullo Spazio target <ol><li> Posizionare il substrato donatore, su fasi y-rototraslazione ed x motorizzato provvisto di un microscopio. </li><li> Attaccare il timbro microtip ad una fase di traslazione verticale indipendente. </li><li> Al microscopio, allineare il timbro micropunte con l&#39;inchiostro sul substrato di Si donatore mediante traslazione e rotazione fasi. Inoltre, fare l&#39;allineamento inclinazione tra la superficie microtip e l&#39;inchiostro Si regolando una fase di ribaltamento. Successivamente, portare il timbro microtip giù per fare contatto. </li><li> Lentamente portare il timbro micropunte ridurre ulteriormente dopo il contatto iniziale, in modo che le piccole punte sono completamente crollati e l&#39;intera superficie è a contatto con l&#39;inchiostro Si su substrato donatore. </li><li> Aumentare rapidamente la fase z, rompendo le ancore a causa della grande area di contatto tra il timbro micropunte e l&#39;inchiostro Si, per rRECUPERO l&#39;inchiostro Si dal substrato donatore e allegarlo al timbro microtip. NOTA: Quando il timbro microtip è priva di qualsiasi stress, la microtip compresso restituisce alla sua forma piramidale originale, rendendo minimo contatto con l&#39;inchiostro Si recuperato. </li><li> Posizionare il ricevitore su un substrato x, y-stadio traduzione e allineare l&#39;inchiostro Si recuperato sotto il timbro micropunte nella posizione desiderata. </li><li> Scendere la fase z finché l&#39;inchiostro Si recuperato rende a malapena contatto con il substrato ricevitore. </li><li> Dopo il contatto, sollevare lentamente la fase z per rilasciare l&#39;inchiostro Si, stampandolo sulla posizione desiderata. </li></ol> 7. Processo di incollaggio <ol><li> Programmare un forno di ricottura termica rapida ciclare da RT fino a 950 ° C in 90 sec, rimangono a 950 ° C per 10 minuti e raffreddare a RT (eliminando qualsiasi fornitura di calore nel forno). </li><li> Posizionare il substrato ricevente stampato in forno in un ambiente di aria ambiente e ricottura a 950 °C per 10 min per Si-Si incollaggio oa 360 ° C per 30 min per Si-Au bonding. </li></ol>

<ol>
	<li>Stix, G. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Toward+&#8220;Point+one.">Toward &#8220;Point one.</a> Sci Am. Feb. , 90-95 (1995).</li><li>Appenzeler, T. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=The+Man+Who+Dared+to+Think+Small.">The Man Who Dared to Think Small.</a> Science. 254, 1300-1301 (1991).</li><li>Madou, M. J. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Fundamentals+of+Microfabrications+The+Science+of+Miniaturization.">Fundamentals of Microfabrications The Science of Miniaturization.</a> , (2002).</li><li>Xia, Y., Whitesides, G. M. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Soft+Lithography.">Soft Lithography.</a> Angew Chem Int Ed. 38, 551-575 (1998).</li><li>Judy, J. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Microelectromechanical+systems+(MEMS)+fabrication,+design+and+applications.">Microelectromechanical systems (MEMS) fabrication, design and applications.</a> Smart Mater Struct. 10, 1134-1154 (2001).</li><li>Jain, V. K. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=.">.</a> Micromanufacturing Process. , (2012).</li><li>Keum, H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+micro-masonry+using+elastomeric+stamps+for+three-dimensional+microfabrication.">Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication.</a> J Micromech Microeng. 22, 55018 (2012).</li><li>Keum, H., Chung, H., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrical+Contact+at+The+Interface+between+Silicon+and+Transfer-Printed+Gold+Films+by+Eutectic+Joining.">Electrical Contact at The Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining.</a> ACS Appl Mater Interfaces. 5, 6061 (2013).</li><li>Keum, H., Seong, M., Sinha, S., Kim, S. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Electrostatically+Driven+Collapsible+Au+Thin+Films+Assembled+Using+Transfer+Printing+for+Thermal+Switching.">Electrostatically Driven Collapsible Au Thin Films Assembled Using Transfer Printing for Thermal Switching.</a> Appl Phys Lett. 100, 211904 (2012).</li><li>Klaassen, E. H., et al. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+and+deep+reactive+ion+etching:+a+new+technology+for+microstructures.">Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures.</a> Sens Actuators A. 52, 132-139 (1996).</li><li>Barth, P. W. <a target="_blank" href="http://www.ncbi.nlm.nih.gov/entrez/query.fcgi?db=PubMed&cmd=Search&doptcmdl=Citation&defaultField=Title+Word&term=Silicon+fusion+bonding+for+fabrication+of+sensors+actuators+and+microstructures.">Silicon fusion bonding for fabrication of sensors actuators and microstructures.</a> Sens Actuators. A21 - A23, 919-926 (1990).</li></ol>

