Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics
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13:58 min
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September 28th, 2016
DOI :
September 28th, 2016
•Rozdziały w tym wideo
0:05
Title
1:21
Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C84 in Si Substrate
2:57
Measurements of Electronic Properties of C84-embedded Si Substrate
5:07
Measurements of Surface Magnetism
6:17
Measurements of Nanomechanical Properties by AFM
6:49
Measurement of Nanomechanical Properties by Molecular Dynamics Simulation
11:05
Results: Characterization of C84-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation
12:46
Conclusion
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