Preparation of 3D-printed Substrate, Fabrication of Interconnects and Adjustment of Printer Parameters for the First Layer
2:53
Curing Parameter Adjustments for the First Layer
3:44
Inkjet Printing and Curing of the First Device Layer
4:41
Inspection of the Surface Properties of the Respective Substrates for Printability and Inkjet Printing and Curing of Subsequent Device Layers
6:37
Results: Surface Analyses and Measurement Results from a Capacitive Sensor System Prototype
7:50
Conclusion
副本
We focus on the combination of 3D printed substrates and inkjet printing which is subject to vivid research. We believe that their combination can enable a complete and normal censor system concept in automated production lines in collaborative ro
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Here we present a protocol for the fabrication of inkjet-printed multilayer sensor structures on additively manufactured substrates and foil.