The authors have nothing to disclose.

Micro-muratura, illustrato nella figura 4, prevede l&#39;incollaggio fusione di silicio in una fase di saldatura del materiale. Silicon legame di fusione si ottiene ponendo il campione in un forno di ricottura termica rapida (forno RTA) e riscaldamento del campione a 950 ° C per 10 min. Questa condizione di ricottura è sia adottabile tra Si - Si e Si - SiO 2 bonding 10,11. In alternativa, l&#39;Au legato con una striscia di Si come si trova nella Figura 5C adotta...

Sistemi microelettromeccanici (MEMS), come la miniaturizzazione su larga scala macchine 3D ordinarie, sono indispensabili per far progredire le tecnologie moderne, fornendo miglioramenti delle prestazioni e 1,2 di riduzione dei costi di produzione. Tuttavia, l&#39;attuale tasso di progresso tecnologico in MEMS non può essere mantenuta senza continue innovazioni nelle tecnologie di produzione 3-6. Microfabbricazione monolitico comune si basa principalmente su processi layer-by-layer sviluppati per la fabbricazione di circuiti integrati (IC). Questo metodo ha avuto successo a permettere la produzione di massa di dispositivi MEMS ad alte prestazioni. Tuttavia, a causa della sua complessa layer-by-layer e natura elettrochimica sottrattiva, fabbricazione di forma-diversamente strutture e dispositivi MEMS 3D, mentre facile nel macroworld, è molto difficile da realizzare utilizzando questo microfabbricazione monolitico. Per attivare microfabbricazione 3D più flessibile con la complessità meno di processo, ci DEVEluppato una strategia 3D additivo micromanufacturing (chiamato &#39;micro / nano-massoneria&#39;), che coinvolge un gruppo basato su stampa, trasferimento di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici. Stampa transfer è un metodo per trasferire materiali solidi microscala (ossia &#39;inchiostri solidi ») da un substrato in cui sono generati o coltivate su un substrato diverso utilizzando adesione secco controllata di Stamp elastomerici. La procedura tipica di micro-muratura inizia con stampa transfer. Inchiostri solidi prefabbricate sono il trasferimento stampato con un timbro microtip che è una forma avanzata di francobolli elastomerici e le strutture stampate sono successivamente ricotto con una rapida ricottura termica (RTA) che permettono di migliorare inchiostro inchiostro e ink-substrato adesione. Questo approccio produttivo consente la costruzione di strutture microscala insoliti e dispositivi che non possono essere ospitati con altre metodologia esistenteds 7. Micro-massoneria fornisce diverse caratteristiche interessanti non presenti in altri metodi: (a) la capacità di integrare inchiostri solidi funzionali e strutturali di materiali dissimili da montare sensori MEMS e attuatori tutto integrato all&#39;interno della struttura 3D; (B) le interfacce di inchiostri solidi assemblati possono funzionare come contatti elettrici e termici 9,10; (C) la risoluzione spaziale assemblaggio può essere elevata (~ 1 micron) utilizzando processi litografici altamente scalabili e di facile comprensione per la generazione di inchiostri solidi e fasi meccaniche altamente precisi per stampa transfer 7; e (d) inchiostri solidi funzionali e strutturali possono essere integrati su entrambi i substrati rigidi e flessibili in planare o geometrie curvilinee.

