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Cプロービング

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13:58 min

September 28th, 2016

DOI :

10.3791/54235-v

September 28th, 2016


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115 C 84 Si

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0:05

Title

1:21

Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C84 in Si Substrate

2:57

Measurements of Electronic Properties of C84-embedded Si Substrate

5:07

Measurements of Surface Magnetism

6:17

Measurements of Nanomechanical Properties by AFM

6:49

Measurement of Nanomechanical Properties by Molecular Dynamics Simulation

11:05

Results: Characterization of C84-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation

12:46

Conclusion

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