Зондирование C

1:21

Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C₈₄ in Si Substrate

2:57

Measurements of Electronic Properties of C₈₄-embedded Si Substrate

5:07

Measurements of Surface Magnetism

6:17

Measurements of Nanomechanical Properties by AFM

6:49

Measurement of Nanomechanical Properties by Molecular Dynamics Simulation

11:05

Results: Characterization of C₈₄-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation

12:46

Conclusion