<table border="0" cellpadding="0" cellspacing="0" width="758">
	<tbody>
		<tr height="20">
			<td height="20" style="height:20px;width:217px;">Name of Material / Equipment</td>
			<td style="width:97px;">Company</td>
			<td style="width:97px;"></td>
			<td style="width:347px;">Comments / Description</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Az 5214</td>
			<td>Clariant</td>
			<td></td>
			<td>1.5 mm thick photoresist</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Su8-100</td>
			<td>Microchem</td>
			<td></td>
			<td>100 mm Photoresist used in mold</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Sylgard 184</td>
			<td>Dow Corning</td>
			<td></td>
			<td>PDMS mixed to fabricate stamp</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Hydrofluoric Acid</td>
			<td>Honeywell</td>
			<td></td>
			<td>Acid to etch silicon oxide layer</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">Silicon on insulator</td>
			<td>Ultrasil</td>
			<td></td>
			<td>Donor substrate was fabricated</td>
		</tr>
		<tr height="20">
			<td height="20" style="height:20px;">trichlorosilane</td>
			<td>Sigma-Aldrich</td>
			<td></td>
			<td>Chemical used to help pealing of PDMS from mold</td>
		</tr>
	</tbody>
</table>

micro-masonry for 3d additive micromanufacturing

Stampa transfer è un metodo per trasferire materiali micro / nanoscala solidi (qui chiamati &quot;inchiostri&quot;) da un substrato in cui sono generati ad un substrato diverso utilizzando Stamp elastomerici. Stampa transfer consente l&#39;integrazione di materiali eterogenei per fabbricare strutture unexampled o sistemi funzionali che si trovano in dispositivi avanzati recenti come celle solari flessibili ed estensibili e array LED. Durante la stampa transfer presenta caratteristiche uniche nella capacità di assemblaggio materiale, l&#39;uso di strati adesivi o la modifica della superficie, come la deposizione di monostrati auto-assemblati (SAM) su substrati per migliorare i processi di stampa ostacola la sua vasta adattamento in microstruttura del sistema microelettromeccanici (MEMS) strutture e dispositivi. Per ovviare a questo inconveniente, abbiamo sviluppato una modalità avanzata di stampa a trasferimento che assembla in modo deterministico oggetti microscala singoli esclusivamente attraverso il controllo superficie di area di contattosenza alcuna alterazione superficiale. L&#39;assenza di uno strato adesivo o altra modificazione e processi materiale legante successive garantire non solo legame meccanico, ma anche il collegamento elettrico e termico tra materiali assemblati, che apre ulteriormente varie applicazioni in adattamento a costruire dispositivi MEMS insoliti.

Micro-massoneria consente l&#39;integrazione di materiale eterogeneo per generare strutture MEMS che sono molto difficili o impossibili da raggiungere da processi di microfabbricazione monolitici. Al fine di dimostrare la sua capacità, una struttura (chiamato &#39;micro teiera&#39;) è realizzato esclusivamente mediante micro-muratura. Figura 4A è un&#39;immagine al microscopio ottico di inchiostri di Si fabbricato su un substrato donatore. Gli inchiostri progettati sono dischi con diverse dimensioni ...

Watch this Scientific Journal Video about Micro-masonry for 3D Additive Micromanufacturing at JoVE.com

Micro-masonry for 3D Additive Micromanufacturing

Questo articolo introduce una strategia 3D additivo micromanufacturing (chiamato &#39;micro-massoneria&#39;) per la fabbricazione flessibile del sistema microelettromeccanici (MEMS) strutture e dispositivi. Questo approccio comporta il trasferimento di montaggio a base di stampa, di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici.

