Fabrication of Hexagonal-closed-packaged (HCP) Overlayer of C84 in Si Substrate
2:57
Measurements of Electronic Properties of C84-embedded Si Substrate
5:07
Measurements of Surface Magnetism
6:17
Measurements of Nanomechanical Properties by AFM
6:49
Measurement of Nanomechanical Properties by Molecular Dynamics Simulation
11:05
Results: Characterization of C84-embedded Silicon Substrate by Nanomeasurements and Molecular Dynamic Simulation
12:46
Conclusion
Transcript
The aim of this study is the fabrication of a C84-embedded silicon substrate heterojunction and subsequent analysis to obtain a comprehensive understanding of the electronic, optoelectronic, mechanical, magnetic, and field emission properties of t
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This paper reports the nanomaterial fabrication of a fullerene Si substrate inspected and verified by nanomeasurements and molecular dynamic simulation.