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A High-Throughput Platform for Culture and 3D Imaging of Organoids

2.5K Views

07:42 min

October 14th, 2022

DOI :

10.3791/64405-v

October 14th, 2022


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High throughput Platform

Chapters in this video

0:04

Introduction

0:49

PDMS Mold Dicing and Production of the UV‐Curable, Adhesive, Textured Layer

2:19

Coverslip Substrate Preparation

3:34

Transferring the Textured Film to the Final Substrate

4:33

Cell Seeding, Release, and Collection of the Organoids

6:29

Results: Fabrication of the Microwell Culture Dish for a High‐Density Organoid Culture and Differentiation

7:00

Conclusion

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