Micro-muratura per 3D Additivo Micromanufacturing

Transfer printing is a method to transfer solid micro/nanoscale materials (herein called &#8216;inks&#8217;) from a substrate where they are generated to ...

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10.3K Views.  University of Illinois at Urbana-Champaign.  Questo articolo introduce una strategia 3D additivo micromanufacturing (chiamato 'micro-massoneria') per la fabbricazione flessibile del sistema microelettromeccanici (MEMS) strutture e dispositivi. Questo approccio comporta il trasferimento di montaggio a base di stampa, di materiali micro / nanoscala in combinazione con tecniche rapide materiale di incollaggio ricottura abilitato termici. 

Video: Micro-masonry for 3D Additive Micromanufacturing

High-resolution, High-speed, Three-dimensional Video Imaging with Digital Fringe Projection Techniques

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses triangulation between matching points in two views of the same scene at different angles to compute depth.&#160;However, unlike a stereo-based method, DFP uses a digital video projector to replace one of the cameras1. The projector rapidly projects a known sinusoidal pattern onto the subject, and the surface of the subject distorts these patterns in the camera&#8217;s field of view. Three distorted patterns (fringe images) from the camera can be used to compute the depth using triangulation.
Unlike other 3D measurement methods, DFP techniques lead to systems that tend to be faster, lower in equipment cost, more flexible, and easier to develop.&#160;DFP systems can also achieve the same measurement resolution as the camera.&#160;For this reason, DFP and other digital structured light techniques have recently been the focus of intense research (as summarized in1-5). Taking advantage of DFP, the graphics processing unit, and optimized algorithms, we have developed a system capable of 30&#160;Hz 3D video data acquisition, reconstruction, and display for over 300,000 measurement points per frame6,7.&#160;Binary defocusing DFP methods can achieve even greater speeds8.
Diverse applications can benefit from DFP techniques. Our collaborators have used our systems for facial function analysis9, facial animation10, cardiac mechanics studies11, and fluid surface measurements, but many other potential applications exist.&#160;This video will teach the fundamentals of DFP techniques and illustrate the design and operation of a binary defocusing DFP system.

This video describes the fundamentals of digital fringe projection techniques, which provide dense 3D measurements of dynamically changing surfaces.&#160;It also demonstrates the design and operation of a high-speed binary defocusing system based on these techniques.

Digital fringe projection (DFP) techniques provide dense 3D measurements of dynamically changing surfaces.&#160;Like the human eyes and brain, DFP uses ...

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Scalable Nanohelices for Predictive Studies and Enhanced 3D Visualization

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing applications.&#160; For predictive simulations, it has become increasingly important to be able to model the structure of nanohelices accurately.&#160; To study the effect of local structure on the properties of these complex geometries one must develop realistic models.&#160; To date, software packages are rather limited in creating atomistic helical models.&#160; This work focuses on producing atomistic models of silica glass (SiO2) nanoribbons and nanosprings for molecular dynamics (MD) simulations. Using an MD model of &#8220;bulk&#8221; silica glass, two computational procedures to precisely create the shape of nanoribbons and nanosprings are presented.&#160; The first method employs the AWK programming language and open-source software to effectively carve various shapes of silica nanoribbons from the initial bulk model, using desired dimensions and parametric equations to define a helix.&#160; With this method, accurate atomistic silica nanoribbons can be generated for a range of pitch values and dimensions.&#160; The second method involves a more robust code which allows flexibility in modeling nanohelical structures.&#160; This approach utilizes a C++ code particularly written to implement pre-screening methods as well as the mathematical equations for a helix, resulting in greater precision and efficiency when creating nanospring models.&#160; Using these codes, well-defined and scalable nanoribbons and nanosprings suited for atomistic simulations can be effectively created.&#160; An added value in both open-source codes is that they can be adapted to reproduce different helical structures, independent of material.&#160; In addition, a MATLAB graphical user interface (GUI) is used to enhance learning through visualization and interaction for a general user with the atomistic helical structures.&#160; One application of these methods is the recent study of nanohelices via MD simulations for mechanical energy harvesting purposes.

Accurate modeling of nanohelical structures is important for predictive simulation studies leading to novel nanotechnology applications.&#160; Currently, software packages and codes are limited in creating atomistic helical models.&#160; We present two procedures designed to create atomistic nanohelical models for simulations, and a graphical interface to enhance research through visualization.

Nanohelices scalabili per predittivi Studi e migliorata visualizzazione 3D

Spring-like materials are ubiquitous in nature and of interest in nanotechnology for energy harvesting, hydrogen storage, and biological sensing ...

Novel 3D/VR Interactive Environment for MD Simulations, Visualization and Analysis

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials science, biology, chemistry and physics among many others. A new computational system for the accurate and fast simulation and 3D/VR visualization of nanostructures is presented here, using the open-source molecular dynamics (MD) computer program LAMMPS. This alternative computational method uses modern graphics processors, NVIDIA CUDA technology and specialized scientific codes to overcome processing speed barriers common to traditional computing methods. In conjunction with a virtual reality system used to model materials, this enhancement allows the addition of accelerated MD simulation capability. The motivation is to provide a novel research environment which simultaneously allows visualization, simulation, modeling and analysis. The research goal is to investigate the structure and properties of inorganic nanostructures (e.g., silica glass nanosprings) under different conditions using this innovative computational system. The work presented outlines a description of the 3D/VR Visualization System and basic components, an overview of important considerations such as the physical environment, details on the setup and use of the novel system, a general procedure for the accelerated MD enhancement, technical information, and relevant remarks. The impact of this work is the creation of a unique computational system combining nanoscale materials simulation, visualization and interactivity in a virtual environment, which is both a research and teaching instrument at UC Merced.

A new computational system featuring GPU-accelerated molecular dynamics simulation and 3D/VR visualization, analysis and manipulation of nanostructures has been implemented, representing a novel approach to advance materials research and promote innovative investigation and alternative methods to learn about material structures with dimensions invisible to the human eye.

Romanzo 3D / VR Interactive Environment per MD simulazioni, visualizzazione e l&#39;analisi

The increasing development of computing (hardware and software) in the last decades has impacted scientific research in many fields including materials ...

Energy Dispersive X-ray Tomography for 3D Elemental Mapping of Individual Nanoparticles

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial resolution, and is even capable of providing atomically resolved elemental maps. In this technique, a highly focused electron beam is incident upon a thin sample and the energy of emitted X-rays is measured in order to determine the atomic species of material within the beam path. This elementally sensitive spectroscopy technique can be extended to three dimensional tomographic imaging by acquiring multiple spectrum images with the sample tilted along an axis perpendicular to the electron beam direction.
Elemental distributions within single nanoparticles are often important for determining their optical, catalytic and magnetic properties. Techniques such as X-ray tomography and slice and view energy dispersive X-ray mapping in the scanning electron microscope provide elementally sensitive three dimensional imaging but are typically limited to spatial resolutions of &gt; 20 nm. Atom probe tomography provides near atomic resolution but preparing nanoparticle samples for atom probe analysis is often challenging. Thus, elementally sensitive techniques applied within the scanning transmission electron microscope are uniquely placed to study elemental distributions within nanoparticles of dimensions 10-100 nm.
Here, energy dispersive X-ray (EDX) spectroscopy within the STEM is applied to investigate the distribution of elements in single AgAu nanoparticles. The surface segregation of both Ag and Au, at different nanoparticle compositions, has been observed.

The use of energy dispersive X-ray tomography in the scanning transmission electron microscope to characterize elemental distributions within single nanoparticles in three dimensions is described.

Tomografia a dispersione di energia dei raggi X per il 3D Elemental mappatura delle nanoparticelle individuali

Energy dispersive X-ray spectroscopy within the scanning transmission electron microscope (STEM) provides accurate elemental analysis with high spatial ...

3D Printing of Biomolecular Models for Research and Pedagogy

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D structures are most often perceived using the two-dimensional and exclusively visual medium of the computer screen. Converting digital 3D molecular data into real objects enables information to be perceived through an expanded range of human senses, including direct stereoscopic vision, touch, and interaction. Such tangible models facilitate new insights, enable hypothesis testing, and serve as psychological or sensory anchors for conceptual information about the functions of biomolecules. Recent advances in consumer 3D printing technology enable, for the first time, the cost-effective fabrication of high-quality and scientifically accurate models of biomolecules in a variety of molecular representations. However, the optimization of the virtual model and its printing parameters is difficult and time consuming without detailed guidance. Here, we provide a guide on the digital design and physical fabrication of biomolecule models for research and pedagogy using open source or low-cost software and low-cost 3D printers that use fused filament fabrication technology.

Physical models of biomolecules can facilitate an understanding of their structure-function for the researcher, aid in communication between researchers, and serve as an educational tool in pedagogical endeavors. Here, we provide detailed guidance for the 3D printing of accurate models of biomolecules using fused filament fabrication desktop 3D printers.

La stampa 3D dei modelli biomolecolari per la Ricerca e Pedagogia

The construction of physical three-dimensional (3D) models of biomolecules can uniquely contribute to the study of the structure-function relationship. 3D ...

A 3D-printed Chamber for Organic Optoelectronic Device Degradation Testing

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, using 3D-printing. As these types of devices are sensitive to moisture and oxygen, such a chamber can aid researchers in characterizing the electronic and stability properties. The chamber is intended to be used as a temporary, reusable, and stable environment with controlled properties (including humidity, gas introduction, and temperature). It can be used to protect air-sensitive materials or to expose them to contaminants in a controlled way for degradation studies. To characterize the properties of the chamber, we outline a simple procedure to determine the water vapor transmission rate (WVTR) using relative humidity as measured by a standard humidity sensor. This standard operating procedure, using a 50% infill density of polylactic acid (PLA), results in a chamber that can be used for weeks without any significant loss of device properties. The versatility and ease of use of the chamber allows it to be adapted to any characterization condition that requires a compact-controlled atmosphere.

Here, we present a protocol for the design, manufacture, and use of a simple, versatile 3D-printed and controlled atmospheric chamber for the optical and electrical characterization of air-sensitive organic optoelectronic devices.

Una camera di stampa 3D per organico dispositivo optoelettronico degradazione test

In this manuscript, we outline the manufacture of a small, portable, easy-to-use atmospheric chamber for organic and perovskite optoelectronic devices, ...

Multi-material Ceramic-Based Components &#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three dimensions for the geometry and one degree of freedom concerning the material properties at each position) the Thermoplastic 3D-Printing (CerAM -&#160;T3DP) was developed. It is a direct AM technology which allows the AM of multi-material components. To demonstrate the advantages of this technology black-and-white zirconia components were additively manufactured and co-sintered defect-free.
Two different pairs of black and white zirconia powders were used to prepare different thermoplastic suspensions. Appropriate dispensing parameters were investigated to manufacture single-material test components and adjusted for the additive manufacturing of multi-color zirconia components.

Multi-material Ceramic-Based Components &amp;#8211; Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

Here we describe a protocol for additively manufacturing black-and-white zirconia components by Thermoplastic 3D-Printing (CerAM -&#160;T3DP) and co-sintering defect-free.

Componenti ceramici multi-materiali – additivo produzione di componenti di Zirconia in bianco e nero di stampa 3D termoplastico (CerAM - T3DP)

To combine the benefits of Additive Manufacturing (AM) with the benefits of Functionally Graded Materials (FGM) to ceramic-based 4D components (three ...

Additive Manufacturing of Functionally Graded Ceramic Materials by Stereolithography

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light processing/stereolithography, is developed within the scope of the CerAMfacturing European research project. A three-dimensional (3-D) hemi-maxillary bone-like structure is 3-D printed using custom aluminum oxide polymeric mixtures. The powders and mixtures are fully analyzed in terms of rheological behavior in order to ensure proper material handling during the printing process. The possibility to print functionally graded materials using the Admaflex technology is explained in this document. Field-emission scanning electron microscopy (FESEM) show that the sintered aluminum oxide ceramic part has a porosity lower than 1% and no remainder of the original layered structure is found after analysis.

This manuscript describes the processing of single multifunctional ceramic components (e.g., combinations of dense-porous structures) additively manufactured by stereolithography.

Produzione di additivi di materiali ceramici funzionalmente graduate di stereolitografia

An additive manufacturing technology is applied to obtain functionally graded ceramic parts. This technology, based on digital light ...

Manufacturing, Control, and Performance Evaluation of a Gecko-Inspired Soft Robot

This protocol presents a method for manufacturing, control, and evaluation of the performance of a soft robot that can climb inclined flat surfaces with slopes of up to 84&#176;. The manufacturing method is valid for the fast pneunet bending actuators in general and might, therefore, be interesting for newcomers to the field of actuator manufacturing. The control of the robot is achieved by means of a pneumatic control box that can provide arbitrary pressures and can be built by only using purchased components, a laser cutter, and a soldering iron. For the walking performance of the robot, the pressure-angle calibration plays a crucial role. Therefore, a semi-automated method for the pressure-angle calibration is presented. At high inclines (&#62; 70&#176;), the robot can no longer reliably fix itself to the walking plane. Therefore, the gait pattern is modified to ensure that the feet can be fixed on the walking plane.

This protocol provides a detailed list of steps to be performed for the manufacturing, control and evaluation of the climbing performance of a gecko-inspired soft robot.

Valutazione di produzione, controllo e prestazioni di un robot morbido ispirato a Gecko

This protocol presents a method for manufacturing, control, and evaluation of the performance of a soft robot that can climb inclined flat surfaces with ...

3D Printing - Evaluating Particle Emissions of a 3D Printing Pen

Three-dimensional (3D) printing as a type of additive manufacturing shows continuing increase in application and consumer popularity. The fused filament fabrication (FFF) is an inexpensive method used most frequently by consumers. Studies with 3D printers have shown that during the printing process particulate and volatile substances are released. Handheld 3D printing pens also use the FFF method but the consumer&#8217;s proximity to the 3D pens gives reason to higher exposure compared to a 3D printer. At the same time, 3D printing pens are often marketed for children who could be more sensitive to the printing emission. The aim of this study was to implement a low cost method to analyze the emissions of 3D printing pens. Polylactide (PLA) and acrylonitrile butadiene styrene (ABS) filaments of different colors were tested. In addition, filaments containing metal and carbon nanotubes (CNTs) were analyzed. An 18.5 L chamber and sampling close to the emission source was used to characterize emissions and concentrations near the breathing zone of the user.
Particle emissions and particle size distributions were measured and the potential release of metal particles and CNTs investigated. Particle number concentrations were found in a range of 105 - 106 particles/cm3, which is comparable to previous reports from 3D printers. Transmission electron microscopy (TEM) analysis showed nanoparticles of the different thermoplastic materials as well as of metal particles and CNTs. High contents of metal were observed by inductively coupled plasma mass spectrometry (ICP-MS).
These results call for a cautious use of 3D pens due to potential risk to the consumers.

This protocol presents a method to analyze the emission of 3D printing pens. Particle concentration and particle size distribution of the released particle is measured. Released particles are further analyzed with transmission electron microscopy (TEM). Metal content in filaments is quantified by inductively coupled plasma mass spectrometry (ICP-MS).

Stampa 3D - Valutazione delle emissioni di particelle di una penna da stampa 3D

Three-dimensional (3D) printing as a type of additive manufacturing shows continuing increase in application and consumer popularity. The fused filament ...